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Diamond Wheel Dressing Solution Resistors - Thin Film Microwave & RF Solitec Spinners, Coaters and Developer support Storage Cabinets (Dry / Nitrogen & Custom) Tapes (Wafer, Dicing & Protective) Tape / Film Applicator / Mounters UV Curing Control & Test Equipment
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FLIP-CHIP ADHESIVE BUMPS
Flip-Chip Die-Attach and Interconnections with Flexible Conductive Adhesives:
◊ Patented
and proven reliability of flip-chip interconnections with flexible
conductive adhesive.
◊ Simple
flip-chip attach process with conductive adhesive on substrate-interposer:
o
Stencil LRTC 8550 onto precious metal bond pads on
substrate-interposer.
o
B-stage the adhesive at ambient to 60°C.
o
Place flip-chip with precious metal bond-pad or bumps onto the
respective substrate-interposer.
o
Cure the device interconnection at temperature 80-200°C without
applied pressure.
o
Optional underfill with flexible protection encapsulation (ME 7150
water-like viscosity for defect free underfilling).
◊ Alternative
flip-chip attach process with conductive adhesive on wafer-chip:
o
Stencil ESS8450 (or PSS 8150) onto precious metal bond pads on
wafer-chip.
o
B-stage the adhesive at ambient to 60°C.
o
Place flip-chip with conductive adhesive onto the respective
substrate-interposer with precious metal bond-pad or bumps that is heated to
above 200°C.
o
Cure the device interconnection at temperature 200°C without
pressure.
o
Optional underfill with flexible protection encapsulation (me 7150
water-like viscosity for defect free underfilling).
◊ Adhesive absorbed less than 0.15% even at saturated moisture at 100°C. Devices have passed most stringent military specification for components. ◊ One of the most stable adhesive for high temperature exposures with TGA degradation well above 390°C
FLIP-CHIP FLEXIBLE CONDUCTOR ADHESIVE BUMPS
Solder Joint Replacement: Patent Pending
FLEXIBLE UNDERFILL FOR INSULATION & PROTECTION
03/09/2010 09:06 |
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