WA SERIES THICK FILM CHIP RESISTORS

WA Series Wrap Around

HW Series Half-Wrap

Surface mount thick film resistors,, printed and fired on 96% alumina with a five sided wraparound termination, and a top conductor pad are offered in a variety of styles to fit a wide range of hybrid microelectronic and surface mount applications. Advanced processing techniques, and Hi-Rel construction assure optimum performance where TCR, VCR and operating power are critical factors. WA styles meet and exceed the qualification requirements of MIL-PRF-55342.

WA-SERIES WRAPAROUND Standard Termination Materials : Untinned - Palladium silver, Platinum Gold, Gold with no barrier metal and electrolytic Gold plating over Nickel barrier metal. Solder Tinned - Palladium silver, Platinum Gold, With or Without Nickel Barrier Metal. Standard Solder Sn62 - Other compositions available including high temperature and indium solders. Please contact us for more information. Data Sheet.

HW- SERIES HALF-WRAP Standard Termination Materials : Untinned - Palladium silver, Platinum Gold, Gold with no barrier metal and electrolytic Gold plating over Nickel barrier metal. Solder Tinned - Palladium silver, Platinum Gold, With or Without Nickel Barrier Metal. Standard Solder Sn62 - Other compositions available including high temperature and indium solders. Please contact us for more information. Data Sheet.

We offer a variety of high reliability thin film and thick film components from Mini-Systems Inc. Mini-Systems have the QPL MIL-PRF-55342 style parts including 'S'-Level failure rate qualified. Mini-Systems Package Division offer high performance, alumina / glass walled packages in flat pack, plug-in and surface mount configurations for microwave applications. Call us for more information and tell us what you need.