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ABRASIVE MEDIA

    Sodium Bicarbonate, Walnut Shell, Glass Bead, Crushed Glass, Walnut Shell, Silicon Carbide, & Plastic Abrasive Media from Comco

    ABRASIVE MEDIA AND APPLICATIONS LIST

A wide variety of materials can be used for abrasive blasting. Listed are products that Comco Inc. offer as a standard item. Specially graded materials can be ordered for fine tuning of processes. Call for further details !!


ALUMINUM OXIDE  

Aluminum Oxide is recommended for the following applications:

Cleaning ceramic substrates

Removal of inked markings

Component failure analysis

Removing bridging between traces

Cleaning magnesium oxide from thermocouples

Etching of heat-sensitive materials

Clean up of laser drilled holes

Texturing graphite surfaces

Silicon wafer beveling

Available in :

"A" 10 micron

"B" 25 micron

"C" 50 micron

"J" 17.5 micron

"N" 150 micron

 

CRUSHED GLASS

Available in "K" 80 micron

GLASS BEADS

For cosmetic use on component metal surfaces or board edges

Demarking plated components without damaging component finish

Available in "D" 50 micron (white)

PLASTIC MEDIA

Deburring Delrin ® / Teflon® / nylon devices

Deflashing plastic connectors

Stripping wire insulation

Removing conformal coating

Available in "M" 200 micron

SILICON CARBIDE

Cutting silicon wafers

Drilling holes in ceramic substrates

Deburring stainless steel parts & other hard material

Available in "E" 20 micron (grey) & "F" 50 micron (grey)

     

SODIUM BICARBONATE

Removing solder mask

Removal of inked markings on plastic materials

Removing conformal coating

Removal of epoxy on electronic test probe ID's

Deburring Delrin ® / Teflon® / nylon devices

Cleaning ceramic surfaces

Stripping wire insulation

    Available in "G" 50 micron (white)

WALNUT SHELLS

Removing solder mask

Stripping wire insulation

Removing conformal coating

Removal of inked markings on plastic materials

Deburring Delrin ® / Teflon® / nylon devices

    Available in "H" 250 micron (brown)

Data Sheet on Media

 

13/08/2008 14:34

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

Latest  News:

 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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