Advanced
Circuit Substrate Materials
Solderable
Copper Clad Laminate
|
Advantages and
benefits of AIT COUPLER™-MIP organic copper-clad
laminate for high performance advanced chip and board
level circuit
- Much lower dielectric
constant (permittivity) and loss than polyimide and
comparable to PTFE.
- Much lower substrate cost than PTFE
(as much as 10 times lower) in and easier to fabricate multi-layer
board with consistency.
- Consistent and lower CTE along XY
and Z-axis for lower stresses and long-term thermal
cycling and shock reliability
- Highest continuous operating
temperatures of >230°C.
- 100 times lower moisture absorption
eliminates all “measling and “pop-corn” effects
common with polyimide-based components and boards.
Multi-layer
circuit fabrication using AIT COUPLER™-MIP organic
copper-clad laminate advanced circuit substrate material
1. Pattern circuits of each layer
with suitable fiducial marks on COUPLER™-MIP organic
copper-clad laminate substrate material from ¼, ½ or 1
oz copper.
2. Etched circuit traces of different
layers according to design using traditional imaging and
chemical processes.
3. Pre-drill or cut all vias for each
layer whenever appropriate.
4. Laminate the different layers
together at temperature of 260-300°C using the fiducial
marks.
5. Finishing drilling of pre-drill
vias and drill any remaining or other blind vias through
to the proper layers if required.
6. Plate blind vias using traditional
process.
7. Finish imaging, etching of outer
layers.
8. Cut, inspect and test finished
boards or interposes.
APPLICATIONS
o
High Frequency and microwave circuit (PTFE
replacement).
o
High speed chip interposer substrate.
o
High performance flexible circuit substrate (Polyimide
copper clad replacement).
o
High performance multi-layer chip and board
substrate material.
FEATURES
o
High dimensional stable flexible circuit
substrate material.
o
Multi-layer lamination at 260ºC or above.
o
Directly solderable up to 250ºC.
o
Properties are similar to standard Polyimide
with dramatically lower moisture absorption.
o
Copper cladding is achieved without additional
adhesive layer.
o
UV solder mask may be applied simultaneously to
increase yields.
AVAILABILITY
o
1 oz copper on 2 mils dielectric (COUPLERTM-MIP-36).
o
1/2 oz copper on 2 mils dielectric (COUPLERTM-MIP-18).
o
1/4 oz copper on 2 mils dielectric (COUPLERTM-MIP-09).
|
Characteristics
|
FR-4
|
PTFE
|
Polyimide
|
COUPLER™-MIP
|
|
Volume Resistivity (MΩ-cm)
|
1X108
|
0.1X108
|
1000X108
|
10X108
|
|
Density (g/cc)
|
1.2
|
2.2
|
1.4
|
1.4
|
|
Permittivity
@ 1MHz - 1GHz
|
4.4
|
2.6-4.0
|
4.1
|
2.9
|
|
Loss
Tangent @ 1MHz – 1GHz
|
0.018
|
0.001
|
0.006
|
0.002
|
|
Dielectric
Breakdown (V/Micron)
|
100
|
240
|
276
|
220
|
|
Moisture
Absorption
(%)
|
1.0-1.5
|
0.02
|
1.0-2.0
|
0.02
|
|
Flammability (UL-94)
|
V0
|
V0
|
V0
|
V0
|
|
Tensile
Strength (MPa)
|
63
|
22
|
231
|
208
|
|
Thermal
Conductivity (W/m/ºK)
|
0.2
|
0.3
|
0.12
|
0.3
|
|
Continuous
Service Temperature (ºC)
|
>100
|
>200
|
>200
|
>230
|
|
Degradation
Temperature (ºC)
|
290
|
>300
|
>300
|
>350
|
|
Coefficient
of Thermal Expansion
|
X-Y
Axis below Tg
|
20
|
12
|
20
|
12
|
|
Z-axis
below Tg
|
60
|
12
|
20
|
12
|
|
Glass
Transition Temperature (ºC)
|
134-178
|
Not defined
(Low)
|
250
|
>220
|
|
Relative Cost
|
1
|
4
|
4-100
|
4
|
AIT COUPLER™-MIP organic copper-clad laminate
substrate and pre-preg material can panels can be used
to build one of the thinnest components and circuit
boards with 40-50 micron dielectric over 1/4 oz (9
micron) copper conductor.
