MILLFIELD ESTATE, CHARD, SOMERSET. TA20 2BB. TEL : 01460 61791 FAX : 01460 67833
We offer a range of easy to use, manual, and semi-automatic pick and place systems from Semiconductor Equipment Corp (SEC). The BRAND NEW Model 830 manual pick and place system is designed as a low cost, general purpose system for die and surface mount components. Also available is the Model 850 designed for flip-chip placement system that can be used for simple or more complicated placement.
MODEL 830 MANUAL PICK AND PLACE SYSTEM
The Model 830 is an easy to use manual pick and place system designed for transferring die or other devices from either tape or carrier trays to any desired destination. The precision manual X-Y slide table offers 12" x 6" of travel. The Z motion pickup head is pneumatically controlled with semiautomatic movement for transferring die and other small devices. The pickup head is controlled by a footswitch to lower the tool to working height and return it home.
The system offers an accuracy of +/- 25 microns.
Four 2" x 2" waffle pack pick up stage.
Four inch square vacuum stage is standard (other sizes are available on request).
Consistent bond load.
Throughput of up to 400 placements an hour.
Optional Items include :
High intensity illuminators
Dual position pivoting head for epoxy dispensing
Stereo Zoom Microscope
Die ejector probe stage for picking die from tape mounted wafers
Die ejector grid assembly system (Model 4800) mounted to the X-Y slide table.
Pneumatic brakes for X-Y table movement.
Cross hair alignment system with intensity control.
This system is ideal for hybrid die bonding, die sorting to or from carriers, pre-form handling, and all surface mount applications. The system is designed to give the maximum operator comfort whilst achieving maximum throughput.
Call us for further details.
MODEL 850 FLIP CHIP PLACEMENT SYSTEM
The SEC model 850 is a semi-automatic placement system primarily designed for flip-chips, and low volume production and development projects. It is a very flexible system and can be used as an easy to use semi-automatic pick and place system featuring a +/- 12 micron accuracy. This system can also be given a variety of heated stage and hot gas jet module options that spot heats components for reflow or rework as pictured above.
The viewing system uses a cube beam viewer that allows a simultaneous picture of both the component and the board to facilitate inspection and to ensure correct alignment prior to placement.
SEC also offer the Model 430 hot gas module to add as a field upgrade for existing Model 850's and optional extra for new systems allows the 850 to become a flexible, and cost effective flip-chip placement and re-work system.
Call us for further details
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