Semiconductor
Equipment Corp Model 4750 Die Ejector
system for traditional pin eject removal of die from wafer mounting tape.
Semiconductor
Equipment Corp Model 4800
Die Ejector system for easy and safe removal of fragile or traditional pin
eject removal of die from wafer mounting tape.
MODEL
4750
DIE EJECTOR
The
Model 4750 die ejector system from SEC allows quick and easy removal
of die from wafer mounting tape. It can be supplied as a stand alone
unit or can be integrated with regular or high speed bonders, pick
and place systems or die inspection equipment.
The
Model 4750 is adaptable to almost all die carrier ring or die
carrier plate systems. As the system only has one moving part the
maintenance and downtime for the 4750 is virtually zero.
The
system can be fitted with the following options to make the system
as flexible as possible :-
Projected
image cross hair alignment system.
B
& L stereo zoom microscope with 10X eyepieces and stationary arm.
Adaptor
to accommodate specific carrier rings.
Extra
ejector probe bushing and vacuum plate.
Spare
ejector probes.
