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DIE ATTACH FILM ADHESIVES

AIT pioneered the use of flexible die-attach film for large area die-attachment and has since achieved 20 years of proven reliability. Continuing with this innovative heritage, the following "Die-Attach Film" adhesives represents products that are engineered for manufacturability and reliability:

· Die-attach film that can be pre-applied onto wafer by lamination or screening

· Applicable for dicing with UV-release tape

· Instant melt-tack with nominal pressure and finishing inline curing without fixture or pressure

· Ability to withstand 250°C wire-bonding

· Low moisture absorption to achieve soldering of components without pre-baking

· Industry first “instant melt-bondable” thermoplastic die-attach films

Click on the Product for the TDS

Non-conductive Film Adhesives

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Die-shear (psi)	Tg (^oC)	Film Type
ESP7450-W	-Wafer pre-application -Instant melt-tack >120°C (<10 psi) -Curing without fixture and pressure -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for large area dies	>1x10¹⁴	>1.2	>1,500	-45	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP7455-W	-Wafer pre-application -Instant melt-tack >120°C (<10 psi) -Curing without fixture and pressure -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for large area dies	>1x10¹⁴	>2.0	>1,500	-45	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP7670-W	-Wafer pre-application -Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for multi-layer stack	>1x10¹⁴	>1.2	>3,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP7675-W	-Wafer pre-application -Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for multi-layer stack	>1x10¹⁴	>2.0	>3,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
RTK7556	-Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for large area dies	>1x10¹⁴	>3.0	>1,500	-45	Tacky film Preforms 1.5 mils (thick) 3.0 mils (thick)
TPX 7150-W	-Wafer pre-application -Instant melt-bond >200°C (<10 psi) -No post curing -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4	>1x10¹⁴	>1.2	>1,500	-40	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
TPX 7260-W	-Wafer pre-application -Instant melt-bond >260°C (<10 psi) -No post curing -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4	^>1x10¹⁴	>1.2	>2,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

Electrically Conductive Film Adhesives

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Die-shear (psi)	Tg (^oC)	Film Type
ESP8450-W	-Wafer pre-application -Instant melt-tack >120°C (<10 psi) -Curing without fixture and pressure -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for large area dies	<4x10-⁴	>6.0	>1,500	-45	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP8680-W	-Wafer pre-application -Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for multi-layer stack	^<4x10-⁴	>6.0	>3,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
RTC8750	-Instant melt-tack >80°C (<10 psi) -Curing with fixture or pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for multi-layer stack	<4x10-⁴	>6.0	>2,000	-20	Tacky film Preforms 1.5 mils (thick) 3.0 mils (thick)
TPX 8150-W	-Wafer pre-application -Instant melt-bond >200°C (<10 psi) -No post curing -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4	<4x10-⁴	>6.0	>1,500	-40	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
TPX 8260-W	-Wafer pre-application -Instant melt-bond >260°C (<10 psi) -No post curing -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4	<4x10-⁴	>6.0	>2,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

Die-attach-film (DAF) is engineered for "tack-and-cure" process. This allows for tacking the die onto the substrate with low temperature (80-160°C) and low pressure (4-8 psi) for short time (1-2 seconds). It then is followed by a curing process without pressure at a temperature that fits the manufacturing process.

AIT die-attach film adhesives are engineered to have a balance of high temperature bond strength to allow wire-bonding operations up to 275°C and low stress for larger dies.

DAF has a long history of success in performance under extreme temperature and humidity. The following graph is a reflection of the low moisture absorption and potential for packaging components for lead-free soldering without pre-baking.

DAF has more than 10 years of proven success in stacking multiple chips for high reliability applications. Part of the attributes for its success is the ability to withstand high temperature without degradation. The following graph illustrates the unparalleled molecular stability among DAF.

18/01/2012 03:50