DIE BONDERS
Epak Electronics Ltd
offer an range of die bonders from Semiconductor Equipment
Corp (S.E.C.) and their range include a simple manual pick
and place bonder to high accuracy flip chip, laser diode
and eutectic bonders.
Model
860 Eagle Omni Bonder
A multi-use system which can be configured for bonding
laser diodes, flip chip and eutectic bonded die.
Model
850 Flip Chip Placement System
A versatile, semi-automatic placement system for flip
chips, chip scale devices and bare die.
Model
830 Manual Pick & Place System
Pick and Place surface mounted devices from carrier packs
onto pre-epoxied surfaces. Transfers die or other devices
from tape or carrier trays to any desired packages.
Optional epoxy dispensing or die eject systems can also be
integrated into the Model 830.
 Model
860 Eagle Eutectic Bonder
Model 850 Flip Chip
Bonder
Model 830 Pick &
Place Bonder
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