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CHIP CARRIERTM CHIP PROTECTION SOLUTIONS |
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"UNIVERSAL" WAFFLE PACK |
"UNIVERSAL" JEDEC TRAY |
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CUSTOM WAFFLE PACK |
CUSTOM JEDEC TRAY |
"Universal" Waffle Pack
UV-releasing tacky plain waffle pack, anti-static, and high temperature use (>110ºC), deliverable within 1 week.
UV-releasing tacky layer may be removed and new tacky layer re-applied for recycle useage.
"Universal" for use with any size parts.
Custom Waffle Pack
High temperature (>160ºC), anti-static, custom waffle-pack, deliverable in 3 weeks.
Lowest cost custom waffle pack for use below 60ºC and non-static sensitive parts, deliverable in 3 weeks.
Custom anti-static waffle pack for use below 60ºC, deliverable in 3 weeks.
"Universal" JEDEC tray
UV-releasing tacky plain waffle pack, anti-static, and high temperature use (>110ºC), deliverable within 1 week.
UV-releasing tacky layer may be removed and new tacky layer re-applied for recycle useage.
"Universal" for use with any size parts.
Custom JEDEC tray
High temperature (>160ºC), anti-static, custom waffle-pack, deliverable in 3 weeks.
Lowest cost custom waffle pack for use below 60ºC and non-static sensitive parts, deliverable in 3 weeks.
Custom anti-static waffle pack for use below 60ºC, deliverable in 3 weeks.
CUSTOM WAFFLE PACKS
Custom made with precision for 100% pick and place success.
CUSTOM WAFFLE PACKS BASE MATERIAL COLOUR CAVITY SIZES HEIGHT SUGGESTED APPLICATIONS 4-inch Waffle Packs Conductive HIPS or ABS Black As Needed As Needed Dies of all sizes.
CSP, BGA and JEDEC components <1.3mm height.
Adhesive preforms.
Any parts that used pick-and-place automation.
2-inch Waffle Packs Conductive HIPS or ABS Black As Needed As Needed These special waffle pack sizes are not standard and the cost per cavity may be slightly more expensive.
Applications and selection guideline:
High temperature waffle packs series is more suitable for components that must be pre-baked before soldering.
All waffle packs may be refurbished with detergent cleaning and low temperature drying.
Other height of cavity may be custom made upon request.
Standard delivery of all custom waffle packs is 3 to 4 weeks.
CUSTOM "BAKE-ABLE" WAFFLE PACKS BASE MATERIAL COLOUR CAVITY SIZES HEIGHT SUGGESTED APPLICATIONS 4-inch "Bake-Able" Waffle Packs PC or Nylon Black As Needed As Needed Dies of all sizes.
CSP, BGA and JEDEC components <1.3mm height.
Adhesive preforms.
Any parts that used pick-and-place automation.
2-inch "Bake-Able" Waffle Packs PC or Nylon Black As Needed As Needed These special waffle pack sizes are not standard and the cost per cavity may be slightly more expensive.
UNIVERSAL UV - RELEASING WAFFLE PACKS
Universally fitting waffle pack for custom and 100% pick and place success.
Precision firm holding of chips and components at low cost.
UV accessible substrate and UV relesing tacky layer.
Uni-Waffle TM (for use below 80ºC) Pocket Heights Pocket Sizes & Special Characteristics Peel Strength WT-50 WT-100
WT-200
50 mil 100 mil
200 mil
Universal with no specific pocket size. Place parts within 3.8" (97mm) x 3.8" (97mm) active area.
Lowest cost solution for part that does not require pre-baking.
High pre-cured tack (~600gm/inch)
Suggested applications and selection guideline:
Dies, CSP, BGA and parts of all sizes/
All JEDEC components and any parts that use pick and place automation.
Order trial sample kits of various peel strength for testing. Larger surface area in contact with the tray may use lower peel strength.
Lower tack Uni-Waffle TM may be used universally for all parts when used with insert foam for additional part security and positioning.
High temperature Uni-WaffleTM of BWT series is more suitable for components that must be pre-baked before soldering.
All Uni-WaffleTM packs may be refurbished with re-application of UV releasing insert of tacky layers available from AIT/Epak.
Standard delivery of all custom waffle packs is 3 to 4 weeks.
"Bake-able" Uni-Waffle TM (for use @ 150ºC) Pocket Heights Pocket Sizes & Special Characteristics Peel Strength BWT-50 BWT-100
BWT-200
50 mil 100 mil
200 mil
Universal with no specific pocket size. Place parts within 3.8" (97mm) x 3.8" (97mm) active area.
Suitable for part that requires pre-baking before soldering.
High pre-cured tack (~600gm/inch)
CUSTOM JEDEC TRAYS
Custom made for 100% pick and place success.
CUSTOM TRAYS BASE MATERIAL COLOUR CAVITY SIZES HEIGHT SUGGESTED APPLICATIONS 4-inch Waffle Packs Conductive HIPS or ABS Black As Needed As Needed Dies of all sizes.
CSP, BGA and JEDEC components <1.3mm height.
Adhesive preforms.
Any parts that used pick-and-place automation.
2-inch Waffle Packs Conductive HIPS or ABS Black As Needed As Needed These special waffle pack sizes are not standard and the cost per cavity may be slightly more expensive.
Applications and selection guideline:
High temperature waffle packs series is more suitable for components that must be pre-baked before soldering.
All waffle packs may be refurbished with detergent cleaning and low temperature drying.
Other height of cavity may be custom made upon request.
Standard delivery of all custom waffle packs is 3 to 4 weeks.
CUSTOM "BAKE-ABLE" WAFFLE PACKS BASE MATERIAL COLOUR CAVITY SIZES HEIGHT SUGGESTED APPLICATIONS 4-inch "Bake-Able" Waffle Packs PC or Nylon Black As Needed As Needed Dies of all sizes.
CSP, BGA and JEDEC components <1.3mm height.
Adhesive preforms.
Any parts that used pick-and-place automation.
2-inch "Bake-Able" Waffle Packs PC or Nylon Black As Needed As Needed These special waffle pack sizes are not standard and the cost per cavity may be slightly more expensive.
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25/01/06
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