 BINARY MOS STYLE CHIP CAPACITORS
MSBIN-1
MSBIN-2 MSBIN-3 MSBIN-4 SERIES
Designed
to established industry standards. BINARY capacitors offer great flexibility
in capacitance value selection for Hybrid and Microwave
circuits.
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MSBIN-1
.019" x .030" x .010" Binary MOS style chip capacitor. The substrate is Silicon with dielectric of
silicon oxide. Total capacitance value is 3.75pF, individual
capacitance values are 0.25pF, 0.50pF, 1.0pF and 2.0pF. Tolerance of
25% available and gold bond pads are standard with an
option of aluminum.
Data Sheet.
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MSBIN-2
.019" x .030" x .010" Binary
MOS style chip capacitor. The substrate is Silicon with dielectric of
silicon oxide. Total capacitance value is 15pF, individual capacitance
values are 1.0pF, 2.0pF, 4.0pF and 8.0pF. Tolerances of 10% and 20%
available and gold bond pads are standard with an
option of aluminum.
Data Sheet. |
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MSBIN-3
.019" x .048" x .010" Binary
MOS style chip capacitor. The substrate is Silicon with dielectric of
silicon oxide. Total capacitance value is 31pF, individual capacitance
values are 1.0pF, 2.0pF, 4.0pF 8.0pF and 16pF. Tolerances of 10% and
20% available and gold bond pads are standard with an
option of aluminum.
Data Sheet. |
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MSBIN-4
.044" x .044" x .010" Binary
MOS style chip capacitor. The substrate is Silicon with dielectric of
silicon oxide. Total capacitance value is 93pF, individual capacitance
values are 3.0pF, 6.0pF, 12.0pF 24.0pF and 48pF. Tolerances of 10% and
20% available and gold bond pads are standard with an
option of aluminum.
Data Sheet. |
We offer a
variety of high reliability thin film and thick film components from
Mini-Systems Inc. Mini-Systems have the QPL MIL-PRF-55342 style parts
including 'S'-Level failure rate qualified. Mini-Systems Package Division
offer high performance, alumina / glass
walled packages in flat pack, plug-in and surface mount
configurations for microwave applications. Call us for more
information and tell us what you need.
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