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SOLDERABLE INSULATING LIDS

AIT patent-pending solderable insulating lids and patented wafer level MEMS and optical lids solutions (US patent#6,432,253; 6,428,650; 6,409,859; 6,136,128) represents some of the most innovative solutions in hermetic lid sealing. The solderable lid sealing when applied to insulating lids such as glass for optical lids, ceramic lids for large and small components, LCP (Liquid Crystal Polymers) for high performance components, and lid seals for MEMS and wafer level packaging represents some of the most cost-effective solutions with unparalleled reliability performance:

◊     The only proven polymer lid-seal solution that passed fine and gross leak tests.
◊     Unparalleled high temperature stability to withstand soldering at 300°C.
◊     Ideal for high volume components lid sealing.
◊     Ideal for CCD and optical devices when glass lids are used.

 

Solderable Glass Lids 
 

 

AIT Product
Process & Characteristics
Copper Thickness
(oz)
Gross Leak
Fine Leak 
Dielectric
Strength of Insulating Layer
(Volt/mil)
 
Opto-LidTM
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF

1

Pass 

>1000

  

Solderable Ceramic Lids 
 

 

AIT Product
Process & Characteristics
Copper Thickness
(oz)
Gross Leak
Fine Leak 
Dielectric
Strength of Insulating Layer
(Volt/mil)
 
Ceramic-LidTM
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF

1

Pass 

>1000

   

Solderable LCP (Liquid Crystal Polymer) Lids 
 

 

AIT Product
Process & Characteristics
Copper Thickness
(oz)
Gross Leak
Fine Leak 
Dielectric
Strength of Insulating Layer
(Volt/mil)
 
LCP-LidTM
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF

1

Pass 

>1000

 

 

 

 

18/09/2008 07:35

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

Latest  News:

 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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