Adhesives & Epoxies

Air Dryers

Bonding Capillaries

Bonding Wedges

Chip Capacitors

CO2 Cleaning

Custom Automation

Die Bonders

Die & Pin Eject Systems

Die Pickup Tools

Dispensing Systems

Dry Storage Cabinets

Diamond Wheel Dressing Solution

Dicing & Wafer Tapes

Dust Collectors

Electronic Packages

Epoxy Stamping & Dispensing

Hot Gas/Rework

Ink Coating & Handling

Machine Guarding

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Pick & Place Systems

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Surface Abrader

Tape / Film Applicators

UV Curing Control & Test Equipment

UV Curing Equipment

Printing Supplies &  Equipment

Wafer Backlap Applicator

--------------

Home Page

--------------

Applications

Contact Us 

Data Sheets

Links

Map & Directions

News

Products By Manufacturer

Site Map

Spares & Servicing

 

 

 

 

COMPRESSIBLE PHASE CHANGE MATERIALS

Phase-Change Thermal Interface Pad and Compressible Phase-Change Thermal Interface Materials

 

AIT pioneered the use of phase-change materials for use as thermal interface adhesive materials for thermal management in the early 1990’s. These phase change materials used as specialty adhesives found acceptance in both military and commercial electronics over the last 15 years. AIT has patented the use of “compressible phase-change” thermal interface materials and “in-situ curing” thermal interface adhesive materials with one of the lowest thermal interface resistance. This new class of compressible phase change gap-filling materials enable the filling of large gaps between heat-spreader and the heat generating components that may have substantial differential heights. The following tables represent some of these innovative gap-filling phase change interface materials and their solutions and advantages:

 

-Compressible phase-change interface materials that compensates for large area and extreme height tolerances and gaps.

-In-situ curing thermal interface adhesive materials that provides up to 300 psi as applied and cure to over 600-1200 psi over time at operating temperatures of the device.

-Available as electrically conductive or electrically insulating thermal adhesives, thermal greases, thermal gels and thermal pads.

 

-Available as dry, single-sided or double-sided pressure sensitive tacky thermal interface pads and thermal adhesives film tapes.

 

-Available in preforms of thermal phase change material pads and thermal adhesive films and tapes.

 

-Phase-change thermal interface pad materials that flow at 55°C, 90°C, 130°C, and 180°C respectively.

 

-Phase-change materials of all thickness with outstanding thermal conductivity and low thermal interface resistance to help cool and manage power devices as adhesives, greases, gels and gap filling compressible thermal pads. 

          

     

 

Electrically Insulating Compressible Phase-Change Thermal Interface Materials

& In-situ Curing Thermal Interfaces Adhesives

(Click on the Product for the TDS)

 

AIT Product
Characteristics
Electrical Resistivity  (ohm-cm)
Thermal Conductivity(watt/m-oC)
Dielectric
Strength
(volt/mil)
Die-shear (psi)
Tg (oC)
-In-situ curing >60°C
-100 psi die-shear as applied

>1x1014

>3.6

750 

>600

-25

-In-situ curing >60°C
-50 psi die-shear as applied

>1x1014

>1.9

750

>300

-25

-Non-curing
-compressible phase-change pad

>1x1014

>3.0

550 

NA

-45

-Non-curing
-compressible phase-change pad

>1x1014

>2.0

550

>600

-45

-Non-curing
-Non-flowing
-Thermal gasket pad
-May be used with polyimide

>1x1014

>3.0

550 

NA

-45

AIT offers many other phase change materials and non-phase change materials for use as thermally conductive materials that may not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.  

 

Electrically Conductive Compressible Phase-Change Thermal Interface Materials 

& In-situ Curing Thermal Interface Adhesives

(Click on the Product for the TDS)
 

 

AIT Product
Characteristics
Electrical Resistivity  (ohm-cm)
Thermal Conductivity(watt/m-oC)
Die-shear (psi)
Tg (oC)
-In-situ curing >60°C
-300 psi die-shear bond strength as applied

<5x10-3

>5.7

>600

-25

-Phase change
-dry pad

<4x10-4

>9.0

>100

-55

-Phase change
-dry pad
-High flow

<4x10-4

>9.0

>100

-55

-Electrical & thermal
-ground plane interface

<4x10-4

>9.0

>100

-60

-Non-curing
-compressible phase-change pad

<5x10-4

>9.4

N/A

-60

-Non-curing
-compressible phase-change pad

<5x10-4

>9.4

N/A

-60

-Non-curing
-compressible phase-change pad

<5x10-3

>9.4

N/A

-60

AIT offers many other phase change materials that are electrically and /or thermally conductive interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.  

 

 

13/08/2008 09:24

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

Latest  News:

 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication.