|
Abrasives
Adhesives & Epoxies
Air
Dryers
Blast
Cabinets (Abrasive)
Bonding
Capillaries
Bonding
Wedges
Chip
Capacitors
CO2 Cleaning
Custom
Product Solutions
CPU
Cooling (Cool-Silver)
Die
Bonders
Die
& Pin Eject Systems
Dicing
& Wafer Tapes
Die
Pickup Tools
Dispensing
Systems
Diamond Wheel
Dressing Solution
Dust
Extraction
Electronic
Packages & Lids
Epoxy
Stamping & Dispensing
Hot
Gas/Rework Station
Ink Coating & Handling
Machine
Guards (Custom Made)
Mask
& Substrate Alignment
Maintenance
& Shop Supplies
Micro Abrasive Systems
Micro
Blaster Accessories
Micro
Blasting Services Pick
& Place Systems
Printing
Supplies & Equipment
Resistors
- Thin Film
Resistors
- Thin Film Microwave & RF
Resistors
- Thick Film
Safety Products
Silicon Doping Stains
Soldering Equipment
Solderability
Testers
Solitec
Spinners, Coaters and Developer support
Steam
Aging Equipment
Storage Cabinets (Dry / Nitrogen & Custom)
Surface
Abrader Tapes
(Wafer, Dicing & Protective)
Tape
/ Film Applicator / Mounters
UV Curing
Control & Test Equipment
UV Curing Equipment
Wafer Backlap
Applicator Wire
Bonding Wedges
Home
Page
Applications
Contact
Us
Data
Sheets
Links
Map
& Directions
News
Products
By Manufacturer
Site
Map
Spares
& Servicing
|
THERMAL FILM AND PASTE ADHESIVES
   
Thermally Conductive &
Electrically Insulating Paste Adhesives
|
AIT Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Viscosity
|
|
|
-Solvent free
-Stress free
|
>1x1014
|
>1.7
|
>1,800
|
-25
|
276,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Mismatched CTE's
|
>1x1014
|
>1.7
|
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Diamond filled
|
>1x1014
|
>11.4
|
>1,800
|
-25
|
310,000
(cps@ 0.5 rpm)
|
|
ME7638-RC
|
-1-component, 7 days pot-life
min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
|
>1x1014
|
>3.0
|
>3,000
|
60
|
10,000
(cps@ 0.5 rpm)
TI >4.0
|
|
ME7658-RC
|
-1-component, 7 days pot-life
min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
|
>1x1014
|
>3.0
|
>1,500
|
-25
|
60,000
(cps@ 0.5 rpm)
TI >3.0
|
AIT
offers many other thermally conductive paste and
thermal interface adhesive materials not shown on our web
site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
Electrically and Thermally
Conductive Paste
(Click
on the Product for the TDS)
|
AIT Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Viscosity
|
|
|
-Stress free
-One or two component
-Large bonding areas
|
<4x10-4 |
>6.0 |
>1,800
|
-20
|
300,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
<4x10-4 |
>7.9 |
>1,000
|
-20
|
60,00
(cps@ 2.5 rpm)
|
|
|
-Stress free
-Mismatched CTE's
|
<4x10-4 |
>7.9 |
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm)
|
|
|
-Solder replacement
-Rapid curing
-Molecularly flexible
-More than 7 days pot-life
-Dispensible & screen printable
|
<4x10-4 |
>6.0 |
>1,500
|
-20
|
15,000
(cps@ 0.5 rpm)
TI >4
|
AIT offers many other Electrically and Thermally
conductive paste and thermal interface materials
not shown on our web site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
Thermally Conductive &
Electrically Insulating Films and Pads
(Click
on the Product for the TDS)
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die
shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
|
-Instant melt-tack >150°C (<10
psi)
-No curing required
-Low
moisture absorption
-Passes NASA outgassing
requirement
-Proven reliability
for large area substrates
|
>1x1014
|
>4.0
|
>1000 |
-55 |
Tack free dry film
Preforms
3-12 mils (thick)
|
|
COOL-BOND®
CB7208-A
|
-Instant tack with 10 psi
for 300 psi bond
-Insitu curing, no special curing process
-Passes NASA outgassing
requirement
-Proven reliability
for large area substrates
|
>1x1014
|
>3.6
|
750
|
-25
|
Tacky film
Preforms
3-12 mils (thick)
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >300°C
short-term exposure
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
-Proven reliability
for large area substrates
|
>1x1014
|
>2.0
|
>1,500 |
-45
|
Tack free dry film
Preforms
3-12 mils (thick)
|
|
|
-Tacky for instant placement
without fixture
-Curing without fixture and pressure
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirement
-Proven reliability for large
area substrates
|
>1x1014
|
>2.0
|
>1,500 |
-45
|
Tacky film
Preforms
3-12 mils (thick)
|
|
|
-Tacky for instant placement
without fixture
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area substrates
|
>1x1014
|
>3.6
|
>1,500
|
-20
|
Tacky film
Preforms
3-12 mils (thick)
|
AIT offers many other thermally conductive film
and thermal interface materials not shown on our web
site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
Electrically and Thermally
Conductive Films and Pads
(Click
on the Product for the TDS)
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die
shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
|
-Instant melt-tack >120°C (<10
psi)
-Curing without fixture and pressure
-Withstand >150°C
wire-bonding
-Low
moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability
for large area bonding
|
<4x10-4
|
>6.0
|
>1,500
|
-45
|
Tack free dry film
Preforms
3-12 mils (thick)
|
|
|
-Tacky for instant placement
without fixture
-Curing with fixture or low pressure
-Withstand high temperature
excursion
-Molecularly
flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing
requirements
-Proven reliability
for large area substrates
|
|
>8.0
|
>1,500 |
-20
|
Tacky film
Preforms
3-12 mils (thick)
|
AIT offers many other Electrically and Thermally
conductive film adhesive materials not shown on our
web site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.
18/01/2012 03:50
|
|
