 ABRASIVE MEDIA
A
wide variety of materials can be used for abrasive blasting. Listed
are products that Comco Inc. offer as a standard item. Specially
graded materials can be ordered for fine tuning of processes. Call
for further details !!
ALUMINUM OXIDE Aluminum
Oxide is recommended for the following applications:
|
Cleaning
ceramic substrates |
Removal
of inked markings |
Component
failure analysis |
|
Removing
bridging between traces |
Cleaning
magnesium oxide from thermocouples |
Etching
of heat-sensitive materials |
|
Clean
up of laser drilled holes |
Texturing
graphite surfaces |
Silicon
wafer beveling |
Available
in :
|
"A"
10 micron |
"B"
25 micron |
"C"
50 micron |
"J"
17.5 micron |
"N"
150 micron |
CRUSHED
GLASS
Available
in "K" 80 micron
GLASS
BEADS
|
For
cosmetic use on component metal surfaces or board edges |
Demarking
plated components without damaging component finish |
Available
in "D" 50 micron (white)
PLASTIC
MEDIA
|
Deburring
Delrin ® / Teflon® / nylon devices |
Deflashing
plastic connectors |
|
Stripping
wire insulation |
Removing
conformal coating |
Available
in "M" 200 micron
SILICON
CARBIDE
|
Cutting
silicon wafers |
Drilling
holes in ceramic substrates |
Deburring
stainless steel parts & other hard material |
Available
in "E" 20 micron (grey) & "F" 50 micron (grey)
SODIUM
BICARBONATE
|
Removing
solder mask |
Removal
of inked markings on plastic materials |
|
Removing
conformal coating |
Removal
of epoxy on electronic test probe ID's |
|
Deburring
Delrin ® / Teflon® / nylon devices |
Cleaning
ceramic surfaces |
|
Stripping
wire insulation |
|
WALNUT
SHELLS
|
Removing
solder mask |
Stripping
wire insulation |
|
Removing
conformal coating |
Removal
of inked markings on plastic materials |
|
Deburring
Delrin ® / Teflon® / nylon devices |
|
Data Sheet on Media
|
