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COMPRESSIBLE PHASE CHANGE MATERIALS

Phase-Change Thermal Interface Pad and Compressible Phase-Change Thermal Interface Materials

AIT pioneered the use of phase-change materials for use as thermal interface adhesive materials for thermal management in the early 1990’s. These phase change materials used as specialty adhesives found acceptance in both military and commercial electronics over the last 15 years. AIT has patented the use of “compressible phase-change” thermal interface materials and “in-situ curing” thermal interface adhesive materials with one of the lowest thermal interface resistance. This new class of compressible phase change gap-filling materials enable the filling of large gaps between heat-spreader and the heat generating components that may have substantial differential heights. The following tables represent some of these innovative gap-filling phase change interface materials and their solutions and advantages:

-Compressible phase-change interface materials that compensates for large area and extreme height tolerances and gaps.

-In-situ curing thermal interface adhesive materials that provides up to 300 psi as applied and cure to over 600-1200 psi over time at operating temperatures of the device.

-Available as electrically conductive or electrically insulating thermal adhesives, thermal greases, thermal gels and thermal pads.

-Available as dry, single-sided or double-sided pressure sensitive tacky thermal interface pads and thermal adhesives film tapes.

-Available in preforms of thermal phase change material pads and thermal adhesive films and tapes.

-Phase-change thermal interface pad materials that flow at 55°C, 90°C, 130°C, and 180°C respectively.

-Phase-change materials of all thickness with outstanding thermal conductivity and low thermal interface resistance to help cool and manage power devices as adhesives, greases, gels and gap filling compressible thermal pads.

Electrically Insulating Compressible Phase-Change Thermal Interface Materials

& In-situ Curing Thermal Interfaces Adhesives

(Click on the Product for the TDS)

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Dielectric Strength (volt/mil)	Die-shear (psi)	Tg (^oC)
COOL-BOND^® CB7208-EDA	-In-situ curing >60°C -100 psi die-shear as applied	>1x10¹⁴	>3.6	750	>600	-25
COOL-BOND^® CB7205-E	-In-situ curing >60°C -50 psi die-shear as applied	>1x10¹⁴	>1.9	750	>300	-25
COOL-PAD^TM CPR7158	-Non-curing -compressible phase-change pad	>1x10¹⁴	>3.0	550	NA	-45
COOL-PAD^TM CPR7155	-Non-curing -compressible phase-change pad	>1x10¹⁴	>2.0	550	>600	-45
COOL-PAD^TM CP7178	-Non-curing -Non-flowing -Thermal gasket pad -May be used with polyimide	>1x10¹⁴	>3.0	550	NA	-45

AIT offers many other phase change materials and non-phase change materials for use as thermally conductive materials that may not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.

Electrically Conductive Compressible Phase-Change Thermal Interface Materials

& In-situ Curing Thermal Interface Adhesives

(Click on the Product for the TDS)

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Die-shear (psi)	Tg (^oC)
COOL-BOND^® CB8205-EJD	-In-situ curing >60°C -300 psi die-shear bond strength as applied	<5x10^-3	>5.7	>600	-25
COOL-PAD^TM CP8550	-Phase change -dry pad	<4x10^-4	>9.0	>100	-55
COOL-PAD^TM CP8550-HF	-Phase change -dry pad -High flow	<4x10^-4	>9.0	>100	-55
COOL-PAD^TM CP8550-HFT	-Electrical & thermal -ground plane interface	<4x10^-4	>9.0	>100	-60
COOL-PAD^TM CPR8850	-Non-curing -compressible phase-change pad	<5x10^-4	>9.4	N/A	-60
COOL-PAD^TM CPR8850-XT	-Non-curing -compressible phase-change pad	<5x10^-4	>9.4	N/A	-60
COOL-PAD^TM CPR8853	-Non-curing -compressible phase-change pad	<5x10^-3	>9.4	N/A	-60

AIT offers many other phase change materials that are electrically and /or thermally conductive interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.

03/09/2010 09:06