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|
Low
Pressure Copper Pre-Preg
COUPLERTM
is a novel organic copper-clad laminate that is
available with 40-50 micron molecularly flexible
dielectric and as thin 1/4 oz copper layer for
ultra-thin components and boards.
 
AIT patented (US
patent#7,154,046; 6,717,819; 6,580,035; 6,581,276;
6,108,210; 6,297,564; 6,665,193; 6,973,716)) flexible
circuit substrates (FCS) are organic copper-clad laminate
that differs from traditional FCS in two fundamental
aspects to give them the unparalleled reliability
performance:
◊
Instead of polyimide-adhesive or vacuum deposited copper
laminates, its uses AIT proprietary flexible hydrophic
dielectric insulating layer resulting in stress-free and
high speed circuits and interconnections.
◊
Unparalleled high temperature stability to withstand
soldering at 300°C.
◊ Multi-layer
capability with the same flexible dielectric copper
pre-preg that can be laminate at low pressure of less
than 14 psi and 125°C or higher.
◊ Thinner
pre-preg are available in rolls of 24-inch width.
◊ Thicker
pre-preg are available in sheets of 24-inch by 24-inch.
◊ Ideal
for flexible circuits, fine-pitch interposers, power and
LED components, modules.
Flexible Pre-Preg for Flex
Circuits and Interposers
|
AIT
Product
|
Characteristics
|
Copper Thickness
(oz)
|
Dielectric
Thickness (mils)
|
Nominal
Stack Thickness
(mils)
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
Dielectric Constant of
Insulating Layer
|
|
COUPLERTM
CPR-CU-1.00
|
-Flexible Dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC
soldering
|
1
|
2
|
3.5
|
>1000
|
3.1
|
|
COUPLERTM
CPR-CU-0.50
|
-Flexible Dielectric
-Lamination Flow @>125oC
and <14
psi
-Withstand 300oC
soldering
|
1/2
|
2
|
2.75
|
>1000
|
3.1
|
|
COUPERTM
CPR-CU-0.25
|
-Flexible Dielectric
-Lamination Flow @>125oC
and <14
psi
-Withstand 300oC
soldering
|
1/4
|
2
|
2.38
|
>1000
|
3.1
|
Flexible
Pre-Preg for Power and LED Modules
|
AIT
Product
|
Characteristics
|
Copper
Thickness
(oz)
|
Thermal
Resistance
(oC/W-in2)
|
Nominal
Stack Thickness
(mils)
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
Dielectric
Constant of Insulating Layer
|
|
COUPLERTM
TPR-CU-1
|
-Flexible thermal
dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC
soldering
|
1
|
<1.1
|
88
|
>1000
|
4.5
|
|
COUPLERTM
TPR-CU-2
|
-Flexible thermal
dielectric
-Lamination Flow @>125oC
and <14
psi
-Withstand 300oC
soldering
|
2
|
<1.1
|
115
|
>1000
|
4.5
|
|
COUPERTM
TPR-CU-X
|
-Flexible thermal
dielectric
-Lamination Flow @>125oC
and <14
psi
-Withstand 300oC
soldering
|
Custom
|
<1.1
|
Custom
|
>1000
|
4.5
|
18/01/2012 03:50
|
|
