COMPONENT & SUBSTRATE ATTACH ADHESIVE FILMS
AIT pioneered
the use of flexible substrate-attach film
adhesives since 1985. Its flag-ship products
such as TC8750 and ESP8450-WL have found many successful
applications for over the last 20 years. Continuing
with this innovative heritage, the
following "Substrate and Component Attach
Film" adhesives represents products that are
engineered for both manufacturability and reliability:
· Molecular
flexible for stress-free bonding for large area substrate
and component
· All
specialty film adhesives are available in dry tack-free or
tacky pressure sensitive formats for large and low
volume manufacturing
· Ability
to withstand 250°C exposure such as wire-bonding
· Low
moisture absorption for ultimate reliability
· “Instant
melt-bondable” thermoplastic substrate-attach films
Click
on the Product for the TDS
Electrically
Conductive Film Adhesives
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area bonding
|
<4x10-4
|
>6.0
|
>1,500
|
-45
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area bonding
|
<1x10-4
|
>6.0
|
>1,500
|
-50
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
TPX
8150-W
|
-Instant melt-bond >200°C (<10
psi)
-No post curing
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883
5011.4
|
|
|
>1,500
|
-40
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Tacky for instant placement
without fixture
-Ambient storable for 6 months
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirements
-Proven reliability
for large area substrates
|
|
|
>1,500
|
-45
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
-Tacky for instant placement
without fixture
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirements
-Proven reliability
for large area substrates
|
|
>8.0
|
>1,500 |
-20
|
Tacky film
Preforms
3-12 mils
(thick)
|
AIT offers many other Substrate
Attach film materials not shown on our web
site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
Electrically Non-conductive
Film Adhesives
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
|
-Tacky for instant placement
without fixture
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area substrates
|
>1x1014
|
>3.6
|
>1,500
|
-20
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >300°C
short-term exposure
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
-Proven reliability
for large area substrates
|
>1x1014
|
>2.0
|
>1,500 |
-45
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >80°C (<10
psi)
-Curing without fixture and pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
-Proven reliability for large
area substrates
|
>1x1014
|
>3.0
|
>1,500 |
-45
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
TPX
7155-W
|
-Instant melt-bond >200°C (<10
psi)
-No post curing
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
|
>1x1 |
>2.0
|
>1,500
|
-40
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
AIT offers many other Substrate
Attach film materials not shown on our web
site.
|
