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SEC MODEL 860 EAGLE
SEMI-AUTOMATIC DIE BONDER
Semiconductor Equipment Corporation's New
Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and
low volume production. Applications include solder and gold bumped flip
chip, eutectic bonding including laser diodes and bars and epoxy bonding.
Some of the process capabilities that support these applications are
ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The
new system is designed for maximum versatility and ease of operation.
The Eagle's base platform includes a
retractable cube beam splitter viewing system with LED lighting, precision
servo-driven Z motion with closed loop bond load control, closed loop
temperature controls for head, stage and spot heating and Windows XP Pro
operating system. Various standard heads and stages are available.
.
Head
Designs
-
Precision
servo-driven Z motion with bond load ranges of 10 grams to 10 kilograms
controlled by closed loop system. Head die tools include flat face or
collet design for specific applications. Head options include:
-
4
Single Tool Head with bond loads to 10 KG and heating to 300 degrees C.
Linear Scrub is an option.
-
4
Dual Tool Head with pivoting die tool and preform tool with bond loads to
2 KG and heating to 250 degrees C. Allows preform and die placement in one
cycle without tool switch-over. Pin transfer tool can also be used for
adhesive. Linear Scrub is an option.
-
4
Ultrasonic Head with loads to 3 KG.
-
4
Pulsed Thermal Bond Head with loads to 10 KG and ramping of 100 degrees C
per second to maximum of 450 degrees C.
Workstage
Designs
-
Micrometer
adjusted workstage for alignment in X, Y and theta. Workchucks have vacuum
hold-down or mechanical clamps. Custom workchucks available.
-
4
¾” Rapid Heat Cycle Workstage with quick heat up ramping to 450 degrees
C and heated cover gas manifold with separate temperature control. Cooling
gas manifold optional.
-
4
2” x 2” Heated Workstage with maximum temperature of 450 degrees C and
heated cover gas manifold.
-
4
4” x 4” Heated Workstage with maximum temperature to 350 degrees C.
-
4
4” x 4” Unheated Workstage with aluminum workchuck.
Viewing System
-
Retractable
cube beam splitter vision system features a 12x zoom lens, digital camera,
image capture, LED array lighting, electronic crosshair and a 17” LCD
display.
-
4
Direct View System option consists of stereo zoom microscope with 10X
eyepieces, pivot mounting and ring light illumination. Allows operator to
observe bonding process.
-
4
Motorized Viewer option provides 5/8” travel from center in X and Y to
facilitate alignment of large devices at high magnification.
Computer Control
-
Computer
with Windows XP operating system, CD drive, floppy drive, keyboard, mouse
and 17” LCD display. Improved machine control software uses macros to
set-up and save machine processes.
For Flip Chip
applications:
- Thermocompression bond head with
temperatures up to 250 degrees C operation.
- Heated stage with closed loop temperature
controls, operation up to 350 degrees C.
- Dual nozzle hot gas spot heating system
for localized heating.
- Choice of motorized tray or manual tray
and doctor blade for flux or adhesive dipping.
For bonding edge
emitting Laser Diodes:
- Rapid heat-up stage.
- Dual tool bond head consisting of one
heated die tool and one preform tool.
- Servo-controlled ultra fine linear scrub
bond head with voice coil and preform tool for < 250 degrees C
operation; extremely repeatable operation returning to starting point
within plus or minus 5 microns.
- Direct viewing stereo zoom microscope
with 10X eyepieces on pivoting mount with fiber optic illuminators.
- Single nozzle hot gas heating system for
localized heating.
Eutectic die
bonding :
- Heated stage with closed loop temperature
controls, operation up to 350 degrees C.
- Dual tool bond head consisting of one
heated die tool and one preform tool.
- Dual nozzle hot gas spot heating system
for localized heating.
- Servo-controlled ultra fine linear scrub
bond head with voice coil and preform tool for < 250 degrees C
operation; extremely repeatable operation returning to starting point
within plus or minus 5 microns.
- +/- 5 micron placement accuracy.
- Die sizes from 0.006" square
to 1.00"
- Four 2"X2" or
4"X4" waffle pack pick-up stage.
- Workstage options include
4"X4" cold stage, 4"X4" heated stage or
3/4" rapid heat-up stage.
- Bond load ranges from 5 grams to
10 kilograms.
- Throughput - up to 200 placements
per hour.
| Utilities |
|
| Compressed air: |
60 psi |
| Vacuum: |
20 " Hg |
| Cover Gas |
40 psi |
| Power: |
115V, 10 amp - 50-60
Hz
220V, 15 amp - 50-60 Hz |
| Size: |
40 " W x 36
" D x 36 " H |
| Weight: |
System - 500 lbs;
Shipping - 600 lbs. |
Model 860 Data Sheet.
03/09/2010 09:06
|
|