Applications

Spares/Service

Adhesives & Epoxies

Blast Cabinets (Abrasive)

Bonding Capillaries

Chip Capacitors

Custom Product Solutions

CPU Cooling (Cool-Silver)

Die & Pin Eject Systems

Dicing & Wafer Tapes

Die Pickup Tools

Dispensing Systems

Diamond Wheel Dressing Solution

Dust Extraction

Electronic Packages & Lids

Epoxy Stamping & Dispensing

Hot Gas/Rework Station

Ink Coating & Handling

Machine Guards (Custom Made)

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Micro Blaster Accessories

Micro Blasting Services

Pick & Place Systems

Printing Supplies & Equipment

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solderability Testers

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Storage Cabinets (Dry / Nitrogen & Custom)

Surface Abrader

Tapes (Wafer, Dicing & Protective)

Tape / Film Applicator / Mounters

UV Curing Control & Test Equipment

UV Curing Equipment

Wafer Backlap Applicator

Wire Bonding Wedges

Links

Map & Directions

Products By Manufacturer

Spares & Servicing

Melt-Bonding Lid-Shield

Pre-Applied Melt-Bonding & Pressure-Sensitive EMI/RFI Shielding Lid-Shield For UHF and Microwave Components and Boards

With the use of LEAD-FREE soldering, having to reach 250-300°C for the attachment and rework of shielding lids on components could potential damages sensitive components on the boards. AIT has designed a series of EMI/RFI shielding solutions incorporating direct attach EMI shielding, cans, covers, lids and caps. The following are some of the potential benefits of these patented products and applications:

· Allow inspection of finished products before attaching EMI/RFI cans and covers.

· Attachment either by mechanical insertion or instant melt-flow at 150°C.

· Flexibility of fully automated assembly or manual assembly.

· Optional complete shield without ventilation holes with compressible phase change thermal enhancement.

· Cost effective.

EMI Metal Caps and Lids

AIT Product	Process & Characteristics	Minimum Lid Width (mils)	Bond Strength (psi)	Electrical Resistivity (ohm-cm)
CB 8250-E (Self-tacking, Insitu-curable)	Þ Suitable for flat mating area of 250 micron or wider Þ Low cost pre-applied on your parts or your design Þ Insitu curing after bonding for bond strength at high temp. Þ Ambient storable for 12 months min.	3	>600	5x10^-4
CB 8130 (Instant Melt-Bonding @130°C)	Þ Suitable for contour and flat area of 250 micron or wider Þ Low cost pre-applied on your parts or your design Þ Low melt-bonding and rework temperature @ 130°C Þ Ambient storable for 12 months min.	3	>600	5x10^-4
CB 8133 (Instant Melt-Bonding @130°C)	Þ Suitable for contour and flat area of 250 micron or wider Þ Low cost pre-applied on your parts or your design Þ Maintain bonding up to @ 130°C Þ Ambient storable for 12 months min.	3	>600	5x10^-3
EMI Covers, Lids & Caps	Þ Your design with or without ventilation holes. Þ Your parts or AIT provides parts with adhesives. Þ All AIT provided parts are made with copper lamiante. Þ All AIT EMI/RFI covers are internally electrically insulated. Þ Optional thermal interface from components to cover. Þ Ambient storable for 12 months min. Þ Choose mechanical insertion or melt-attach @ 150°C.	3	>600	Copper

03/09/2010 09:06

09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

09.03.2010

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers.

27.10.08 SPT RTR-D2/D3 series Special Pickup Tips for thin or fragile components

14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles.

18.04.08 NEW from AI Technology : COOL-SILVER^{TM CPU
Thermal Grease gives 2-3
degree centigrade lower temperatures over the industry
"standards" even for a medium performing CPS for longer life
of the processors and electronic devices.}

19.03.08 : New Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication.