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Diamond Wheel Dressing Solution Resistors - Thin Film Microwave & RF Solitec Spinners, Coaters and Developer support Storage Cabinets (Dry / Nitrogen & Custom) Tapes (Wafer, Dicing & Protective) Tape / Film Applicator / Mounters UV Curing Control & Test Equipment
Links
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AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area bonding
|
<4x10-4 |
>6.0 |
>1,500 |
-45 |
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area bonding
|
<1x10-4 |
>6.0 |
>1,500 |
-50 |
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
TPX
8150-W
|
-Instant melt-bond >200°C (<10
psi)
-No post curing
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883
5011.4
|
<4x10-4 |
>6.0 |
>1,500
|
-40
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
-Tacky for instant placement
without fixture
-Ambient storable for 6 months
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirements
-Proven reliability
for large area substrates
|
<4x10-4 |
>6.0 |
>1,500
|
-45
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
-Tacky for instant placement
without fixture
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirements
-Proven reliability
for large area substrates
|
<4x10-4 |
>8.0
|
>1,500 |
-20
|
Tacky film
Preforms
3-12 mils
(thick)
|
AIT offers many other Substrate Attach film materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
-Tacky for instant placement
without fixture
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area substrates
|
>1x1014
|
>3.6
|
>1,500
|
-20
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >300°C
short-term exposure
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
-Proven reliability
for large area substrates
|
>1x1014
|
>2.0
|
>1,500 |
-45
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >80°C (<10
psi)
-Curing without fixture and pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
-Proven reliability for large
area substrates
|
>1x1014
|
>3.0
|
>1,500 |
-45
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
TPX
7155-W
|
-Instant melt-bond >200°C (<10
psi)
-No post curing
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
|
>1x1 |
>2.0
|
>1,500
|
-40
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
AIT offers many other Substrate Attach film materials not shown on our web site.
18/01/2012 03:50
| Latest News: |
|
06.07.2011 NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor
Lighter, brighter, cleaner and quieter. |
|
09.03.2011 We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.
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| 21.10.2010
SA150 Video of our Surface Abrader added to our YouTube channel |
| 09.08.2010
BV9000 Videos Added of our Rectifier Beveller to our new YouTube video channel online |
| 03.08.2010
Comco Celebrate 45th Year Anniversary Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years. |
| 21.07.2010
RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.
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| 09.07.2010
NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now. |
| 09.03.2010
Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine. |
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21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet
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| 18.09.09 Epak
BV9000 Wafer Beveller Installed
Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed. Designed to take from 30mm to 150mm (6") wafers. |
| 27.10.08 SPT RTR-D2/D3 series Special Pickup Tips for thin or fragile components |
| 14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. |
| 18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. |
| 19.03.08 : New Website Launched |
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Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication. |
