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SOLDERABLE INSULATING LIDS

AIT patent-pending solderable insulating lids and patented wafer level MEMS and optical lids solutions (US patent#6,432,253; 6,428,650; 6,409,859; 6,136,128) represents some of the most innovative solutions in hermetic lid sealing. The solderable lid sealing when applied to insulating lids such as glass for optical lids, ceramic lids for large and small components, LCP (Liquid Crystal Polymers) for high performance components, and lid seals for MEMS and wafer level packaging represents some of the most cost-effective solutions with unparalleled reliability performance:

◊     The only proven polymer lid-seal solution that passed fine and gross leak tests.
◊     Unparalleled high temperature stability to withstand soldering at 300°C.
◊     Ideal for high volume components lid sealing.
◊     Ideal for CCD and optical devices when glass lids are used.

Solderable Glass Lids 
AIT Product
Process & Characteristics
Copper Thickness
(oz)
Gross Leak
& 
Fine Leak 
Dielectric
Strength of Insulating Layer
(Volt/mil)
 
Opto-LidTM
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF

1

Pass 

>1000
Solderable Ceramic Lids 
AIT Product
Process & Characteristics
Copper Thickness
(oz)
Gross Leak
& 
Fine Leak 
Dielectric
Strength of Insulating Layer
(Volt/mil)
 
Ceramic-LidTM
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF

1

Pass 

>1000
Solderable LCP (Liquid Crystal Polymer) Lids 
 
AIT Product
Process & Characteristics
Copper Thickness
(oz)
Gross Leak
& 
Fine Leak 
Dielectric
Strength of Insulating Layer
(Volt/mil)
 
LCP-LidTM
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF

1

Pass 

>1000
 

18/01/2012 03:50

EPAK
Latest  News:
 

06.07.2011

NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor

Lighter, brighter, cleaner and quieter.

09.03.2011

Custom Flex Circuit Abrader

We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.
21.10.2010

SA150 Video of our Surface Abrader added to our YouTube channel

09.08.2010

BV9000 Videos Added  of our Rectifier Beveller to our new YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet
18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

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