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HOT GAS & REWORK STATIONS

    We offer a range of systems and equipment from Semiconductor Equipment Corp (SEC) for component and board rework. The SEC Model 450 is a hot gas removal station for bonded die and SMD devices. Also available is the Model 430 hot gas jet module which can easily be integrated with existing equipment to provide pinpointed heat to 800 degrees C.

    The SEC Model 850 flip chip placement system can also be fitted with the rework module and used as a complete placement/rework station.

    Need to remove a conformal coating prior to re-work - click here to find out about the Comco micro-abrasive blasters.

    If you have any questions please contact us for further details.


MODEL 450 SMD/BONDED DIE HOT GAS REMOVAL STATION

The Model 450 Hot gas removal station from SEC is a valuable tool for removing surface mount components and bonded die from PC boards, hybrid microcircuits and packages.

All the process parameters are closely controlled as heated nitrogen flows through an interchangeable quartz nozzle to the selected device. An optional mechanical side-mounted device ejector can apply a precise amount of gentle pressure to loosen very small or closely spaced die. The entire cycle is accomplished without disturbing nearby components precisely and easily.

Options can include a Leica stereo zoom microscope with 10x eyepieces, illuminator, mounting brackets, and different work chuck configurations. The nozzles are available in many different sizes with and are either round or rectangular.

 

SEC Model 450 Quartz nozzles

Model 450 Data Sheet.


 MODEL 430 HOT GAS JET MODULE

The Model 430 hot gas jet module from SEC is an add on unit for production equipment such as flip chip bonders, wire bonders, and SMD rework stations for spot heating devices for reflow.

The Model 430 can deliver up to 800 degrees C of pinpoint localized high temperature heat through an interchangeable nozzle to the bonding or removal site.

The closed loop temperature control box and controlled gas flow delivery system can easily be integrated with the operation of your existing equipment.

Model 430 Data Sheet.

 

18/01/2012 03:50

EPAK
Latest  News:
 

06.07.2011

NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor

Lighter, brighter, cleaner and quieter.

09.03.2011

Custom Flex Circuit Abrader

We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.

21.10.2010

SA150 Video of our Surface Abrader added to our YouTube channel

09.08.2010

BV9000 Videos Added  of our Rectifier Beveller to our new YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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