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HOT GAS & REWORK STATIONS

    We offer a range of systems and equipment from Semiconductor Equipment Corp (SEC) for component and board rework. The SEC Model 450 is a hot gas removal station for bonded die and SMD devices. Also available is the Model 430 hot gas jet module which can easily be integrated with existing equipment to provide pinpointed heat to 800 degrees C.

    The SEC Model 850 flip chip placement system can also be fitted with the rework module and used as a complete placement/rework station.

    Need to remove a conformal coating prior to re-work - click here to find out about the Comco micro-abrasive blasters.

    If you have any questions please contact us for further details.


MODEL 450 SMD/BONDED DIE HOT GAS REMOVAL STATION

The Model 450 Hot gas removal station from SEC is a valuable tool for removing surface mount components and bonded die from PC boards, hybrid microcircuits and packages.

All the process parameters are closely controlled as heated nitrogen flows through an interchangeable quartz nozzle to the selected device. An optional mechanical side-mounted device ejector can apply a precise amount of gentle pressure to loosen very small or closely spaced die. The entire cycle is accomplished without disturbing nearby components precisely and easily.

Options can include a Leica stereo zoom microscope with 10x eyepieces, illuminator, mounting brackets, and different work chuck configurations. The nozzles are available in many different sizes with and are either round or rectangular.

 


 MODEL 430 HOT GAS JET MODULE

The Model 430 hot gas jet module from SEC is an add on unit for production equipment such as flip chip bonders, wire bonders, and SMD rework stations for spot heating devices for reflow.

The Model 430 can deliver up to 800 degrees C of pinpoint localised high temperature heat through an interchangeable nozzle to the bonding or removal site.

The closed loop temperature control box and controlled gas flow delivery system can easily be integrated with the operation of your existing equipment.

 

27/06/2008 09:38

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