Stress-Free
Insulated Metal Substrate with Lowest Thermal Resistance
for Large Area and High Power Modules
AIT patented (US patent#7,154,046;
6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564;
6,665,193; 6,973,716) applied to insulated metal
substrates (IMS) differs from traditional IMS thermal
circuit substrate in the following aspects to
give them the unparalleled thermal and reliability
performance:
-
Instead of a thermally conductive
rigid fiberglass epoxy laminate, we use our
proprietary flexible thermal dielectric insulating
layer resulting in stress and warp-free thermal
copper-clad laminates.
-
Unparalleled thermal conductivity
in the insulating layer by eliminating the
fiberglass fabrics.
-
High temperature stability to
withstand soldering at 300°C.
-
Multi-layer capability with the
same flexible dielectric copper-clad pre-preg
that can be laminated at less than 14 psi pressure
and at 125°C or higher.
-
Base metal plates with choices of
aluminum and copper from 35 mils to 350 mils.
-
Thinner insulated metal substrate (IMS)
and pre-preg are available in rolls of 24-inch
width.
-
Thicker insulated metal substrate (IMS)
and pre-preg are available in sheets of 24-inch by
24-inch.
-
Ideal for power and LED
components, modules.
Single-Sided Insulated
Metal Substrate (IMS) for Power & LED
Modules
COOL-CLADTM
CC-AL-SS-1 |
-Flexible
thermal dielectric
-Aluminum Clad
-Ease of Machining
-Withstand 300oC soldering |
1 |
<1.5 |
88 |
>1000 |
4.5 |
COOL-CLADTM
CC-AL-SS-4 |
-Flexible
thermal dielectric
-Aluminum Clad
-Ease of Machining
-Withstand 300oC soldering |
4 |
<1.5 |
162 |
>1000 |
3.9 |
COOL-CLADTM
CC-AL-SS-10 |
-Flexible
thermal dielectric
-Aluminum Clad
-Ease of Machining
-Withstand 300oC soldering |
10 |
<1.5 |
312 |
>1000 |
3.9 |
COOL-CLADTM
CC-AL-SS-X |
-Flexible
thermal dielectric
-Aluminum Clad
-Ease of Machining
-Withstand 300oC soldering |
Custom |
<1.5 |
Custom |
>1000 |
3.9 |
COOL-CLADTM
CC-AL-OX-SS-10 |
-Flexible
thermal dielectric
-Aluminum Clad
-Laser Machineable
-Withstand 300oC soldering |
10 |
<1.5 |
312 |
>3000 |
3.9 |
COOL-CLADTM
CC-AL-OX-SS-X |
-Flexible
thermal dielectric
-Aluminum Clad
-Laser Machineable
-Withstand 300oC soldering |
Custom |
<1.5 |
Custom |
>3000 |
3.9 |
Double-Sided Copper-Clad Laminates
for Power & LED Modules
COOL-CLADTM
CC-CU-DS-1 |
-Flexiblethermal
dielectric
-Copper-clad Base Plate
-Ease of Machining
-Withstand 300oC soldering |
1 |
<1.1 |
88 |
>1000 |
3.9 |
COOL-CLADTM
CC-CU-DS-4 |
-Flexiblethermal
dielectric
-Copper-clad Base Plate
-Ease of Machining
-Withstand 300oC soldering |
4 |
<1.1 |
162 |
>1000 |
3.9 |
COOL-CLADTM
CC-CU-DS-10 |
-Flexiblethermal
dielectric
-Copper-clad Base Plate
-Ease of Machining
-Withstand 300oC soldering |
10 |
<1.1 |
312 |
>1000 |
3.9 |
COOL-CLADTM
CC-CU-DS-X |
-Flexiblethermal
dielectric
-Copper-clad Base Plate
-Ease of Machining
-Withstand 300oC soldering |
Custom |
<1.1 |
Custom |
>1000 |
3.9 |
COOL-CLADTM
CC-CU-OX-DS-X |
-Flexiblethermal
dielectric
-Copper-clad Base Plate
-Laser Machineable
-Withstand 300oC soldering |
Custom |
<1.1 |
Custom |
>3000 |
3.9 |
Flexible
Thermal Copper-clad Pre-preg for Power &
LED Modules
COUPLERTM
TPR-CU-1 |
-Flexible
thermal dielectric
-Lamination Flow @>125oC and
<14 psi
-Withstand 300oC soldering |
1 |
<1.1 |
88 |
>1000 |
3.9 |
COUPLERTM
TPR-CU-2 |
-Flexible
thermal dielectric
-Lamination Flow @>125oC and
<14 psi
-Withstand 300oC soldering |
2 |
<1.1 |
115 |
>1000 |
3.9 |
COUPERTM
TPR-CU-X |
-Flexible
thermal dielectric
-Lamination Flow @>125oC and
<14 psi
-Withstand 300oC soldering |
Custom |
<1.1 |
Custom |
>1000 |
3.9 |
|
SOLDERABLE
FLEXIBLE CIRCUIT COPPER CLAD LAMINATE
(COUPLER-C)
|
Characteristics
|
Unit
|
Conditioning
|
Typical
Values
|
Specification
|
|
Volume
Resistivity
|
MΩ-cm
|
C-96/35/90
|
5X107~5X108
|
106
↑
|
|
Surface
Resistivity
|
MΩ
|
C-96/35/90
|
5X105~5X106
|
10⁴
↑
|
|
Permittivity
1 MHz
|
-
|
C-24/23/50
|
3.8-4.2
|
5.4
↓
|
|
Loss
Tangent 1 MHz
|
-
|
C-24/23/50
|
0/013-0.020
|
0.035
↓
|
|
Arc
Resistance
|
Sec
|
D-48/50
+ D-0.5/23
|
100
↑
|
60
↑
|
|
Dielectric
Breakdown
|
KV
|
D-48/50
|
45
↑
|
40
↑
|
|
Moisture
Absorption
|
%
|
D-24/23
|
0.01-0.20
|
0.35
↓
|
|
Flammability
|
-
|
C-24/23/50+E-24/125
|
94V0
|
94V0
|
|
Peel
Strength 1oz
|
Lb/in
|
288ºC
Solder Floating
|
8
↑
|
8
↑
|
|
Thermal
Stress
|
Sec
|
288ºC
Solder Dipping
|
600
↑
|
300
↑
|
|
Pressure
Cooker
(2
atm/120&
|
|
