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MODEL 3200 & MODEL 3250 WAFER
BACKLAP APPLICATOR
Applies Protective
Tape to Your Wafer Prior to Backlapping
- Eliminates bubbles between tape and wafer
- Provides uniform tension between tape and
wafer
- Operates with backed and non-backed tape
- Adjustable roller pressure
- Cuts tape within .005 " of edge of
wafer
Click
Here for a video demonstration
Quickly, Easily and
Uniformly Mounts Protective
Tape to Wafer for Back Lap Operation
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Step #1
Grasp tape from storage position. Pull over wafer mounting platen. |
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Step #2
Affix tape to tensioner frame. |
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Step #3
Roll tape with preset tension across wafer for bubble-free
application. |
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Step #4
Close cutter cover. |
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Step #5
Separate tape from roll, using built-in slitter. |
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Step #6
Using built-in fail-safe circular cutter, rotate handle in either
direction to trim tape away from tension frame. |
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Step #7
Remove finished wafer assembly. |
- Up to 6" wafer capability standard.
- Trims tape to the edge of the wafer
including the flats, within .005".
- Manual tape feed.
- Manual tape tensioner.
- Compatible with standard or interleaved
tape.
- Vacuum stage wafer hold-down.
- Built in cutter tape separation systems.
- Captive roller assembly assures
consistent wafer/film frame contact pressure.
- Adjustable spring loaded platen for
optimum contact pressure.
- Manual.
- Four, five, six and eight inch wafer
capability standard.
- Trims tape to the edge of the wafer
including the flats, within .005 ".
- Manual tape feed.
- Manual tape tensioner.
- Compatible with standard or interleaved
tape.
- Vacuum stage wafer hold-down.
- Built in cutter tape separation systems.
- Captive roller assembly assures
consistent wafer/film frame contact pressure.
- Adjustable spring loaded platen for
optimum contact pressure.
- Manual.
| Model
3250 Back Lap Tape Remover
Semiconductor Equipment
Corp. has introduced a
back lap tape remover to compliment it’s Model 3250
Back Lap Tape Applicator giving it the ability to double
as both an applicator and remover. The tape applicator
applies back lapping tape to the top side of a wafer to
offer protection during the backside grinding process.
Once the wafer is thinned the tape is gently peeled off
the wafer while being held by a slip on vacuum chuck
that drops onto the tape applicator. The new system
works for all size wafers up to 200 mm.
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- Static Eliminator with power
supply.
- Heated Blade Assembly. Heats
cutting blade to reduce friction when cutting particular types of
back lapping tapes. Heats to 75 degrees C.
- De-Taper for removing
backgrinding tape once the wafer has been thinned; which includes
roller assembly carrier, vacuum chuck and tape dispenser.
- Spare Blades, End Cut, P/N 19190
- Spare Blades, Rotary, Wafer Trimmer
| Weight: |
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25 lbs. |
| Height: |
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8" |
| Width: |
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14" |
| Length: |
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24" |
| Vacuum: |
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25 " H2O |
Model 3200 Data Sheet.
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27/06/2008 09:38
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& Thick Film Resistors - Electronic Packages - Dispensing
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