Bonding Capillaries, Wedges, Pick Up Tools and Dispensing Nozzles Epoxies, Adhesives, Thermoplastic Films and Thermal Gel and Greases Micro-Abrasive blasting equipment, media and systems UV Curing equipment, spares and accessories Wafer, dicing and protective tapes including UV and pressure release tapes Thin Film & Thick Film Chip Resistors, Arrays, Networks, Attenuators, MOS Chip Capacitors and Jumpers Precision Die Bonders, pick and place systems, die eject systems and wafer film mounters

Abrasives

Adhesives & Epoxies

Air Dryers

Blast Cabinets (Abrasive)

Bonding Capillaries

Bonding Wedges

Chip Capacitors

CO2 Cleaning

Custom Product Solutions

CPU Cooling (Cool-Silver)

Die Bonders

Die & Pin Eject Systems

Dicing & Wafer Tapes

Die Pickup Tools

Dispensing Systems

Diamond Wheel Dressing Solution

Dust Extraction 

Electronic Packages & Lids

Epoxy Stamping & Dispensing

Hot Gas/Rework Station

Ink Coating & Handling

Machine Guards (Custom Made)

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Micro Blaster Accessories

Micro Blasting Services

Pick & Place Systems

Printing Supplies &  Equipment

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solderability Testers

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Storage Cabinets (Dry / Nitrogen & Custom)

Surface Abrader

Tapes (Wafer, Dicing & Protective)

Tape / Film Applicator / Mounters

UV Curing Control & Test Equipment

UV Curing Equipment

Wafer Backlap Applicator

Wire Bonding Wedges

 

 

Home Page

Applications

Contact Us 

Data Sheets

Links

Map & Directions

News

Products By Manufacturer

Site Map

Spares & Servicing

 

ESD Protection Coatings & Materials

AIT manufactures some of the most unique semi-conductive adhesives, coatings and rubber sheets for electrostatic dissipative applications. The following tables list some representative products. 

ESD Protective Coatings and Materials

 

Semi-Conductive & Static-Dissipative Coatings

 
AIT
Product
Characteristics
Electrical
Resistivity
Peel Strength
(ppi) 
Pot-life
(hrs)
Curing
Schedule
(50%RH
@25° C)
EDC 9100
(Flexible polymer coating)
-Carbon fiber particulate filled
-1 part ambient drying
-Flexible for large area coating
-Hydrophobic and water resistant
-Heat resistant to 105°C
-Good adhesion on metals, ceramics,  
  woods and plastics
105-109 ohm per sq.
 
>3 ppi
N/A
5 min.
EDC 9150
(Flexible polymer coating)
-Carbon fiber particulate filled
-1 part ambient drying
-Flexible for large area coating
-Hydrophobic and water resistant
-Heat resistant >150°C
-Good adhesion on metals, ceramics,  
  woods and plastics
105-109 ohm per sq.
>3 ppi
N/A
30 min.
EDC 9260
(Hard polymer coating)
-Carbon fiber particulate filled
-1 part ambient drying
-Hard scratch resistant protective coating
-Hydrophobic and water resistant
-In-situ crosslinked for stronger coat
 when used at higher temperature >90°C
-May be used for >150°C
-Good adhesion on metals, ceramics,  
  woods and plastics
105-109 ohm per sq.
>12 ppi
12 mos.
30 min.
+
In-situ curing under high termp use

 

Semi-Conductive & Electrostatic Dissipative Adhesives 

AIT
Product
Characteristics
Electrical
Resistivity
Bond Strength
(psi) 
Peel Strength
(ppi) 
Pot-life
(hrs)
Curing
Schedule
(50%RH
@25° C)
EG9095
(Flexible Epoxy)
-Carbon particulate filled
-2 part ambient curable epoxy
-Flexible for large area bonding
-More than 20 years of proven successes
-May be diluted with MEK or suitable solvents for coating applications
< 5x102 ohm-cm
>1200
psi
 
>6 ppi
>300
48 hr.
EG9090
(Hard Epoxy)
-Carbon particulate filled
-2 part ambient curable epoxy
-High strength 
-More than 20 years of proven successes
-May be diluted with MEK or suitable 
 solvents for coating applications
< 5x102 ohm-cm
>1600
psi
 
>9 ppi
>300
24 hr.

  

Semi-Conductive & Conductive Rubber Sheets

 

AIT
Product
Characteristics
Electrical
Resistivity
Width-Length
(ft-ft)
Thickness
(mil/mm)
EDS 9550
(Conformable Elastomer)
-Carbon fiber particulate filled
-For workbench lining
-Flexible for large area coating
-Fully cured elastomer
-Heat resistant >150°C
 
-Extremely conformable.
105-109 ohm per sq.
>3.0 ppi
20/ 0.50
 
40/ 1.0
EDS 9555
(Pressure-sensitive)
-Carbon fiber particulate filled
-For workbench lining
 
-Fully cured elastomer with pressure-sensitive layer
-Heat resistant >150°C
 
-Extremely conformable and may be die-cut
105-109 ohm per sq.

NA

 

5/ 0.12
 
10/ 0.25

 

 

18/01/2012 03:50

EPAK
Latest  News:
 

06.07.2011

NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor

Lighter, brighter, cleaner and quieter.

09.03.2011

Custom Flex Circuit Abrader

We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.

21.10.2010

SA150 Video of our Surface Abrader added to our YouTube channel

09.08.2010

BV9000 Videos Added  of our Rectifier Beveller to our new YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication.