Links

MODEL 3200 & MODEL 3250 WAFER BACKLAP APPLICATOR

Applies Protective Tape to Your Wafer Prior to Backlapping

Eliminates bubbles between tape and wafer
Provides uniform tension between tape and wafer
Operates with backed and non-backed tape
Adjustable roller pressure
Cuts tape within .005 " of edge of wafer

Peeler Option
Peeler for removing backgrinding tape once the wafer has been thinned. This option includes
a roller assembly, vacuum chuck and tape dispenser. The peeler can be added to any
3200 or 3250.

Click Here for a video demonstration of the 3250

Click here for a Video of the Peeler option

Model 3200 / 3250 Data Sheet.

Step by Step Procedure, Model 3200 Back Lap Tape Applicator

Quickly, Easily and Uniformly Mounts Protective
Tape to Wafer for Back Lap Operation

	Step #1 Grasp tape from storage position. Pull over wafer mounting platen.
	Step #2 Affix tape to tensioner frame.
	Step #3 Roll tape with preset tension across wafer for bubble-free application.
	Step #4 Close cutter cover.
	Step #5 Separate tape from roll, using built-in slitter.
	Step #6 Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame.
	Step #7 Remove finished wafer assembly.

Features of Model 3200

Up to 6" wafer capability standard.
Trims tape to the edge of the wafer including the flats, within .005".
Manual tape feed.
Manual tape tensioner.
Compatible with standard or interleaved tape.
Vacuum stage wafer hold-down.
Built in cutter tape separation systems.
Captive roller assembly assures consistent wafer/film frame contact pressure.
Adjustable spring loaded platen for optimum contact pressure.
Manual.

Features of Model 3250

Four, five, six and eight inch wafer capability standard.
Trims tape to the edge of the wafer including the flats, within .005 ".
Manual tape feed.
Manual tape tensioner.
Compatible with standard or interleaved tape.
Vacuum stage wafer hold-down.
Built in cutter tape separation systems.
Captive roller assembly assures consistent wafer/film frame contact pressure.
Adjustable spring loaded platen for optimum contact pressure.
Manual.

Model 3250 Back Lap Tape Remover

Semiconductor Equipment Corp. has introduced a
back lap tape remover to compliment it’s Model 3250
Back Lap Tape Applicator giving it the ability to double
as both an applicator and remover. The tape applicator
applies back lapping tape to the top side of a wafer to
offer protection during the backside grinding process.
Once the wafer is thinned the tape is gently peeled off
the wafer while being held by a slip on vacuum chuck
that drops onto the tape applicator. The new system
works for all size wafers up to 200 mm.

Options for Model 3200 and 3250

Static Eliminator with power supply.
Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
De-Taper for removing backgrinding tape once the wafer has been thinned; which includes roller assembly carrier, vacuum chuck and tape dispenser.

Spare Parts for Model 3200 and 3250

Spare Blades, End Cut, P/N 19190
Spare Blades, Rotary, Wafer Trimmer

Specifications for Model 3200 and 3250

Weight:		25 lbs.
Height:		8"
Width:		14"
Length:		24"
Vacuum:		25 " H₂O

Model 3200 Data Sheet.

03/09/2010 09:06