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DIE & PIN EJECT SYSTEMS

Semiconductor Equipment Corp Model 4750 Die Ejector system for traditional pin eject removal of die from wafer mounting tape.

SEC Model 4800 Die Ejector Grid SystemSemiconductor Equipment Corp Model 4800 Die Ejector system for easy and safe removal of fragile or traditional pin eject removal of die from wafer mounting tape. 

Die Ejector Pins for a wide range of bonders including AMI, Kaijo, ASM, Delvotec, Foton, ESEC, Alphasem, and Shinkawa. Other manufacturers are supported, just tell us what you need. 


MODEL 4750 DIE EJECTOR

The Model 4750 die ejector system from SEC allows quick and easy removal of die from wafer mounting tape. It can be supplied as a stand alone unit or can be integrated with regular or high speed bonders, pick and place systems or die inspection equipment.

The Model 4750 is adaptable to almost all die carrier ring or die carrier plate systems. As the system only has one moving part the maintenance and downtime for the 4750 is virtually zero.

The system can be fitted with the following options to make the system as flexible as possible :-

    Projected image cross hair alignment system.

    B & L stereo zoom microscope with 10X eyepieces and stationary arm.

    Adaptor to accommodate specific carrier rings.

    Extra ejector probe bushing and vacuum plate.

    Spare ejector probes.

 

Model 4750 Data Sheet.


MODEL 4800 DIE EJECTOR GRID SYSTEM

The Model 4800 die ejector grid system from SEC is specifically designed to allow die to be loosened quickly and safely from plastic wafer mounting tape. This eliminates the need for ejector pins or pokers which can break die as they are being ejected from the back on the tape.

A complete system comprises of the die ejector grid mounted to a combination warming plate and vacuum chamber, a temperature controller box, vacuum switch and an optional footswitch controller.

SEC Model 4800 Die Ejector Grid System

Model 4800 Data Sheet.

 

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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