LID SEAL PREFORMS
AIT patent-pending solderable insulating
lids and patented wafer level MEMS and optical lids
solutions (US patent#6,432,253; 6,428,650; 6,409,859;
6,136,128) represent some of the most innovative solutions
in lid sealing. The solderable lid seal when applied to
insulating lids such as glass for optical lids, ceramic
lids for large and small components, LCP (Liquid Crystal
Polymers) for high performance components, and lid seals
for MEMS and wafer level packaging represents the most
cost-effective solution for reliability and performance:
◊ The only
proven polymer lid-seal solution that passes fine and
gross leak tests.
◊ Unparalleled high
temperature stability to withstand soldering at 300°C.
◊ Ideal for high volume
component lid sealing.
◊ Ideal for CCD and optical
devices when glass lids are used.
Glass, Ceramic and LCP Lids
|
AIT
Product
|
Process
& Characteristics
|
Minimum Lid Width
(mils)
|
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
|
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ambient storable for 6 mos
-Ease of Customization
-Withstand 300oC
soldering
|
6
|
Pass
|
>1000
|
Conductive Lids
|
AIT
Product
|
Process
& Characteristics
|
|
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
|
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ambient storable for 6 mos
-Ease of Customization
-Withstand 300oC
soldering
|
6
|
Pass
|
>1000
|
EMI Metal Caps and Lids
|
AIT
Product
|
Process
& Characteristics
|
|
Bond Strength
(psi)
|
Electrical Resistivity
(ohm-cm)
|
|
(Pressure
Sensitive,
Insitu-curable)
|
Þ
Suitable for flat mating area of
250 micron or wider
Þ
Low cost pre-applied on your
parts or your design
Þ
Insitu curing after bonding for
bond strength at high temp.
Þ
Ambient storable for 12 months
min.
|
3
|
>600
|
5x10-4
|
|
(Instant
Melt-Bonding
@130°C)
|
Þ
Suitable for contour and flat
area of 250 micron or wider
Þ
Low cost pre-applied on your parts or
your design
Þ
Low melt-bonding and rework temperature
@ 130°C
Þ
Ambient storable for 12 months min.
|
3
|
>600 |
5x10-4
|
|
(Instant
Melt-Bonding
@130°C)
|
Þ
Suitable for contour and flat
area of 250 micron or wider
Þ
Low cost pre-applied on your parts or
your design
Þ
Maintain bonding up to @ 130°C
Þ
Ambient storable for 12 months min.
|
3
|
>600 |
2x10-2
|
Preform Lid-Seal
Solution and Process
1. Send lid
design to our sales-engineering staff
◊ It is most
cost-effective if preforms are made in a panel or
wafer with repeating devices
2. Review and approve
lid design
3. AIT manufactures
B-staged adhesive preforms based on a repeating
device pattern
4. Lids,panel or wafer
of lids are placed onto adhesive preforms
5. Place lids with
adhesive preforms onto devices
6. Cure Lids onto
devices
◊ Induce and
observe flow of adhesive to cover lid perimeters
◊ AIT preforms
are typically high flow to allow you to observe the
sealing of all sides
7. Excise devices
8. Test for seals and
other qualities
|
