FLIP-CHIP
ADHESIVE BUMPS
Flip-Chip
Die-Attach and Interconnections with Flexible Conductive Adhesives:
◊ Patented
and proven reliability of flip-chip interconnections with flexible
conductive adhesive.
◊ Simple
flip-chip attach process with conductive adhesive on substrate-interposer:
o
Stencil LRTC 8550 onto precious metal bond pads on
substrate-interposer.
o
B-stage the adhesive at ambient to 60°C.
o
Place flip-chip with precious metal bond-pad or bumps onto the
respective substrate-interposer.
o
Cure the device interconnection at temperature 80-200°C without
applied pressure.
o
Optional underfill with flexible protection encapsulation (ME 7150
water-like viscosity for defect free underfilling).
◊ Alternative
flip-chip attach process with conductive adhesive on wafer-chip:
o
Stencil ESS8450 (or PSS 8150) onto precious metal bond pads on
wafer-chip.
o
B-stage the adhesive at ambient to 60°C.
o
Place flip-chip with conductive adhesive onto the respective
substrate-interposer with precious metal bond-pad or bumps that is heated to
above 200°C.
o
Cure the device interconnection at temperature 200°C without
pressure.
o
Optional underfill with flexible protection encapsulation (me 7150
water-like viscosity for defect free underfilling).
◊ Adhesive
absorbed less than 0.15% even at saturated moisture at 100°C. Devices have
passed most stringent military specification for components.
◊ One
of the most stable adhesive for high temperature exposures with TGA
degradation well above 390°C
FLIP-CHIP FLEXIBLE CONDUCTOR ADHESIVE BUMPS
Solder Joint Replacement: Patent Pending
|
AIT
Product
|
Resistivity
(ohm-cm)
|
Current
Capability
(Amp/mm2)
|
Tg
(°C)
|
Die-Shear
(psi)
|
Max.
Temp.
(°C)
under
load
of
100 psi
|
Off-line Melt-Bonding
(@10psi
after B-staging)
|
|
(Ag, Thermoplastic)
|
< 3x10-4
|
>20
|
-55
|
>1,000
|
150
|
Instant Melt-Bonding,
>190° C
|
|
PSS8159
(Au, Thermoplastic)
|
< 3x10-3
|
>20
|
-55
|
>1,000
|
150
|
Instant Melt-Bonding,
>190° C
|
|
(Ag, Flexible Epoxy)
|
< 3x10-4
|
>20
|
-60
|
>2,000
|
250
|
Rapid-Curing Epoxy
@>100° C
|
|
(Pd, Flexible Epoxy)
|
< 3x10-3
|
>20
|
-60
|
>2,000
|
250
|
Rapid-Curing Epoxy
@>100° C
|
|
(Au, Flexible Epoxy)
|
< 3x10-3
|
>20
|
-60
|
>2,000
|
250
|
Rapid-Curing
Epoxy @>100° C
|
|
Wafer & Substrate Precision
bumpings down to 50 micron bumps and 100 micron pitch
Bumping Services Bump
height of 50-75 micron for bump diameter of 50-75 micron
With Conductor-Adhesive Clean-room
operation for substrate panel of 12"x12"
|
FLEXIBLE
UNDERFILL FOR INSULATION & PROTECTION
|
AIT
Product
|
Resistivity
(ohm-cm)
|
Dielectric
Strength
(volt/mil)
|
Thermal
Conductivity
(W/m-°
C)
|
Tg
(°C)
|
Die
Shear
(psi @
25°C
/150°C)
|
Modulus
(psi)/
Poisson Ratio
|
Curing
Conditions
|
|
(Flexible)
|
>1x10114
|
750
|
0.20
|
-30
|
1,000/50
|
6,000/0.45
|
125oC
10 min.
|
|
(Alumina epoxy)
|
>1x10114
|
750
|
1.6
|
-30
|
5,000/50
|
9,000/0.45
|
125oC
10 min.
|
|
