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Solderable Copper Clad Laminate |
Advantages and benefits of AIT
COUPLER™-MIP organic copper-clad laminate for high
performance advanced chip and board level
circuit
- Much lower
dielectric constant (permittivity) and loss than polyimide and
comparable to PTFE.
- Much lower substrate cost than PTFE (as much
as 10 times lower) in and easier to fabricate multi-layer
board with consistency.
- Consistent and lower CTE along XY and Z-axis
for lower stresses and long-term thermal cycling and shock
reliability
- Highest continuous operating temperatures of
>230°C.
- 100 times lower moisture absorption
eliminates all “measling and “pop-corn” effects
common with polyimide-based components and boards.
Multi-layer circuit fabrication using AIT
COUPLER™-MIP organic copper-clad laminate advanced circuit
substrate material
1. Pattern circuits of each layer with
suitable fiducial marks on COUPLER™-MIP organic copper-clad
laminate substrate material from ¼, ½ or 1 oz
copper.
2. Etched circuit traces of different layers
according to design using traditional imaging and chemical
processes.
3. Pre-drill or cut all vias for each layer
whenever appropriate.
4. Laminate the different layers together at
temperature of 260-300°C using the fiducial marks.
5. Finishing drilling of pre-drill vias and
drill any remaining or other blind vias through to the
proper layers if required.
6. Plate blind vias using traditional
process.
7. Finish imaging, etching of outer
layers.
8. Cut, inspect and test finished boards or
interposes.
o High speed chip interposer substrate.
o High performance flexible circuit substrate (Polyimide copper clad replacement).
o High performance multi-layer chip and board substrate material.
o High dimensional stable flexible circuit substrate material.
o Multi-layer lamination at 260ºC or above.
o Directly solderable up to 250ºC.
o Properties are similar to standard Polyimide with dramatically lower moisture absorption.
o Copper cladding is achieved without additional adhesive layer.
o UV solder mask may be applied simultaneously to increase yields.
o 1 oz copper on 2 mils dielectric (COUPLERTM-MIP-36).
o 1/2 oz copper on 2 mils dielectric (COUPLERTM-MIP-18).
o 1/4 oz copper on 2 mils dielectric (COUPLERTM-MIP-09).
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Characteristics
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FR-4
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PTFE
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Polyimide
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COUPLER™-MIP
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Volume Resistivity
(MΩ-cm)
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1X108
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0.1X108
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1000X108
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10X108
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Density (g/cc)
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1.2
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2.2
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1.4
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1.4
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Permittivity @ 1MHz -
1GHz
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4.4
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2.6-4.0
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4.1
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2.9
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Loss Tangent @ 1MHz
– 1GHz
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0.018
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0.001
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0.006
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0.002
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Dielectric
Breakdown (V/Micron)
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100
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240
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276
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220
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Moisture
Absorption (%)
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1.0-1.5
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0.02
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1.0-2.0
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0.02
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Flammability
(UL-94)
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V0
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V0
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V0
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V0
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Tensile
Strength (MPa)
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63
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22
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231
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208
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Thermal
Conductivity (W/m/ºK)
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0.2
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0.3
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0.12
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0.3
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Continuous Service
Temperature (ºC)
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>100
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>200
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>200
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>230
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Degradation
Temperature (ºC)
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290
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>300
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>300
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>350
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Coefficient of Thermal
Expansion
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X-Y Axis below
Tg
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20
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12
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20
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12
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Z-axis below
Tg
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60
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12
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20
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12
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Glass Transition
Temperature (ºC)
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134-178
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Not defined
(Low)
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250
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>220
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Relative
Cost
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1
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4
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4-100
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4
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AIT COUPLER™-MIP organic copper-clad laminate substrate and pre-preg material can panels can be used to build one of the thinnest components and circuit boards with 40-50 micron dielectric over 1/4 oz (9 micron) copper conductor.
| Latest News: |
|
06.07.2011 NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor
Lighter, brighter, cleaner and quieter. |
|
09.03.2011 We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.
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| 21.10.2010
SA150 Video of our Surface Abrader added to our YouTube channel |
| 09.08.2010
BV9000 Videos Added of our Rectifier Beveller to our new YouTube video channel online |
| 03.08.2010
Comco Celebrate 45th Year Anniversary Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years. |
| 21.07.2010
RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.
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| 09.07.2010
NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now. |
| 09.03.2010
Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine. |
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21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet
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| 18.09.09 Epak
BV9000 Wafer Beveller Installed
Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed. Designed to take from 30mm to 150mm (6") wafers. |
| 27.10.08 SPT RTR-D2/D3 series Special Pickup Tips for thin or fragile components |
| 14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. |
| 18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. |
| 19.03.08 : New Website Launched |
|
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