SOLDERABLE INSULATING LIDS
AIT patent-pending solderable insulating
lids and patented wafer level MEMS and optical lids
solutions (US patent#6,432,253; 6,428,650; 6,409,859;
6,136,128) represents some of the most innovative
solutions in hermetic lid sealing. The solderable lid
sealing when applied to insulating lids such as glass for
optical lids, ceramic lids for large and small components,
LCP (Liquid Crystal Polymers) for high performance
components, and lid seals for MEMS and wafer level
packaging represents some of the most cost-effective
solutions with unparalleled reliability performance:
◊ The only
proven polymer lid-seal solution that passed fine and
gross leak tests.
◊ Unparalleled high
temperature stability to withstand soldering at 300°C.
◊ Ideal for high volume
components lid sealing.
◊ Ideal for CCD and optical
devices when glass lids are used.
Solderable Glass Lids
|
AIT
Product
|
Process
& Characteristics
|
Copper Thickness
(oz)
|
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
|
Opto-LidTM
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC
soldering
-AIT ESP 7675-HF
|
1
|
Pass
|
>1000
|
Solderable Ceramic Lids
|
AIT
Product
|
Process
& Characteristics
|
Copper Thickness
(oz)
|
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
|
Ceramic-LidTM
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC
soldering
-AIT ESP 7675-HF
|
1
|
Pass
|
>1000
|
Solderable LCP (Liquid Crystal
Polymer) Lids
|
AIT
Product
|
Process
& Characteristics
|
Copper Thickness
(oz)
|
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer
(Volt/mil)
|
|
LCP-LidTM
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC
soldering
-AIT ESP 7675-HF
|
1
|
Pass
|
>1000
|
|
