The Model 830 is a general
purpose pick and place system for die and surface mount components. The
830 offers manually or pneumatically controlled Z motion with semiautomatic
vacuum pickup tool movement for transferring die and other small devices from
tape or carrier trays to packages. A footswitch option controls the
pick - up head to lower the pickup tool to working height and return it home.
Open frame design assures full visiblilty and complete access of all system
components. Operator friendly - takes less than two minutes to learn to
operate. Epoxy die bonding capability can be easily added. The
830 works with any tape - mounted die removal system, including S.E.C.'s
Model 4800 heated tape expanding die ejector grid featuring a grid plate that
can be machined with one of two different pyramid pitches.
Click
Here for a video demonstration
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Plus or minus 25 micron placement
accuracy.
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Four 2" X 2" waffle pack
pickup stage available.
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Four inch square vacuum stage
standard (optional sizes available).
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Consistent bond load.
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Throughput - up to 400 placements
per hour.
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Dimensions:
26" W X 18" D X 18" H
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Weight:
35 lbs.
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Power:
120 VAC 1 amp or 220 VAC 1 amp
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Vacuum:
20" Hg
Options
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Die tray pedestal capable of holding
up to four 2" X 2" waffle packs.
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Semiautomatic Z motion.
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Flat vacuum chuck capable of holding
up to four 2" X 2" waffle packs.
-
Stereo zoom microscope and/or
projected image cross hair system.
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High intensity illuminators.
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Dual position pivoting head for
epoxy dispensing.
Model 830 Data Sheet.
