MILLFIELD ESTATE, CHARD, SOMERSET. TA20 2BB. TEL : 01460 61791 FAX : 01460 67833
NEW Member to the Model 860 Bonder Range
Epak Electronics are proud to announce Semiconductor Equipment Corp’s newest member to their bonder family, the Model 860 Eagle Omni Bonder
Semiconductor Equipment Corporation's New Model 860 Eagle is a multi-use system, which can be configured to bond laser diodes, flip chip and eutectic bonded die. The new versatile system designs will be ideal for applications involving plate, solder, polymer, or gold stud bumping. Attachment can be made using solder reflow, adhesive or thermocompression.
The Eagle's basic platform includes an extend-retract cube beam splitter viewing system with illuminator and precision servo motor-driven Z motion with closed loop temperature control. Users may select from two closed loop bond load control ranges. Options include a dual nozzle gas heating system, a thermosonic bond head and a servo motor controlled ultra fine linear scrub bond head with voice coil and preform tool.
Standard Features of Model 860 Eagle
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Two
Bond Ranges
Precision servo-motor driven Z motion with the option of choosing from 2 closed loop bond control ranges from 5 grams to 10 kilograms; your choice of one range per configuration. Viewing System Extend-retract cube beam splitter viewing system with fiber optic illuminators including color CCD video camera; 14" monitor with a magnification range of 20X to 200X.. Operator Settings Simplified flat panel display for viewing the cycle and prompting operator action via joystick as process proceeds, providing time and temperature readouts. Internal PC for controlling bond load, temperature profiles, process times and machine cycle. Hard drive and 3.5" floppy disk drive included. Workstage (3 options available) Micrometer adjusted workstage holder for movement over either a small or large open area in X, Y and theta during pickup; easily detachable, modular workstage not included – choose from a 1-1/2" rapid (to 400 degrees C) heat-up stage for small substrates, a 4" preset fixed stage (to maximum of 350 degrees C) for large area heating, or a cold, unheated 4" stage.
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Workchuck
4" square work chuck with vacuum hold down for either fixed heat or unheated stage or a 3/4" square flat vacuum chuck for rapid heat-up; custom work chucks available.
Bonding
Thermocompression bond head with fixed pick-up tool
for operation from cold temperature up to 250 degrees C; includes temperature
ramping feature (for adhesive applications) during placement process.
Options for Model 860 Eagle
For Flip Chip applications:
* Thermocompression bond head with temperatures up to 250 degrees C operation.
* Heated stage with closed loop temperature controls, operation up to 350 degrees C.
* Dual nozzle hot gas spot heating system for localized heating.
* Choice of motorized tray or manual tray and doctor blade for flux or adhesive dipping.
For bonding edge emitting Laser Diodes:
* Rapid heat-up stage.
* Dual tool bond head consisting of one heated die tool and one preform tool.
* Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.
* Direct viewing stereo zoom microscope with 10X eyepieces on pivoting mount with fiber optic illuminators.
* Single nozzle hot gas heating system for localized heating.
Eutectic die bonding :
* Heated stage with closed loop temperature controls, operation up to 350 degrees C.
* Dual tool bond head consisting of one heated die tool and one preform tool.
* Dual nozzle hot gas spot heating system for localized heating.
* Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.
Specifications for Model 860 Eagle
* +/- 5 micron placement accuracy.
* Die sizes from 0.006" square to 1.00"
* Four 2"X2" or 4"X4" waffle pack pick-up stage.
* Workstage options include 4"X4" cold stage, 4"X4" heated stage or 3/4" rapid heat-up stage.
* Bond load ranges from 5 grams to 10 kilograms.
SMALLEST MINI-SYSTEMS RESISTOR MSTF-1 SERIES (11.01.06)
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The NEW MSTF 1 series resistor from Mini-Systems Inc offers a space saving design in a .015" x 0.015" case size. Available in a wide range of substrates including Alumina, Glass, Quartz and Silicon and a resistive film option of Nichrome or Tantalum Nitride. Values range from 2V to 300 KV depending on the substrate and tolerances from 0.1% to 10 % are available. Options for +/-5, 10, 25, 50 & 100 ppm/°C, Aluminum or Gold bond pads and Gold Backside can all be specified. |
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CURE TUNNEL
(10.01.06)
Tremendous 3D, High Speed Curing Power
CON-TROL-CURE’S Cure Tunnel™ is a 4-lamp, 400W/in 3D curing system. The innovative 360° curing zone provides exceptional curing capabilities while maintaining the competitive pricing that CON-TROL-CURE is known for. Utilizing its patented housing geometry, the Cure Tunnel™ is perfectly designed for high-speed,
3-D curing.
Power and Performance
The 4 asymmetrically mounted lamps in the Cure Tunnel™ provide curing power to the substrate utilizing a unique and efficient layout. Each of the 400W/in lamp units is fixed at a 45° angle. This exclusive configuration, combined with the patented housing, enables this unit to outperform systems retailing at nearly 2-1/2 times the price! An exceptional cure is achieved by the 4-400W/in lamps of the Cure Tunnel™, while comparable systems require a configuration of 6-600W/in lamps. The Cure Tunnel™ even has power to spare. A current customer has exhibited satisfactory cure while running their system at only half-power (200W/in).
Cooler Running
The dual lamp layout allows for greater air circulation, keeping the substrate significantly cooler than traditional lamp configurations. Recent performance tests verified that under normal operating conditions, these lamps impart minimal heat onto the substrate. A galvanized steel pipe curing at 350 ft/min left the Cure Tunnel™ with an exit temperature of 76°F. Such a dramatic reduction in temperature over comparable systems means heat sensitive substrates can be cured using the Cure Tunnel™.
CF1000 LED CURING SYSTEM
(10.01.06)
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The new, state-of-the-art CF1000 UV Curing System delivers the benefits of LED technology in a unique and convenient turn key system. This versatile machine is available in 3 different wavelengths (365nm, 395nm, 455nm) to meet almost any UV activated curing process. Despite its compact size, the CF1000 offers industrial strength curing with a large illumination area for high process throughput. The multi-head capability increases output power and provides multiple angles of illumination (up to three different LED Heads can be powered simultaneously). Independent channels allow only one controller to power the different LED heads/wavelengths simultaneously. |
Not limited by costly battery power or inconvenient charging, the robust thermal management system is suitable for continuous usage. An intuitive control panel makes the unit very easy-to-use and a footswitch control frees up both hands for work. A long LED cable allows for remote positioning and accepts domestic or international AC power. The “future-proof” controller has been designed to guarantee compatibility with LED technology as it advances toward new wavelengths and higher power levels.
specifications
Active Area: 1.9” Diameter
Head Size: 2.88”H x 3.0”W x 4.25”D
Cable length: 6’
Controller Size: 8”H x 5”W x 9”D
Power Supply: Input 115/230 VAC, 50-60 Hz
NOTE: Includes one 8” Mounting Post, one 6” Mounting Post, one Right Angle Clamp, one Footswitch and Safety Glasses
LED Lamp Heads
• 455nm, 4.6W
• 455nm, 6.9W
• 395nm, 3.6W
• 395nm, 5.4W
• 365nm, 1.8W
AIT Release NEW Uviversal & Custom Waffle Packs (03.01.06)
UV-releasing tacky plain waffle pack, anti-static, and high temperature use (>110ºC), deliverable within 1 week.
UV-releasing tacky layer may be removed and new tacky layer re-applied for recycle useage.
"Universal" for use with any size parts.
High temperature (>160ºC), anti-static, custom waffle-pack, deliverable in 3 weeks.
Lowest cost custom waffle pack for use below 60ºC and non-static sensitive parts, deliverable in 3 weeks.
Custom anti-static waffle pack for use below 60ºC, deliverable in 3 weeks.
We will be exhibiting at Medical Device Technology at the Birmingham NEC, 15th and 16th February, 2006. (29.11.05)
Medical Device Technology (MDT) 2006 is the UK’s only exhibition and conference for the medical device and in vitro diagnostic (IVD) manufacturing industry.
Constantly evolving, the 2006 event will showcase more exhibitors, more features and more opportunities for networking than ever before.
A ‘must-attend’ event if you design, manufacture or regulate finished medical devices and in vitro diagnostic (IVD) products.
Comco Lathe on the Cover of MD Magazine (28.10.05)
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Comco MicroBlaster is the Medical Design Machine of the Month
It’s not hard to see why a shot of the new Advanced Lathe caught the eye of Medical Design Magazine’s Art Director. It’ll be catching a lot of attention this month on the cover of Medical Design magazine.
The Comco MicroBlaster is the Medical Design Machine of the Month. Featured inside MD is an article on Comco’s microblasters: Stents in all their variations and materials are wonders of manufacturing. Lasers and exotic materials get most credit for the implant's manufacturing success. But another machine on stent production lines also deserves attention. It's a miniature sand blaster that works with a powder-like abrasive. The MicroBlaster from Comco Inc., Burbank,Calif.
See the full article at: http://www.medicaldesign.com/articles/ID/12607 See the magazine cover at: http://www.medicaldesign.com/MenuPages/menu_Articles.aspx?issue_id=3054
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CON-TROL-CURE® Wide Area Flood Curing Lamp (24.10.05)
The CON-TROL-CURE® Wide Area Flood Curing Lamp is a UV Process Supply exclusive and is ideal for UV curing an expansive area. Fitted with adjustable lamp holders, this new, large area UV Flood housing can accommodate lamps with a total power from 250W up to 1,000W. To read more about this product, please go to: http://www.uvprocess.com/shortcut/5.htm.
The Wide Area Flood Curing Lamp casts an even irradiance over a wide area. Placed at a distance of 3 feet from the material to be cured, the Wide Area Flood Curing Lamp projects an effective cure area of at least 5 feet by 5 feet. The lamp housing can sit on a floor and shine up onto a wall. It can also be mounted in almost any other position required, using your own stand and/or supports.
POTENTIAL CURING APPLICATIONS
• 3D objects
• Walls
• Automotive components
• Guitars
• And much more
CUSTOM MACHINE GUARDS & COVERS (14.09.05)
Waycon manufacture & provide bespoke screens and machine guards for the manufacturing industry as well as their traditional acrylic display and storage cabinets.
Since each machine requires a special screen design, call us and we would be delighted to discuss your screen requirements further.
Waycon can design and manufacture boxes, guarding and custom engineered acrylic solutions to suit your needs. Please contact us with your ideas.
NEW UV EB INTENSITY LABELS (13.09.05)
This photochromic intensity indicator is a reliable, low cost, simple, in-house method of monitoring UV intensity. When exposed to UV, the yellow labels undergo a gradual color change from yellow to blue that is directly related to the energy value received.
Made from the same exclusive material as the UV FastCheck Strips, the New UV Intensity Labels (N010-005) have the same color changing principle as the Strips, but they have only 1 color changing square. The New UV Intensity Labels have a sensitivity range that is 5 times greater than the product they have replaced, the old UV Intensity Labels (N010-001).
The dramatic improvements over the old Intensity Labels include:
• Much greater color shift
• More stable, repeatable and consistent color change
• Not subject to increasing color changes at elevated temperatures
The adhesive backed label is placed on a sample product or substrate and processed to proper cure rate. The color deviation can easily be measured with a densitometer or by comparing the colors to test labels created to known operating standards to determine lamp failure or processing inconsistency.
If used on a regular basis, they can detect equipment problems at an early enough stage to prevent lengthy shutdowns. Daily tests can easily indicate a step by step calibration for an accurate reference within each batch. The use of a Digital Tachometer can help insure repeatable results.
Suggested Use: the New Intensity Labels are especially useful in systems where other instruments are not practical, such as 3-D curing, web coating, container printing, medical sterilization, etc.
FEATURES:
• New UV Intensity Labels measure the entire UV spectrum
• Accurate visual determination of UV dose made possible
• Monitor UV dose in difficult-to-access curing environments
• Detect UV lamp degradation and equipment failures
• Provide the user with periodic assurance that their UV source is performing to expectations
• Greater rate of color change provides clearer, more precise UV dose determination
• Determine the dose profile in the 3D curing chambers or across wide webs to ensure even cure
• Measure the dose of sunlight in outdoor curing applications
• Evaluate and compare multiple UV light sources
SPECIFICATIONS:
• New UV Intensity Labels are available in packages of 990 labels (9 sheets of 110 labels per sheet.)
• New UV Intensity Labels Dimensions: ¾"H x 1"W (19mm x 25mm).
NEW UV FASTCHECK STRIPS (13.09.05)
UV FastCheck™ Strips are simple, reliable, and easy to use indicators of accumulated UV light dosage. They are the first product that can be used to determine levels of UV dose with a simple, visual inspection due to the 5 separate color changing zones. Each of the 5 zones begin to change color after a specific amount of UV dose has been received. First the "1" zone begins turning from yellow to blue. Then each subsequent color zone starts to change colors when its specific chemistry has received the proper amount of UV to activate its color change.
The versatility of this unique UV measurement tool allows users to measure a significant range of UV doses. FastCheck Strips measure UV doses from 0mJ/cm² to greater than 5,000mJ(5J)/cm². As well, due to their paper-thin profile and thermal stability, they can be used in all applications where a radiometer is not possible, including: Web printing, Sheet Fed printing, Exposure Verification of exposed products, 3-D curing, and personal UV exposure level testing.
The FastCheck Strips' clearly identifiable color change enables users to visually differentiate the dose differences. UV FastCheck Strips can be further coupled with a handheld colorimeter to measure the dose even more precisely.
As well, we have prepared a comparative dose chart for the FastCheck Strips (N010-003) so that each tested FastCheck Strip can be correlated to the millijoules of UV energy that each color pattern represents. NOTE: This chart is comprised of actual exposed FastCheck Strips.
Made from the same exclusive material, the New UV Intensity Labels (N010-005) have the same color changing principle as the Strips, but they have only 1 color changing square. Click here for more information.
FEATURES:
• FastCheck Strips measure the entire UV spectrum
• Accurate visual determination of UV dose made possible
• Monitor UV dose in difficult-to-access curing environments
• Detect UV lamp degradation and equipment failures
• Provide the user with periodic assurance that their UV source is performing to expectations
• Greater rate of color change provides clearer, more precise UV dose determination
• Determine the dose profile in the 3D curing chambers or across wide webs to ensure even cure
• Measure the dose of sunlight in outdoor curing applications
• Evaluate and compare multiple UV light sources
SPECIFICATIONS:
• UV FastCheck Strips are available in packages 200 Strips (10 sheets of 20 adhesive backed Strips per sheet)
• UV FastCheck Strips Dimensions: 1/2”H x 2-1/8”W (13mm x 54mm)
Model 360 UV Exposure System (13.09.05)
Revolutionary new design cures UV tapes quickly and uniformly, features an ultra long life light source and handles all size wafers up to 300mm.
The Model 360 UV exposure system needs no external ventilation and has a small 18” diameter footprint.
Model 360 Capabilities:
- Cures most UV tape in 30 seconds
- Digital timer counts down and gives audible signal when cycle is complete
- Has cover gas capability with purge timer
- Gas flow stops at end of cycle
- Light source has uniform output over 10,000 hours of operation
- Generates very little heat and no ozone
- Easy to operate. Virtually no training required
- No set-up required when changing wafer sizes
TFC9000 THIN FILM CALORIMETER - QUALIFY YOUR INKS, COATINGS & ADHESIVES (13.09.05)
Is it the Inks or is it the Lamps? Know for Sure with the Thin Film Calorimeter.
You need a radiometer to ensure the performance and curing effectiveness of your UV lamps. So, how do you ensure the same of your inks, coatings and adhesives? Up until now, it was mostly guesswork. If you had curing problems and had ruled out your UV lamps as the culprit, your next target was most likely your chemistry. CON-TROL-CURE’s Thin Film Calorimeter (TFC) allows you to quantitatively measure the curability of your inks, coatings and adhesives.
The TFC-9000™ qualifies your inks, coatings and adhesives curability and ensures that they are curing consistently, batch-to-batch. Now you can test the shelf life of stored inks and evaluate older inks to know conclusively if they still perform to your expectations. Less wasted material translates into greater savings and profits.
The TFC-9000 measures the exothermic heat reaction from a polymerizing sample through a highly sensitive sensor. It performs a rapid analysis of the incoming data to produce meaningful results. Once the green "start" button is selected, the curing and evaluation process commences:
• Temperature recording starts
• The UV LED lamp automatically turns on
• The sample is cured
• Peak temperature reaction from the cured sample is reached and displayed
• Once the temperature reaches 75% of the peak, the lamp automatically shuts off
Upon successful test completion, the TFC-9000 displays key measured test results as indicated in the LCD displays:
• Heat Flux
• Peak Value of Heat (in BTU’s)
• Total Test Time
• Slope of the Curve for "Time to Peak" vs. "Heat Generated"
• Current Temperature
• Total Heat (in BTU’s/Hour)
The TFC-9000 works as a stand-alone measurement system or can be connected to a computer through a serial port. The captured data can be exported and plotted to an Excel graph for quick and easy analysis.
Surprisingly, there is no analytical tool which can quantitatively characterize the photopolymerization rates of pigmented UV inks. Pigmented UV curable coatings typically have reduced photopolymerization rates because the pigments absorb and scatter incident UV radiation. As a consequence, the photoinitiator efficiency is decreased and application thickness is limited to thin-films. In addition, commercial UV curable inks consist of pigment dispersed in reactive oligomers. The resultant concentration of reactive groups is low and consequently small quantities of heat are released upon polymerization making characterization difficult.
Evaluating curing characteristics by using calorimetry is advantageous because measurements are not affected by crosslinking reactions and they offer direct measurement of the polymerization rate. A unique benefit of the TFC-9000™ is the ability to accurately measure a very small stimulus. This sensitivity, unavailable in much more expensive evaluation instruments, makes possible the quantitative analysis of photopolymerizable systems which evolve a small amount of heat. Direct implications of this phenomenon include characterization of films on the nano/micro size scale and thin pigmented UV curable ink formulations.
This instrument’s precision and high sensitivity allow it to record exotherm reactions on films as thin as 2 micrometers. With a high heat tolerance, the TFC-9000™ is ideal for heated sample testing. The sensor has an upper temperature limit of 400°F (205°C.)
Note: The system is sold complete with the UV LED lamp. If a different UV source is required, various UV lamp options are available for use with the TFC-9000 system.
SPECIFICATIONS:
Dimensions: 12”W x 11.25”L x 6.25”H (30.5 cm x 28.6 cm x 15.9cm)
System Weight: 14.5 lbs (2.83 kg)
Sensor Resistance: 300 Ohms (Approx.)
Sensor Lead Wires: 10’ (3.1m) Solid copper, teflon insulated
Nominal Sensitivity: 3.0 µV/Btu/Ft²-Hr
Max Rec’d Heat Flux: 30,000 Btu/Ft²Hr
Response Time: 0.6 sec
Temperature Limit: 400°F (205°C)
Thermal Capacitance:0.03 Btu per Ft²-°F
Thermal Resistance: 0.01 °F per Btu/Ft²-Hr
NEW P.I. CAPILLARY FROM SPT (13.09.05)The advancement in bonding technology and the market demand for faster, smaller and better product, again poses new challenges for the wire bonding process. The transition from fine-pitch (FP) to ultra fine-pitch (UFP) volume production, and the emergence of stacked die, multi-tier and low-K bonding has increased the level of difficulties in the wire bonding process with more yield loss due to lifted ball, wire shorts, etc.
In compliance with these new bonding requirements, SPT has embarked on an extensive study to develop a new generation and high-performance capillary. Designed with advanced process diagnostic tools, the new capillary design, known as the PI (Programmed Intelligence) capillary has been extensively tested in a variety of wire bonders and packages. In all tests, the PI capillary has demonstrated superior bonding performance with good repeatability and portability using a wide range of bonding platform.
Programmed Intelligence P.I. Capillary
The PI capillary was derived from a series of physical modeling and finite element analysis (FEA) studies to analyze the stress level at the tip and transition profile for different designs, as these are locations where breakage is most likely to occurs. An example of the analysis – in this case, for the PI design is as shown below. Among the options considered, the PI design showed the lowest overall stress. This result was validated through destructive test, which showed that the breaking load for the PI design is 7% higher as compared to other design option.
Data Source
Design A
Design B
PI Design
Stress @ Transition (x109 Pa)
Simulation
0.6632
0.5687
0.5417
Stress @ Tip (x1011 Pa)
Simulation
0.1269
0.1253
0.1167
Breakage load (gf)
Simulation
228
238
245
Figure 1: Correlation of the simulation data with the results of destructive test
Laser interferometry technique is also used to determine the optimum capillary profile through amplitude of vibration measurement along the overall profile of the capillary. In wire bonding, the vibration characteristics of the capillary is an important factor as its indicates the efficiency of the transfer of the ultrasonic energy from the bonding tool to the bond pad interface. Through the various design optimization, the PI design has shown to be more responsive to the bonding parameters, producing better bond integrity.
Amplitude of Vibration (nm)
Design A
Design B
PI Design
454
488
544
Figure 2: Laser interferometry test results
Based on the various simulation and diagnosis, the PI capillary design was conceived. Actual bonding responses were tested using standard QFP and BGA package for a 70um bond pad pitch (BPP). The PI capillary was shown to be more responsive to the bonding parameter producing better results on all the measures (ball size, ball shear and stitch pull). In contrast, other design options would require higher bond force and more ultrasonic power to achieve the same bond integrity. This observation correlated with the result from the laser interferometry test.
Readings
Design A
Design B
PI Design
Ball size (um) 25
52.6
53.3
53.8
Ball shear (gf) Standard deviation
Failure mode
25
24.4
1.41
Ball sheared
25.0
1.48
Ball sheared
25.7
1.33
Ball sheared
Stitch pull (gf) Standard deviation
Failure mode
25
7.32
100% Break
@ stitch
7.41
100% Break
@ stitch
7.54
100% Break
@ stitch
Figure 3: Average results from actual bonding responses
Today, the PI capillary has been qualified and used in volume production by major assembly houses for a broad range of bonding applications. Depending on the specific bonding application, the PI design can be used together with the any existing design feature, such as the DFX (for small ball large wire bonding), CSP (for short loop/low wire bonding, BSB (ball stitch on ball bonding), Infinity (extended tool life), etc. Indeed, the PI capillary has proved to be a new revolution in bonding solution.
CONSTANT AIR BLEED OPTION NOW AVAILABLE ON
ALL COMCO MICRO-ABRASIVE BLASTERS (13.09.05)Consistent operation of the MicroBlaster requires very clean, dry compressed air. This can be easily achieved with the proper dryer installed on the air line. A more difficult task is controlling
the environment where the blasting occurs. Often it can be very wet and dirty, as in the case of hypodermic needle production facilities. To keep the contamination from clogging the nozzles we have developed a Constant Air Bleed Option.
The constant air option functions alternately with the pinch valve. When the machine is turned on clean air immediately begins flowing to the nozzle. As soon as the abrasive stream is activated the bleed turns off. The constant flow of air out to the nozzle keeps contamination from plugging into the nozzle and restricting the abrasive flow.
For more information about the Constant Air Bleed Option, call us today.
Learn about integrating micro-abrasive blasting with needle grinding from John Perry of Popper Precision Instruments in this month's MPMN on-line at:
http://www.devicelink.com/mpmn/archive/05/07/016.html .
REPAIR & REFURBISHMENT (26/04/05)
Its not a new service we offer but for our new and old customers we can carry out inspection, repair and refurbishment for all the Comco machines at our headquarters in Chard, Somerset. Depending on the nature of the problem and parts needed we will carry out a thorough inspection and advise you of the condition of the essential parts for the machines operation. Before proceeding with any work we will consult you and request authorization to carry out work or return the machine with only a nominal inspection fee. We always endeavor to get machines repaired and turned around as quickly as possible.
Refurbishment is possible for machines that at first look beyond repair. The MB100 below has had a hard working life but despite the initial cosmetic condition which is the worst one we have seen to date, mechanically it was in relatively good condition. With a little TLC,a few hours labor, some paint and some spare parts we managed to transform the machine into one almost as good as new and it is now back in regular use at our customers site. Yes, it is actually the same machine.
BEFORE AFTER
Yes, it is actually the same machine!
UV LED CURE-ALL (18/04/05)
This amazing new lamp can simply perform in ways that current lamps cannot. In order to truly maximize the potential of this lamp technology, you need to forget all of your current assumptions in regards to how UV curing works. This lamp technology defies accepted UV curing limitations. It is simply doing what it should not be allowed to do. It's curing faster. It's power consumption is minimal. The mechanism of cure is operating beyond current standards, due to the fact that this lamp is 100% efficient.
UV curing without heat!
Heat sensitive substrates (films, foils, DVDs, CDs, etc.)
UV curing without radiometers!
Consistent lamp output for the first 50,000 hours!
UV curing without replacement lamps!
Keep your line running - no downtime!
APPLICATIONS: • Laminating Adhesive • 3-D Curing • Wire Marking • Silicone Release Lining • CD/DVD • Wire Tacking • Ink Jet • Wood Repair/Finishing • Contact Lenses • Narrow Web Flexo • Medical Assembly • Heat Sensitive Substrate Curing
New Epak 2005 CD-ROM Catalogue (18/04/05)
The latest update of the Epak Electronics CD Catalogue is now available. It features all of our product range, including data sheets and short video clips from our wide product range.
Please call or email us for your copy.
All Information and images are © copyright of Epak Electronics and our principle companies. No unauthorized duplication.
Click here to review the various bonding application and part number
recommendations applicable with the PI capillary
