COMPONENT & SUBSTRATE ATTACH PASTE ADHESIVES
AIT has many
proven epoxy paste adhesives for thermal management in component and
substrate attachment. The ME8456 series of flexible conductive adhesives have
been the mainstay of conductive adhesives used for microwave applications in
military electronics with 20 years of proven success.
The
following tables are representative of products that have been engineered
for:
·
Microwave
large and small area substrate attach
·
Inline
curing SMT adhesive with outstanding pot-life and dispensing properties
·
Patented
solder-replacement component attach conductive adhesives
click
on the Product for the TDS
Non-conductive Substrate Attach Paste
|
AIT
Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Die-shear (psi)
|
Tg (oC)
|
Viscosity/
Thixotropic Index
|
|
|
-Stress free
-One or two component
-Large bonding areas
|
>1x1014
|
>1.7
|
>1,800
|
-20
|
300,000
(cps@ 0.5 rpm)
|
|
|
-Substrate attach
-Large bonding areas
-Bonding mismatched CTE's
|
>1x1014
|
>3.67
|
>1,800
|
-25
|
337,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
>1x1014
|
>1.7
|
>1,800
|
-25
|
276,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
>1x1014
|
>3.6
|
>1,800
|
-25
|
245,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Mismatched CTE's
|
>1x1014
|
>1.7
|
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-High power die attach
|
>1x1014
|
>3.6
|
>1,800
|
-25
|
250,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Diamond filled
|
>1x1014
|
>11.4
|
>1,800
|
-25
|
310,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Moisture resistant
|
>1x1014
|
>3.6
|
>1,600
|
-55
|
20,000
(cps@ 5 rpm)
|
|
|
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
|
>1x1014
|
>1.2
|
>3,000
|
60
|
10,000
(cps@ 0.5 rpm)
TI >4.0
|
|
|
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
-Thermally conductive
|
>1x1014
|
>2.2
|
>1,500
|
-40
|
10,000
(cps@ 0.5 rpm)
TI >4.0
|
|
|
-Stress free
-Fast curing
|
>1x1014
|
>3.6
|
>1,200
|
-10
|
200,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-High Green Strength
|
>1x1013
|
>2.9
|
>1,200
|
-60
|
60,000
(cps@ 5 rpm)
|
AIT offers many other Substrate Attach paste materials not shown on
our web site. Please go to Product
Application Form to receive a recommendation from our
office on your specific application.
Electrically Conductive Substrate Attach Paste
|
AIT
Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Die-shear
(psi)
|
Tg (oC)
|
Viscosity
|
|
|
-Stress free
-One or two component
-Large bonding areas
|
<4x10-4 |
>6.0 |
>1,800
|
-20
|
300,000
(cps@ 0.5 rpm)
|
|
|
-Substrate attach
-Large bonding areas
-Bonding mismatched CTE's
|
<4x10-4 |
>6.0 |
>1,800
|
-25
|
337,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
<4x10-4 |
>6.0 |
>1,800
|
-25
|
276,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
<4x10-4 |
>7.9 |
>1,000
|
-20
|
60,00
(cps@ 2.5 rpm)
|
|
|
-Stress free
-Mismatched CTE's
|
<4x10-4 |
>7.9 |
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm)
|
|
|
-Solder replacement
-Rapid curing
-Molecularly flexible
-More than 7 days pot-life
-Dispensible & screen printable
|
<4x10-4 |
>6.0 |
>1,500
|
-20
|
15,000
(cps@ 0.5 rpm)
TI >4
|
|
|
-Stress free
-High power die attach
|
<4x10-4 |
>6.0 |
>1,800
|
-25
|
250,000
(cps@ 0.5 rpm)
|
AIT offers many other Substrate Attach paste materials not shown on
our web site.
|
