epak ELECTRONICS LTD.

MILLFIELD ESTATE, CHARD, SOMERSET. TA20 2BB. TEL : 01460 61791 FAX : 01460 67833

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ABRASIVE MEDIA AND APPLICATIONS LIST

A wide variety of materials can be used for abrasive blasting. Listed are products that Comco Inc. offer as a standard item. Specially graded materials can be ordered for fine tuning of processes. Call for further details !!

ALUMINUM OXIDE

Aluminium Oxide is recommended for the following applications:

Cleaning ceramic substrates	Removal of inked markings	Component failure analysis
Removing bridging between traces	Cleaning magnesium oxide from thermocouples	Etching of heat-sensitive materials
Clean up of laser drilled holes	Texturing graphite surfaces	Silicon wafer beveling

Available in :

CRUSHED GLASS

Available in "K" 80 micron

GLASS BEADS

For cosmetic use on component metal surfaces or board edges

Demarking plated components without damaging component finish

Available in "D" 50 micron (white)

PLASTIC MEDIA

Deburring Delrin ® / Teflon® / nylon devices	Deflashing plastic connectors
Stripping wire insulation	Removing conformal coating

Available in "M" 200 micron

SILICON CARBIDE

Cutting silicon wafers

Drilling holes in ceramic substrates

Deburring stainless steel parts & other hard material

Available in "E" 20 micron (grey) & "F" 50 micron (grey)

SODIUM BICARBONATE

Removing solder mask	Removal of inked markings on plastic materials
Removing conformal coating	Removal of epoxy on electronic test probe ID's
Deburring Delrin ® / Teflon® / nylon devices	Cleaning ceramic surfaces
Stripping wire insulation

Available in "G" 50 micron (white)

WALNUT SHELLS

Removing solder mask	Stripping wire insulation
Removing conformal coating	Removal of inked markings on plastic materials
Deburring Delrin ® / Teflon® / nylon devices

Available in "H" 250 micron (brown)

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