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THIN FILM CHIP RESISTORS

Epak Electronics Ltd offer the complete range of Mini-Systems Inc (MSI) Thin Film Resistors.

Thin film resistors are manufactured using sputtering technology to apply the resistive "film" and they are then etched using a process similar to making printed circuit boards. The the surface is coated with a photo-sensitive material, covered by a film, irradiated with ultraviolet light, and then the exposed photo-sensitive coating, and underlying thin film, are etched. Mini Systems use a laser trimming system to accurately manufacture the parts to the exact value required.

Depending on the series, typical values range upwards of 2 Ohms up to 1 Meg Ohm and tolerances range from 0.1% to 10%. The substrate metal is typically Alumina or Aluminum Nitride and with a range of termination pads from no solder to Indium and high temperature solders. All thin film components are RoHS compliant unless the part contains solder, in which case, we offer 2 types of lead-free solder. ISO 9001 Certified.

MSMR1 Series - 0.012" x 0.009"

MSTF1 Series - 0.015" x 0.015"

MSTF2 Series - 0.020" x 0.020"

MSTF3 Series - 0.030" x 0.030"

MSTF35 Series - 0.035" x0.035"

MSTF4 / MSTF6 / MSDR4 - High Megohm

MSTF Series - Non-Microwave

WATF Series - Surface mount

MSSR3 Series - Laser Codeable

MSHR Series - Ultra High Value

MSPR1 Series - High Power

PTSM / PTWB Series - 5 Watt Power Terminators

MSBC Series - Back Contact (2 Bond Pads)

EMSBC Series - Back Contact (1 Bond Pad)

MSI RoHS Information

All Thin Film components are RoHS compliant, unless part contains Solder, in which case, we offer 2 types of Lead-Free Solder.

03/09/2010 09:06