Melt-Bonding
Lid-Shield
Pre-Applied
Melt-Bonding & Pressure-Sensitive EMI/RFI Shielding Lid-Shield For UHF
and Microwave Components and Boards
With the use of LEAD-FREE soldering, having
to reach 250-300°C
for the attachment and rework of shielding lids on components
could potential damages sensitive components on the boards. AIT has designed
a series of EMI/RFI shielding solutions incorporating direct attach EMI shielding,
cans, covers, lids and caps. The following are some of the potential
benefits of these patented products and applications:
·
Allow
inspection of finished products before attaching EMI/RFI cans and covers.
·
Attachment
either by mechanical insertion or instant melt-flow at 150°C.
·
Flexibility
of fully automated assembly or manual assembly.
·
Optional
complete shield without ventilation holes with compressible phase change
thermal enhancement.
·
Cost
effective.
EMI Metal Caps and Lids
|
AIT
Product
|
Process & Characteristics
|
|
Bond Strength
(psi)
|
Electrical Resistivity
(ohm-cm)
|
|
(Self-tacking,
Insitu-curable)
|
Þ
Suitable for flat mating area of 250 micron or wider
Þ
Low cost pre-applied on your parts or your design
Þ
Insitu curing after bonding for bond strength at high temp.
Þ
Ambient storable for 12 months min.
|
3
|
>600
|
5x10-4
|
|
(Instant
Melt-Bonding
@130°C)
|
Þ
Suitable for contour and flat area of 250 micron or
wider
Þ
Low cost pre-applied on your parts or your design
Þ
Low melt-bonding and rework temperature @ 130°C
Þ
Ambient storable for 12 months min.
|
3
|
>600 |
5x10-4
|
|
(Instant
Melt-Bonding
@130°C)
|
Þ
Suitable for contour and flat area of 250 micron or
wider
Þ
Low cost pre-applied on your parts or your design
Þ
Maintain bonding up to @ 130°C
Þ
Ambient storable for 12 months min.
|
3
|
>600 |
5x10-3
|
|
EMI Covers,
Lids & Caps
|
Þ
Your design with or without ventilation holes.
Þ
Your parts or AIT provides parts with adhesives.
Þ
All AIT provided parts are made with
copper lamiante.
Þ
All AIT EMI/RFI covers are internally
electrically insulated.
Þ
Optional thermal interface from components to cover.
Þ
Ambient storable for 12 months min.
Þ
Choose mechanical insertion or melt-attach @ 150°C.
|
3
|
>600 |
Copper
|
|
