Solderable
Flexible 1 and 2-Sided Copper Laminate Flexible Circuit
Substrate Materials
AIT patented (US
patent#7,154,046; 6,717,819; 6,580,035; 6,581,276;
6,108,210; 6,297,564; 6,665,193; 6,973,716) molecularly
flexible dielectric laminate with copper (COUPLERTM)
as flexible circuit material differs from traditional
polyimide copper laminates for flexible circuit
applications in two fundamental aspects to give them the
unparalleled reliability performance with cost
effectiveness:
◊ Instead
of high Tg polyimide or liquid crystal polymer (LCP)
substrate materials that requires either the use of
acrylic
adhesives or costly evaporated metal deposition, its
uses AIT proprietary molecularly flexible dielectric
to produce stress-free
and solderable flexible substrate material for
flexible circuits and component interposers.
◊
Unparalleled high temperature stability to withstand
soldering at 300°C when used as flexible circuit
material.
◊
Multi-layer capability with the same flexible
dielectric copper clad pre-preg flexible circuit
material that can be laminated at low pressure of less
than 14 psi and 125°C or higher.
◊ Thinner
COUPLERTM flexible circuit substrate and
pre-preg flexible circuit material are available in
rolls of 24-inch width.
◊ Thicker
COUPLERTM flexible circuit substrate and
flexible circuit pre-preg material are available in
sheets of 24-inch by 24-inch.
◊ Ideal
for higher costs polyimide-copper laminate flexible
circuit material replacement with increase in circuit
speed and reliability.
|
FLEXIBLE
CIRCUIT SUBSTRATE Material COMPARATIVE
ANALYSIS
|
|
Property
|
Polyimide
(PI)
|
LCP
|
PET
|
COUPLER™-C
(PET
& PI Replacement)
|
COUPLER™-CPI
(PI-Adhesive
Replacement)
|
|
Tensile
Strength
(kpsi)
|
40-50
|
15
|
30
|
5
|
50
|
|
Elongation
(%)
|
40-60
|
16
|
50
|
200
|
60
|
|
Young’s
Modulus
(kpsi)
|
800
|
700
|
500
|
Elastomeric
(20)
|
800
|
|
Tear
Strength
(gm)
|
18-26
|
15
|
>20
|
Elastomeric
(5)
|
26
|
|
Peel
Strength (lb/in)
|
3-4
|
|
8
|
8
|
8
|
|
Heat
Shrinkage (@200°C, %)
|
0.04-0.08
|
0.04
|
“Melted”
|
Average <0.1
Elastomeric
|
0.04
|
|
CTE
(ppm/°C)
|
13-14
|
18
|
60
|
Elastomeric
|
15
|
|
Moisture
Absorption (%)
|
1.0-2.4
|
0.1
|
0.5
|
0.2
|
0.2 on circuit
side
|
|
Dielectric
Constant
|
3.1-3.3
|
3.0
|
3.3
|
3.0
|
3.0 on circuit
side
|
|
Dielectric
Loss
|
0.005
|
0.003
|
0.01
|
0.01
|
0.01 on circuit
side
|
|
Dielectric
Strength (kV/mil)
|
5.7-6.0
|
5.9
|
0.8
|
0.8
|
6.0 (overall)
|
|
Thermal
Stress and Solderability
|
>600 sec @
288°C
|
Marginal
|
NA
|
>600 sec @
288°C
|
>600 sec @
288°C
|
|
Thermal
Stress and Solderability
|
>600 sec @
300°C
|
NA
|
NA
|
>600 sec @
300°C
|
>600 sec @
300°C
|
|
Subtractive
and Additive Process Applicability
|
Yes
|
Yes
|
NA
|
Yes
|
Yes
|
|
Additional
Notes:
1.
Some data is extracted from Advanced
Packaging March 2002
2.
Polyimide (PI) and LCP substrates are
seeded and plated-up with copper layer. PI
with acrylic adhesive has lower performance.
3.
Data for Polyester (PET) are typical
values. Since PET substrate is not solderable,
it can only be used for Polymer Thick Film
applications only.
4.
COUPLER™-C is a laminate of standard
electronic copper film with COUPLER™
substrate without adhesive.
5.
COUPER™-CPI is a laminate of standard
electronic copper film with COUPLER™
substrate on Polyimide core.
6.
Typical thickness for COUPLER-C and
COUPLER™-CPI are 3-mil COUPLER™ substrate
and 2-mil COUPLER™ substrate on 1 mil PI.
7.
COUPLER™-C and COUPLER™-CPI are
available with either single side or both side
copper films (@1/4, 1/2 oz or 1 oz, other
thickness is available on special order).
8.
“PRE-PREG” COUPLER™-CPI is
available for multi-layer applications.
|
Single-Sided
Copper-Clad Laminate Flexible Circuit Material
Substrates
|
AIT
Product
|
Characteristics
|
Copper Thickness
(oz)
|
Thermal
Resistance(oC/W-in2)
|
Nominal
Stack Thickness
(mils)
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
Dielectric
Constant of Insulating Layer
|
|
COUPLERTM
CC-CU-SS-1.00
|
-Flexible Dielectric
-Copper Laminate
-Ease of Machining
-Withstand 300oC
soldering
|
1.0
|
<1.5
|
88
|
>1000
|
3.1
|
|
COUPLERTM
CC-CU-SS-0.50
|
-Flexible Dielectric
-Copper Laminate
-Ease of Machining
-Withstand 300oC
soldering
|
0.5
|
<1.5
|
75
|
>1000
|
3.1
|
|
COUPLERTM
CC-CU-SS-0.25
|
-Flexible Dielectric
-Copper Laminate
-Ease of Machining
-Withstand 300oC
soldering
|
0.25
|
<1.5
|
60
|
>1000
|
3.1
|
|
COUPLERTM
CC-CU-SS-X
|
-Flexible Dielectric
-Copper Laminate
-Ease of Machining
-Withstand 300oC
soldering
|
Custom
|
<1.5
|
Custom
|
>1000
|
3.1
|
Double-Sided
Copper Laminates Flexible Circuit Mateirals for Flexible
Circuits, Interposers, and
Modules
|
AIT
Produt
|
Characteristics
|
Copper Thickness
(oz)
|
Thermal
Resistance(oC/W-in2)
|
Nominal
Stack Thickness
(mils)
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
Dielectric
Constant of Insulating Layer
|
|
COUPLERTM
CC-CU-DS-
(0.25/0.25)
|
-Flexible thermal
dielectric
-Copper Base Plate
-Ease of Machining
-Withstand 300oC
soldering
|
0.25/0.25
|
<1.1
|
66
|
>1000
|
3.1
|
|
COUPLERTM
CC-CU-DS-
(0.50/0.50)
|
-Flexible thermal
dielectric
-Copper Base Plate
-Ease of Machining
-Withstand 300oC
soldering
|
0.50/0.50
|
<1.1
|
88
|
>1000
|
3.1
|
|
COUPLERTM
CC-CU-DS-
(1.0/1.0)
|
-Flexible thermal
dielectric
-Copper Base Plate
-Ease of Machining
-Withstand 300oC
soldering
|
1.0/1.0
|
<1.1
|
125
|
>1000
|
3.1
|
|
COUPLERTM
CC-CU-DS-
(1.0/X)
|
-Flexible thermal
dielectric
-Copper Base Plate
-Ease of Machining
-Withstand 300oC
soldering
|
Custom
|
<1.1
|
Custom
|
>1000
|
3.1
|
Flexible
Pre-Preg Flexible Circuit Material for Multi-layer Flexible
Circuits and Interposers
