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APPLICATIONS
MANUFACTURING / INDUSTRIAL
- MEMS/MICROMACHINING – PURCO2 COMCO ABM UVPS SPT
- LCO2 MEMS RELEASE OF SURFACE TENSION
- MICROFLUIDIC STRUCTURE ALIGNMENT AND BONDING
- PRECISION MACHINING
- DE-BURRING
- SURFACE FINISHING – COSMETIC
- SURFACE FINISHING – OXIDE REMOVAL
- SURFACE FINISHING – IMPROVED ADHESION TO LARGER SURFACE AREA
- PRECISION ABRASIVE MACHINING OF DEEP STRUCTURES BLIND AND THROUGH HOLES
- SAND BLAST MASKS
- AEROSPACE TURBINE BLADE
MANUFACTURING & RECONDITIONING
MEDICAL
SEMICONDUCTOR
- PHOTOLITHOGRAPHY EQUIPMENT (MASK ALIGNER)
- SEMICONDUCTOR AND HYBRID MANUFACTURING
- DICING TAPE
- WAFER FRAME TAPE MOUNTING / DE-MOUNTING
- BACKLAP TAPE APPLICATION
- UV DICING TAPE RELEASE
- FLIP-CHIP ALIGNMENT
- EUTECTIC BONDING
- SURFACE FINISHING - STRAIN GAUGE BONDING
ELECTRONICS
- WIRE AND DIE BONDING TOOLS
- EPOXY DISPENSE NOZZLES AND STAMPING TOOLS RUBBER AND STEEL
PRINTING INDUSTRY
- PRINTING – UV CURE MODULES AND PSU, RADIOMETER / PUCK RADIOMETERS DYNE
LIQUIDS PENS AND GONIOMETER UV CURE LABELS
INDUSTRIAL CLEANING
- SURFACE CLEANING
- PURCO2 - SUB-MICRON PARTICULATE REMOVAL / HYDROCARBON REMOVAL / CLEANING
/ PLASMA PREPARATION OF PLASTICS
- QUARTZ CRYSTAL MANUFACTURING – CO2 SNOW CLEANING FOR REMOVAL OF
MICRO-ABRASIVE PARTICLES BEFORE PLATING AND TO REMOVE POORLY ADHERED
PLATING BEFORE CHARACTERIZATION
UV CURING
- UVPS UV CURING / RADIOMETER /
- UV CURING – LOW COST UV PSU 400 – 1000W LAMPHOUSES UV LED CURING UV
CONVEYOR
- UV PROCESS CONTROL AND PROCESS DEVELOPMENT – RADIOMETERS THIN FILM
CALORIMETER (PROCESS DEVELOPMENT AND MONITORING OF UV ADHESIVE
MANUFACTURE) UV CURE LABELS
MISC
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27/06/2008 09:38
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Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film
& Thick Film Resistors - Electronic Packages - Dispensing
Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape &
Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV
Curing Systems & Accessories - Solderability Test Equipment -
Steam Agers - Custom Machine Guarding
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