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MODEL 850 SEMI-AUTOMATIC FLIP CHIP
BONDER
Semiconductor Equipment
Corporationīs Model 850 is a versatile, semi-automatic placement system for
flip chips, chip scale devices and bare die. The system is intended for low
volume production and development projects requiring accuracies of +/- 12
microns. A typical application consists of a cycle in which devices are
picked up from a waffle pack, dipped into flux and then placed on a
substrate.
An optional heated stage (Model
855) is available. An additional option, SECīs Model
430 Hot Gas Jet Module can be integrated to operate on the Model 850 as a
spot heating source for airflow.

Color Video System
A motorized zoom lens allows the operator to optimize viewing with its
standard range of 10x to 100x. Other ranges are available.
Fiber Optic Illuminators
The system has two separate fiber optic ring light illuminators with separate
controls for each, one illuminating the die and the other illuminating the
substrate.
Micrometer Adjusted Stage
A micrometer stage is used to adjust X, Y, and Theta to move the substrate
into exact alignment with the die. A 4 " square vacuum chuck is
provided.
Sliding Table with Brakes
The system has a sliding table which has a 5 " x 13 " travel. Table
movement is controlled by a joystick. Pneumatic brakes lock the table in
position.
SEC Model 430 Hot Gas
Spot Heater (optional)
The Model 430 Hot Gas Jet Module uses heated gas to heat a single die to
reflow. Its closed loop temperature control and gas flow control are
integrated with the operation of the Model 850. This unit may be purchased as
a field upgrade.
SEC Model 855 Heated Stage
(optional)
The heated stage is capable of 250 š C operation. It incorporates a separate
control box with its own closed loop temperature controls. This unit may be
purchased as a field upgrade.
Fluxing Station (optional)
The system includes a fluxing tray to dip the die into flux or adhesive prior
to placement. The fluxing station can be added as a field upgrade.
Illustrated Features:

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| A flux tray and doctor
blade are used to apply a controlled and uniform thickness of flux. |
Die are picked up from
waffle packs. |
SEC's Model 430 Hot Gas Jet
Module deliver heated gas to the die in order to reflow a single die
without affecting nearby components. |
Model 850 Semi-automatic Flip Chip Placement System
has the following standard features:
- Manual X, Y sliding table with 13 " x 5
" of travel and ergonomic control arm.
- Micrometer adjusted X,Y and Theta stage for fine
alignment.
- Pneumatic brakes for XY table movement.
- 4" square flat vacuum chuck.
- Cube beam splitter vision system with simultaneous
view of die and substrate patterns for alignment.
- Motorized zoom lens, color camera and TV monitor.
- Four independent fiber optic ring light
illuminators. Two for die and two for substrate illumination.
- Viewer automatically retracts when Z motion is
activated.
- Automatic Z motion with pneumatic bond control
panel adjusted.
- Pick up tool.
- Set up kit.
- Manual.
- Die tray pedestal capable of holding four 2"
square die trays.
- Fluxing Station included.
- Pedestal with micrometer leveling.
- Removable flux tray.
- Hand held flux doctor blade.
- Heated 4 " x 4 " workstage with control
box, includes temperature controller, power switch and fuses. Temperature
up to 225 š C.
- S.E.C. Model
430 Hot Gas Jet Module, including the following standard features:
- Hot gas jet which directs up to 800 š C
heated gas through an interchangeable quartz to a specific area.
- Voltage proportioning temperature controller
for closed loop control of the hot gas temperature.
- Adjustable gas flow with indicator.
- Round or rectangular nozzles are available in
a variety of sizes. One standard .060 I.D. nozzle comes with the
system.
- General purpose mounting bracket to facilitate
mounting gas jet assembly to your equipment.
- Footswitch controlled.
- Three foot long interconnect cable between
control module and gas jet assembly.
- Safety interlocked to prevent heater burnout.
- Manual.
- +/- 12 micron placement accuracy.
- Four 2x2 waffle pack pick-up stage.
- 4" square vacuum stage standard
(optional sizes available).
- Bond load - 30 to 200 grams standard (10kg
optional).
- Throughput - up to 200 placements per
hour.
| Utilities |
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| Compressed air: |
60 psi |
| Vacuum: |
20 " Hg |
| Power: |
110V, 3 amp - 60 Hz
220V, 15 amp - 50 Hz |
| Size: |
39 " W x 30 " D x
24 " H |
| Weight: |
System - 185 lbs; Shipping -
225 lbs. |
Model 850 Data Sheet.
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13/08/2008 14:34
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