HOT GAS & REWORK STATIONS
We
offer a range of systems and equipment from Semiconductor
Equipment Corp (SEC) for component
and board rework. The
SEC Model 450 is a hot gas removal station
for bonded die and SMD devices. Also available is the Model
430 hot gas jet module which can easily be integrated with
existing equipment to provide pinpointed heat to 800 degrees C.
The
SEC Model 850 flip chip placement system
can also be fitted with the rework module and used as a complete placement/rework station.
Need
to remove a conformal coating prior to re-work - click here
to find out about the Comco micro-abrasive blasters.
If
you have any questions please contact us for further details.
MODEL 450
SMD/BONDED DIE HOT GAS
REMOVAL STATION
The
Model 450 Hot gas removal station from SEC is a valuable tool for
removing surface mount components and bonded die from PC boards,
hybrid microcircuits and packages.
All
the process parameters are closely controlled as heated nitrogen
flows through an interchangeable quartz nozzle to the selected
device. An optional mechanical side-mounted device ejector can apply
a precise amount of gentle pressure to loosen very small or closely
spaced die. The entire cycle is accomplished without disturbing
nearby components precisely and easily.
Options
can include a Leica stereo zoom microscope with 10x eyepieces,
illuminator, mounting brackets, and different work chuck
configurations. The nozzles are available in many different sizes
with and are either round or rectangular.
MODEL
430
HOT GAS JET MODULE
The
Model 430 hot gas jet module from SEC is an add on unit for
production equipment such as flip chip bonders, wire bonders, and SMD
rework stations for spot heating devices for reflow.
The
Model 430 can deliver up to 800 degrees C of pinpoint localised high
temperature heat through an interchangeable nozzle to the bonding or
removal site.
The
closed loop temperature control box and controlled gas flow delivery
system can easily be integrated with the operation of your existing equipment.
|
