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FLIP-CHIP ADHESIVE BUMPS

Flip-Chip Die-Attach and Interconnections with Flexible Conductive Adhesives:

       Patented and proven reliability of flip-chip interconnections with flexible conductive adhesive.
       Simple flip-chip attach process with conductive adhesive on substrate-interposer:
o        Stencil LRTC 8550 onto precious metal bond pads on substrate-interposer.
o        B-stage the adhesive at ambient to 60°C.
o        Place flip-chip with precious metal bond-pad or bumps onto the respective substrate-interposer.
o        Cure the device interconnection at temperature 80-200°C without applied pressure.
o        Optional underfill with flexible protection encapsulation (ME 7150 water-like viscosity for defect free underfilling).
       Alternative flip-chip attach process with conductive adhesive on wafer-chip:
o        Stencil ESS8450 (or PSS 8150) onto precious metal bond pads on wafer-chip.
o        B-stage the adhesive at ambient to 60°C.
o        Place flip-chip with conductive adhesive onto the respective substrate-interposer with precious metal bond-pad or bumps that is heated to above 200°C.
o        Cure the device interconnection at temperature 200°C without pressure.
o        Optional underfill with flexible protection encapsulation (me 7150 water-like viscosity for defect free underfilling).

        Adhesive absorbed less than 0.15% even at saturated moisture at 100°C. Devices have passed most stringent military specification for components.

       One of the most stable adhesive for high temperature exposures with TGA degradation well above 390°C

 

 

 

FLIP-CHIP FLEXIBLE CONDUCTOR ADHESIVE BUMPS
Solder Joint Replacement: Patent Pending
  
AIT Product
Resistivity
(ohm-cm)
Current Capability
(Amp/mm2)
Tg
(°C)
Die-Shear
 (psi)
Max. Temp.
(°C)
under load
 of 100 psi
Off-line Melt-Bonding
(@10psi after B-staging)
(Ag, Thermoplastic)
< 3x10-4
>20
-55
>1,000
150
Instant Melt-Bonding, >190° C
PSS8159
(Au, Thermoplastic)
 < 3x10-3
 >20
-55
>1,000
150 
Instant Melt-Bonding, >190° C 
(Ag, Flexible Epoxy)
 < 3x10-4
 >20
-60 
>2,000 
 250
Rapid-Curing Epoxy @>100° C 
(Pd, Flexible Epoxy)
< 3x10-3
 >20
 -60
>2,000 
 250
Rapid-Curing Epoxy @>100° C 
(Au, Flexible Epoxy)
 < 3x10-3
 >20
 -60
 >2,000
 250
 Rapid-Curing Epoxy @>100° C
Wafer & Substrate               Precision bumpings down to 50 micron bumps and 100 micron pitch
Bumping Services                Bump height of 50-75 micron for bump diameter of 50-75 micron
With Conductor-Adhesive       Clean-room operation for substrate panel of 12"x12"

 

 

 FLEXIBLE UNDERFILL FOR INSULATION & PROTECTION

 

 

AIT Product
Resistivity
(ohm-cm)
Dielectric Strength
(volt/mil)
Thermal Conductivity
(W/m-° C)
Tg
(°C)
Die Shear
(psi @  25°C
/150°C)
Modulus (psi)/ Poisson Ratio
Curing Conditions
(Flexible)
>1x10114
750
0.20
-30
1,000/50
6,000/0.45
125oC
10 min.
(Alumina epoxy)
>1x10114
750
1.6
-30
5,000/50
9,000/0.45
125oC
10 min.

 

 

 

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

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