Links

LID SEAL PREFORMS

AIT patent-pending solderable insulating lids and patented wafer level MEMS and optical lids solutions (US patent#6,432,253; 6,428,650; 6,409,859; 6,136,128) represent some of the most innovative solutions in lid sealing. The solderable lid seal when applied to insulating lids such as glass for optical lids, ceramic lids for large and small components, LCP (Liquid Crystal Polymers) for high performance components, and lid seals for MEMS and wafer level packaging represents the most cost-effective solution for reliability and performance:

◊     The only proven polymer lid-seal solution that passes fine and gross leak tests.
◊     Unparalleled high temperature stability to withstand soldering at 300°C.
◊     Ideal for high volume component lid sealing.
◊     Ideal for CCD and optical devices when glass lids are used.

Glass, Ceramic and LCP Lids

AIT Product	Process & Characteristics	Minimum Lid Width (mils)	Gross Leak & Fine Leak	Dielectric Strength of Insulating Layer (Volt/mil)
ESP 7675-HF	-Wafer or Panel of Devices -B-staged high flow preforms -Ambient storable for 6 mos -Ease of Customization -Withstand 300^oC soldering	6	Pass	>1000

Conductive Lids

AIT Product	Process & Characteristics	Minimum Lid Width (mils)	Gross Leak & Fine Leak	Dielectric Strength of Insulating Layer (Volt/mil)
ESP 8680-HF	-Wafer or Panel of Devices -B-staged high flow preforms -Ambient storable for 6 mos -Ease of Customization -Withstand 300^oC soldering	6	Pass	>1000

EMI Metal Caps and Lids

AIT Product	Process & Characteristics	Minimum Lid Width (mils)	Bond Strength (psi)	Electrical Resistivity (ohm-cm)
CB 8250-E (Pressure Sensitive, Insitu-curable)	Þ Suitable for flat mating area of 250 micron or wider Þ Low cost pre-applied on your parts or your design Þ Insitu curing after bonding for bond strength at high temp. Þ Ambient storable for 12 months min.	3	>600	5x10^-4
CB 8130 (Instant Melt-Bonding @130°C)	Þ Suitable for contour and flat area of 250 micron or wider Þ Low cost pre-applied on your parts or your design Þ Low melt-bonding and rework temperature @ 130°C Þ Ambient storable for 12 months min.	3	>600	5x10^-4
CB 8133 (Instant Melt-Bonding @130°C)	Þ Suitable for contour and flat area of 250 micron or wider Þ Low cost pre-applied on your parts or your design Þ Maintain bonding up to @ 130°C Þ Ambient storable for 12 months min.	3	>600	2x10^-2

Preform Lid-Seal Solution and Process
1.      Send lid design to our sales-engineering staff
   ◊    It is most cost-effective if preforms are made in a panel or wafer with repeating devices
2.      Review and approve lid design
3.      AIT manufactures B-staged adhesive preforms based on a repeating device pattern
4.      Lids,panel or wafer of lids are placed onto adhesive preforms
5.      Place lids with adhesive preforms onto devices
6.      Cure Lids onto devices
   ◊    Induce and observe flow of adhesive to cover lid perimeters
   ◊    AIT preforms are typically high flow to allow you to observe the sealing of all sides
7.      Excise devices
8.      Test for seals and other qualities

03/09/2010 09:06