MSBC2 & EMSBC SERIES BACK CONTACT CHIP RESISTORS

MSBC 2 SERIES & EMSBC THIN FILM BACK CONTACT CHIP RESISTORS

MSBC-2

The MSBC series back contact resistor offers a space saving design in a .020" x .020" x .010" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the substrate. Wire bonding is made to the notched pad on top of the chip; the rectangular pad is a contact to the backside connection. MSBC's offer the high stability, low noise, and low T.C.R. of thin film while providing greater flexibility in hybrid designs.

The substrate and resistive film is Silicon and Tantalum nitride. Values from 5 ohm to 1.5 Meg ohm available. Tolerance range from 0.05% to 20% available (depending on value). Aluminum pads are standard.

Data Sheet.

EMSBC

The NEW EMSBC series back contact resistor offers a space saving design in a .020" x .020" x .010" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the substrate. Wire bonding is made to the notched pad on top of the chip; the rectangular pad is a contact to the backside connection. MSBC's offer the high stability, low noise, and low T.C.R. of thin film while providing greater flexibility in hybrid designs.

Excellent for use in vision recognition systems.

Data Sheet.

We offer a variety of high reliability thin film and thick film components from Mini-Systems Inc. Mini-Systems have the QPL MIL-PRF-55342 style parts including 'S'-Level failure rate qualified. Mini-Systems Package Division offer high performance, alumina / glass walled packages in flat pack, plug-in and surface mount configurations for microwave applications. Call us for more information and tell us what you need.

13/08/2008 14:34

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