COMPRESSIBLE PHASE CHANGE MATERIALS
Phase-Change
Thermal Interface Pad and Compressible Phase-Change
Thermal Interface Materials
AIT
pioneered the use of phase-change materials for use as
thermal interface adhesive materials for thermal
management in the early 1990’s. These phase change
materials used as specialty adhesives found acceptance in
both military and commercial electronics over the last 15
years. AIT has patented
the use of “compressible phase-change” thermal
interface materials and “in-situ curing” thermal
interface adhesive materials with one of the lowest
thermal interface resistance. This new class of
compressible phase change gap-filling materials enable the
filling of large gaps between heat-spreader and the heat
generating components that may have substantial
differential heights. The following tables represent some
of these innovative gap-filling phase change interface
materials and their solutions and advantages:
-Compressible phase-change interface
materials that compensates for large area and extreme
height tolerances and gaps.
-In-situ curing thermal interface
adhesive materials that provides up to 300 psi as
applied and cure to over 600-1200 psi over time at
operating temperatures of the device.
-Available
as electrically conductive or electrically insulating
thermal adhesives, thermal greases, thermal gels and
thermal pads.
-Available
as dry, single-sided or double-sided pressure sensitive
tacky thermal interface pads and thermal adhesives film
tapes.
-Available
in preforms of thermal phase change material pads and
thermal adhesive films and tapes.
-Phase-change
thermal interface pad materials that flow at 55°C, 90°C,
130°C, and 180°C respectively.
-Phase-change
materials of all thickness with outstanding thermal conductivity
and low thermal interface resistance to help cool and
manage power devices as adhesives, greases, gels and gap
filling compressible thermal pads.
 
Electrically
Insulating Compressible Phase-Change Thermal Interface
Materials
&
In-situ Curing Thermal Interfaces Adhesives
(Click
on the Product for the TDS)
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity (ohm-cm)
|
Thermal
Conductivity(watt/m-oC)
|
Dielectric
Strength
(volt/mil)
|
Die-shear
(psi)
|
Tg
(oC)
|
|
|
-In-situ curing >60°C
-100 psi die-shear as
applied
|
>1x1014
|
>3.6
|
750
|
>600
|
-25
|
|
|
-In-situ curing >60°C
-50 psi die-shear as applied
|
>1x1014
|
>1.9
|
750 |
>300
|
-25
|
|
|
-Non-curing
-compressible phase-change pad
|
>1x1014
|
>3.0
|
550
|
NA
|
-45
|
|
|
-Non-curing
-compressible phase-change pad
|
>1x1014
|
>2.0
|
550 |
>600
|
-45
|
|
|
-Non-curing
-Non-flowing
-Thermal gasket pad
-May be used with polyimide
|
>1x1014
|
>3.0
|
550
|
NA
|
-45
|
AIT offers many other phase change materials and
non-phase change materials for use as thermally conductive materials
that may not shown on our web site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
Electrically
Conductive Compressible Phase-Change Thermal Interface
Materials
&
In-situ Curing Thermal Interface Adhesives
(Click
on the Product for the TDS)
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity (ohm-cm)
|
Thermal
Conductivity(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
|
|
-In-situ curing >60°C
-300 psi die-shear bond
strength as applied
|
<5x10-3
|
>5.7
|
>600
|
-25
|
|
|
-Phase change
-dry pad
|
<4x10-4
|
>9.0
|
>100
|
-55
|
|
|
-Phase change
-dry pad
-High flow
|
<4x10-4
|
>9.0
|
>100
|
-55
|
|
|
-Electrical & thermal
-ground plane interface
|
<4x10-4
|
>9.0
|
>100
|
-60
|
|
|
-Non-curing
-compressible phase-change pad
|
<5x10-4
|
>9.4
|
N/A
|
-60
|
|
|
-Non-curing
-compressible phase-change pad
|
<5x10-4
|
>9.4
|
N/A
|
-60
|
|
|
-Non-curing
-compressible phase-change pad
|
<5x10-3
|
>9.4
|
N/A
|
-60
|
AIT offers many other phase change materials that are
electrically and /or thermally conductive interface
materials not shown on our web site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
|
