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APPLICATIONS
MANUFACTURING / INDUSTRIAL
- MEMS/MICROMACHINING – PURCO2 COMCO ABM UVPS SPT
- LCO2 MEMS RELEASE OF SURFACE TENSION
- MICROFLUIDIC STRUCTURE ALIGNMENT AND BONDING
- PRECISION MACHINING
- DE-BURRING
- SURFACE FINISHING – COSMETIC
- SURFACE FINISHING – OXIDE REMOVAL
- SURFACE FINISHING – IMPROVED ADHESION TO LARGER SURFACE AREA
- PRECISION ABRASIVE MACHINING OF DEEP STRUCTURES BLIND AND THROUGH HOLES
- SAND BLAST MASKS
- WIRE
STRIPPING
- AEROSPACE TURBINE BLADE
MANUFACTURING & RECONDITIONING
MEDICAL
SEMICONDUCTOR
- PHOTOLITHOGRAPHY EQUIPMENT (MASK ALIGNER)
- SEMICONDUCTOR AND HYBRID MANUFACTURING
- DICING TAPE
- WAFER FRAME TAPE MOUNTING / DE-MOUNTING
- BACKLAP TAPE APPLICATION
- UV DICING TAPE RELEASE
- FLIP-CHIP ALIGNMENT
- EUTECTIC BONDING
- SURFACE FINISHING - STRAIN GAUGE BONDING
ELECTRONICS
PRINTING INDUSTRY
- PRINTING – UV CURE MODULES AND PSU, RADIOMETER / PUCK RADIOMETERS DYNE
LIQUIDS PENS AND GONIOMETER UV CURE LABELS
INDUSTRIAL CLEANING
- SURFACE CLEANING
- PURCO2 - SUB-MICRON PARTICULATE REMOVAL / HYDROCARBON REMOVAL / CLEANING
/ PLASMA PREPARATION OF PLASTICS
- QUARTZ CRYSTAL MANUFACTURING – CO2 SNOW CLEANING FOR REMOVAL OF
MICRO-ABRASIVE PARTICLES BEFORE PLATING AND TO REMOVE POORLY ADHERED
PLATING BEFORE CHARACTERIZATION
UV CURING
- UVPS UV CURING / RADIOMETER /
- UV CURING – LOW COST UV PSU 400 – 1000W LAMPHOUSES UV LED CURING UV
CONVEYOR
- UV PROCESS CONTROL AND PROCESS DEVELOPMENT – RADIOMETERS THIN FILM
CALORIMETER (PROCESS DEVELOPMENT AND MONITORING OF UV ADHESIVE
MANUFACTURE) UV CURE LABELS
MISC
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Inexpensive
In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder |
Read
Notes>> |
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Rework of
Underfilled Flip Chips
Equipment: Model 850 Flip Chip Placement System with
Model 870 Rework Option |
Read
Notes>> |
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Hot Gas Rework
Equipment: Model 4450 Hot Gas Rework Station |
Read
Notes>> |
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Picking Die From
Tape
Equipment: Model 4750 Die Ejector System; Model 4800
Die Ejector Grid System; Model 830 Pick & Place System |
Read
Notes>> |
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Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System |
Read
Notes>> |
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Bonding VCSEL's
Equipment: Model 410 Flip Chip Die Bonder; Model 860
Omni Bonder |
Read
Notes>> |
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Wafer Mounting for
Dicing
Equipment: Model 300, 3100 and 3150 Wafer Film Frame
Tape Applicators |
Read
Notes>> |
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Bonding Edge
Emitting Laser Diodes
Equipment: Model 410 Flip Chip Die Bonder; Model 860
Omni Bonder |
Read
Notes>> |
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Thermosonic Bonding
Gold Bumped Die
Equipment: Model 410 Flip Chip Aligner/Bonder; Model
410XP Precision Bonder; Model 860 Omni Bonder |
Read
Notes>> |
09/03/2010 16:03
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