WAFER & SUBSTRATE DICING, SAWING & PROTECTIVE TAPES

We offer a range of high quality wafer mount tape and applicators from Semiconductor Equipment Corp (SEC). For over 20 years SEC have set the standard for high quality semiconductor Dicing Tape. A variety of tapes are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer, and the ability to stretch without tearing.

SEC Tape for Semiconductor Wafer Dicing & Hybrid Substrate Sawing.

The tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. This makes a tough, high tear strength but flexible tape for extensive use for wafer sawing, scribing and expanding. The tape is available supplied in rolls or as sheets suitable for all automatic and manual wafer mounting systems.

There is a Semiconductor Equipment Tape that is perfect for your application. Also available is lint-free filter paper and Mylar film.

See below for further information on tape types and sizes.

Wafer, Dicing & Protective Tapes Data Sheet.

LOW TACK - BLUE

Specific uses - sawing wafers, with large die sizes. Adhesion is high enough to hold die firmly during sawing, but low tack enough for die to be easily removed by die bonders or pick and place equipment.

Part No. 18733 - X.XX -(X.XX Denotes Width i.e. 4.00 = 4")

Width	Length	Thickness
4"	660'	0.003"
5"	660'	.003"
6"	660'	0.003"
7"	660'	0.003"
8"	660'	0.003"
9"	660'	0.003"
10"	660'	0.003"
11"	660'	0.003"
12"	660'	0.003"

MEDIUM TACK - BLUE

Specific uses - Sawing silicon wafers with smallest die sizes. Adhesion level is slightly greater than Low Tack -Blue to more firmly hold die to tape but low enough to easily remove die in the next operation.

Part No. 18074 - X.XX -(X.XX Denotes Width i.e. 4.00 = 4")

Width	Length	Thickness
4"	660'	0.003"
5"	660'	0.003"
6"	660'	0.003"
7"	660'	0.003"
8"	660'	0.003"
9"	660'	0.003"
10"	660'	0.003"
11"	660'	0.003"
12"	660'	0.003"

LOW TACK - CLEAR

Specific uses - Sawing silicon wafers where a thicker tape than Low Tack - Blue is required with the same adhesion level.

Part No. 19161 - X.XX -(X.XX Denotes Width i.e. 4.00 = 4")

Width

Length

Thickness

4"

330'

0.004"

5"

330'

0.004"

6"

330'

0.004"

7"

330'

0.004"

8"

330'

0.004"

9"

330'

0.004"

10"

330'

0.004"

11"

330'

0.004"

12"

330'

0.004"

SQUARES

Specific uses - A handy way to dispense tape for users without tape handling equipment. Also ideal for use with interlocking rings. Available in Low & Medium Tack Blue, and Low Tack Clear. (Supplied in boxes of 1000).

Blue Low Tack Squares mounted on backing paper :

P/No.	Size	Thickness
18132-5.75	5.75 sq.	0.003"
18133-6.75	6.75 sq.	0.003"
18133-7.50	7.50 sq.	0.003"
19994-8.27	8.27 sq.	0.003"
18133-9.06	9.06 sq.	0.003"

Blue Medium Tack Squares mounted on backing paper :

P/No.	Size	Thickness
18131-5.75	5.75 sq.	0.003"
18551-7.50	7.50 sq.	0.003"
19995-8.27	8.27 sq.	0.003"
18551-9.06	9.06 sq.	0.003"

NON-ADHESIVE CLEAR

Available in squares only this flexible poly vinyl chloride with excellent clarity is tough and has high tear strength and elongation properties. Available on non-contaminating backing paper it is used extensively for wafer fracturing, expanding and surface protection. Wafers or die are mounted to the plastic by applying a low 65°C heat. (Supplied in boxes of 1000)

Clear Plastic Film With No Adhesive mounted on backing paper :

P/No.	Size	Thickness
13673-5.75	5.75 sq.	0.004"
18153-6.75	6.75 sq.	0.004"
18154-7.50	7.50 sq.	0.004"
18155-8.27	8.27 sq.	0.004"
18155-9.06	9.06 sq.	0.004"

Clear Plastic Film supplied in discs mounted on backing paper

P/No.	Diameter	Thickness
18152-2.43	2.43"	0.004"
18152-3.28	3.28"	0.004"
18152-4.40	4.40"	0.004"

Filter Paper - Lint free in discs (Supplied in boxes of 1000)

P/No.	Diameter
13822-3.00	3.00"
13822-4.00	4.00"
13822-5.00	5.00"

Mylar Film - in discs (Supplied in boxes of 1000)

P/No.	Diameter
13555-3.28	3.28"

UV Curable Dicing Tape

Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.

P/N 24213 Low Tack, expandable PVC, 80 um thick
P/N 24216 Extra High Tack, non-expandable Polyethylene, 90 um thick
P/N 24339 Super High Tack, expandable PVC, 85 um thick
our most popular UV tape
P/N 24351 Super High Tack, expandable Polyolefin, 170 um thick
great for dicing BGA & ceramic

High Purity Pressure Sensitive Expandable Tape with Liner

Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.
P/N 24202 Low Tack, 80 um thick
P/N 24203 Medium Tack, 80 um thick
P/N 24204 High Tack, 80 um thick
P/N 24205 Low Tack, stable over time, 75 um thick
P/N 24206 Medium Tack, stable over time, 75 um thick
P/N 24207 Low Tack, stable over time, 110 um thick
P/N 24208 Medium Tack, stable over time, 110 um thick
P/N 24209 Low Tack, 155 um thick
P/N 24211 High Tack, 155 um thick

17/10/2012 15:22