DIE ATTACH FILM ADHESIVES
AIT pioneered
the use of flexible die-attach film for large area die-attachment and has
since achieved 20 years of proven reliability. Continuing with this
innovative heritage, the following "Die-Attach Film"
adhesives represents products that are engineered for manufacturability
and reliability:
·
Die-attach
film that can be pre-applied onto wafer by lamination or screening
·
Applicable
for dicing with UV-release tape
·
Instant
melt-tack with nominal pressure and finishing inline curing without fixture
or pressure
·
Ability
to withstand 250°C wire-bonding
·
Low
moisture absorption to achieve soldering of components without pre-baking
·
Industry
first “instant melt-bondable” thermoplastic die-attach films
Click
on the Product for the TDS
Non-conductive
Film Adhesives
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
ESP7450-W
|
-Wafer pre-application
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for large area dies
|
>1x1014
|
>1.2 |
>1,500
|
-45
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
ESP7455-W
|
-Wafer pre-application
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for large area dies
|
>1x1014
|
>2.0
|
>1,500 |
-45
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
ESP7670-W
|
-Wafer pre-application
-Instant melt-tack >80°C (<10
psi)
-Curing without fixture and pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for multi-layer stack
|
>1x1014
|
>1.2
|
>3,000
|
80
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
ESP7675-W
|
-Wafer pre-application
-Instant melt-tack >80°C (<10
psi)
-Curing without fixture and pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for multi-layer stack
|
>1x1014
|
>2.0
|
>3,000
|
80
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
|
-Instant melt-tack >80°C (<10
psi)
-Curing without fixture and pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for large area dies
|
>1x1014
|
>3.0
|
>1,500 |
-45
|
Tacky film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
TPX 7150-W
|
-Wafer pre-application
-Instant melt-bond >200°C (<10
psi)
-No post curing
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
|
>1x1014
|
>1.2
|
>1,500
|
-40
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
TPX 7260-W
|
-Wafer pre-application
-Instant melt-bond >260°C (<10
psi)
-No post curing
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
|
|
>1.2
|
>2,000
|
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
AIT offers many other Die Attach paste adhesives not shown on our
web site. Please go to Products
Application Form to receive a recommendation from our office on
your specific application.
Electrically Conductive Film Adhesives
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
|
-Wafer pre-application
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for large area dies
|
<4x10-4
|
>6.0
|
>1,500
|
-45
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
|
-Wafer pre-application
-Instant melt-tack >80°C (<10
psi)
-Curing without fixture and pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for multi-layer stack
|
<4x10-4
|
>6.0
|
>3,000
|
80
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
|
-Instant melt-tack >80°C (<10
psi)
-Curing with fixture or pressure
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
-Proven reliability for multi-layer stack
|
<4x10-4
|
>6.0
|
>2,000
|
-20
|
Tacky film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
TPX 8150-W
|
-Wafer pre-application
-Instant melt-bond >200°C (<10
psi)
-No post curing
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
|
|
|
>1,500
|
-40
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
|
|
-Wafer pre-application
-Instant melt-bond >260°C (<10
psi)
-No post curing
-Withstand >250°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883F 5011.4
|
|
|
|
|
Tack free dry film
Preforms
1.5 mils (thick)
3.0 mils (thick)
|
AIT offers many other Die Attach paste adhesives not shown on our
web site. Please go to Products
Application Form to receive a recommendation from our
office on your specific application.
Die-attach-film (DAF) is engineered for
"tack-and-cure" process. This allows for tacking the
die onto the substrate with low temperature (80-160°C) and low pressure (4-8
psi) for short time (1-2 seconds). It then is followed by a curing
process without pressure at a temperature that fits the manufacturing
process.
AIT die-attach film adhesives are engineered to have a
balance of high temperature bond strength to allow wire-bonding operations up
to 275°C and low stress for larger dies.
DAF has a long history of success in performance under
extreme temperature and humidity. The following graph is a reflection of the
low moisture absorption and potential for packaging components for lead-free
soldering without pre-baking.
DAF has more than 10 years of proven success in stacking multiple
chips for high reliability applications. Part of the attributes for its
success is the ability to withstand high temperature without degradation. The
following graph illustrates the unparalleled molecular stability among DAF.
|
