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DIE & PIN EJECT SYSTEMS

Semiconductor Equipment Corp Model 4750 Die Ejector system for traditional pin eject removal of die from wafer mounting tape.

Semiconductor Equipment Corp Model 4800 Die Ejector system for easy and safe removal of fragile or traditional pin eject removal of die from wafer mounting tape.

Die Ejector Pins for a wide range of bonders including AMI, Kaijo, ASM, Delvotec, Foton, ESEC, Alphasem, and Shinkawa. Other manufacturers are supported, just tell us what you need.

MODEL 4750 DIE EJECTOR

The Model 4750 die ejector system from SEC allows quick and easy removal of die from wafer mounting tape. It can be supplied as a stand alone unit or can be integrated with regular or high speed bonders, pick and place systems or die inspection equipment.

The Model 4750 is adaptable to almost all die carrier ring or die carrier plate systems. As the system only has one moving part the maintenance and downtime for the 4750 is virtually zero.

The system can be fitted with the following options to make the system as flexible as possible :-

Projected image cross hair alignment system.

B & L stereo zoom microscope with 10X eyepieces and stationary arm.

Adaptor to accommodate specific carrier rings.

Extra ejector probe bushing and vacuum plate.

Spare ejector probes.

Model 4750 Data Sheet.

MODEL 4800 DIE EJECTOR GRID SYSTEM

The Model 4800 die ejector grid system from SEC is specifically designed to allow die to be loosened quickly and safely from plastic wafer mounting tape. This eliminates the need for ejector pins or pokers which can break die as they are being ejected from the back on the tape.

A complete system comprises of the die ejector grid mounted to a combination warming plate and vacuum chamber, a temperature controller box, vacuum switch and an optional footswitch controller.

Model 4800 Data Sheet.

03/09/2010 09:06