Bonding Capillaries, Wedges, Pick Up Tools and Dispensing Nozzles Epoxies, Adhesives, Thermoplastic Films and Thermal Gel and Greases Micro-Abrasive blasting equipment, media and systems UV Curing equipment, spares and accessories Wafer, dicing and protective tapes including UV and pressure release tapes Thin Film & Thick Film Chip Resistors, Arrays, Networks, Attenuators, MOS Chip Capacitors and Jumpers Precision Die Bonders, pick and place systems, die eject systems and wafer film mounters
 

Abrasives

Adhesives & Epoxies

Air Dryers

Blast Cabinets (Abrasive)

Bonding Capillaries

Bonding Wedges

Chip Capacitors

CO2 Cleaning

Custom Product Solutions

CPU Cooling (Cool-Silver)

Die Bonders

Die & Pin Eject Systems

Dicing & Wafer Tapes

Die Pickup Tools

Dispensing Systems

Diamond Wheel Dressing Solution

Dust Extraction 

Electronic Packages & Lids

Epoxy Stamping & Dispensing

Hot Gas/Rework Station

Ink Coating & Handling

Machine Guards (Custom Made)

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Micro Blaster Accessories

Micro Blasting Services

Pick & Place Systems

Printing Supplies &  Equipment

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solderability Testers

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Storage Cabinets (Dry / Nitrogen & Custom)

Surface Abrader

Tapes (Wafer, Dicing & Protective)

Tape / Film Applicator / Mounters

UV Curing Control & Test Equipment

UV Curing Equipment

Wafer Backlap Applicator

Wire Bonding Wedges

 

 

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PRODUCTS BY MANUFACTURER

 

Please click on links to open page information. if you cannot find what you are looking for , please contact us.

 

AB MANUFACTURING - Mask & Substrate alignment & Exposure Systems

Alignment Module

Mask Aligner

AI TECHNOLOGY (AIT) - Epoxies, Adhesives, Specialist Dicing /Sawing tapes & Thermal Greases

COMCO INC - Micro-abrasive blasting equipment

AF10 Accuflo Abrasive Blaster

Accessories

AD5100 Air Dryer

AD5300 Air Dryer

CTR100 Pro Center combined dust collector and blast cabinet

DF1200 Directflo (old)

DF1400 Directflo

LA1500 Standard Lathe - Standard Abrasive Lathe

LA3200 Advanced Micro Abrasive Lathe

LA3250 Advanced Micro Abrasive Lathe

MB4320-1 Magnifier 

MB1000 Microblaster

MB1002 Dual Tank Microblaster

MB1570 Wire Stripping Ring nozzle

Media & Powders

Nozzles

PF2000 Powerflo (old)

PF2400 Powerflo

WS6000 Clearview blast cabinet

WS2200 Standard blast cabinet

WS2280 'Big Box' blast cabinet

DISPENSING TECHNOLOGIES INTERNATIONAL CORP (DTIC) - Dispensing Equipment

EZ-Mix Hi hand held dispensing system

EZ-Mix FR meter mix dispenser

Microhead micro-adhesive dispenser

MINI-SYSTEMS INC (MSI) Thin Film & Thick Film chip resistors & Electronic Packages

 

Thin Film Components:

EMSBC Series - Back Contact (1 Bond Pad)

KITS - WATF Series - Surface Mount Chips

KITS MSTF & MSCC Series - Surface Mount Resistor Networks

MRCN Series - RC Networks

MSAT Series Thin Film Chip Attenuators

MSBC Series - Back Contact (2 Bond Pads)

MSBIN Binary Thin Film Chip Capacitors

MSCC Thin Film MOS Chip Capacitors

MSDR 3 Series - Dual Resistor Networks 

MSHR Series - Ultra High Value

MSIR Series - Dual Isolated Resistor Networks

MSJC & WAJC Series - Chip Jumpers

MSMR1 Series - 0.012" x 0.009"

MSMT 116 Series - Log Resistors

MSMT 117, 125 Series - Multi-Tap Resistors

MSMW Series Microwave Chip Resistors

MSPR1 Series - High Power

MSRA, MSRB, MSRC Series - Resistor Arrays

MSSR3 Series - Laser Codeable

MSTF1 Series - 0.015" x 0.015"

MSTF2 Series - 0.020" x 0.020"

MSTF3 Series - 0.030" x 0.030"

MSTF35 Series - 0.035" x0.035"

MSTF4 / MSTF6 / MSDR4 - High Megohm

PTSM / PTWB Series - 5 Watt Power Terminators

WATF Series - Surface mount

CUSTOM PATTERNED Substrates

 

 

Thick Film Components:

Thick Film Resistors

Jumpers

Mounting Pads

MSA Attenuator Series Wire & Ribbon Bondable

QPL - MIL-PRF-55342 Qualified Parts

MSR Series Wire Bondable or Flip-Chip Surface Mount Chip Resistors

Surfacemount Resistor Networks

WA Series Surface Mount Chip Resistors

 

Electronic Packages

PHILTEC - SAFE-T-STAIN & DIAMOND WHEEL DRESSING SOLUTION

Safe-T-Stains DSS1 to DSS-5

DWD Diamond Wheel Dressing Solutions

PURCO2 - CO2 based cleaning systems

PS6000 Powersno CO2 Snow Blaster

PS8000-XT Powersno XT  Precision CO2 Cleaning System

CS6000 Clean Station CO2 Cleaning System

Powersno XP SnoShearTM & SnoPulseTM Spray cleaning technology

 

ROBOTIC PROCESS SYSTEMS (RPS) Solderability Testers, Test equipment & Solder Pots

Anthem Lead Tinning System (wave solder & dynamic solder pot soldering)

6 SIGMA Solderability Wetting Balance Tester (now discontinued) 

202TL Automatic Solderability Test System

202TL-2 Twin Bath Automatic Solderability Test System

ST2 & STD2 Steam Ager

Solder Pots - Static and Dynamic

SMALL PRECISION TOOLS (SPT) Bonding Capillaries, Die Pickup tools, Bonding Wedges, Epoxy stamping & Dispensing tools and Custom bonding tool solutions

 

SOLITEC WP wafer spinners, coaters & developers

Spares & Service Support

UV PROCESS SUPPLY for all your UV requirements from a box of gloves to a complete system 

WAYCON Nitrogen Dry Storage Cabinets

Dry Storage Cabinets & Dessicant Cabinets

Custom Machine Guards & Shields

 

 

 

 

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

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