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WAFER DICING / SAWING / PROTECTIVE TAPES & SPECIALTY TAPES

For nearly 30 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer, and the ability to stretch without tearing.

There is a Semiconductor Equipment Tape that
is Perfect for Your Application

Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.

Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape.

Standard Dicing Tape SEC's most popular and economical electronic grade dicing tape.
	Blue Low Tack Rolls P/N 18733	Thickness 75 um / .003” Length 200 M / 660’
	Blue Medium Tack Rolls P/N 18074	Thickness 75 um / .003” Length 200 M / 660’
	Thick Clear Low Tack Rolls P/N 24353 NEW	Thickness 120 um / .0047" NEW Length 100 M / 330'
	Thick Clear Medium Tack Rolls P/N 24374 NEW	Thickness 120 um / .0047" NEW Length 100 M / 330'
	Clear Low Tack Rolls P/N 19161	Thickness 100 um / .004” Length 100 M & 200 M / 330’ & 660’
	Squares	All the above tapes are available in precut squares mounted on release paper. Standard sizes are 5.75” and 7.50”. Custom sizes are available.
	Inkjet Cover Tape	Blue tape in widths and adhesion levels designed for Inkjet cover tape

Low Tack - Blue

Specific Uses - Sawing wafers with larger die sizes. Adhesion is high enough to hold die firmly during sawing, but low enough for die to be easily removed by die bonders or pick & place equipment.

Medium Tack - Blue

Specific Uses - Sawing silicon wafers with smaller die sizes. Adhesion level is slightly greater than Low Tack-Blue to more firmly hold die to tape but low enough to easily remove die in the next operation.

Thick Low Tack - Clear

Specific Uses - Harder to cut materials generally require thicker saw blades and will require thicker tape. Same adhesion level as Low Tack Blue.

Thick Medium Tack - Clear

Specific Uses - Harder to cut materials generally require thicker saw blades and will require thicker tape. Same adhesion level as Medium Tack Blue.

Low Tack - Clear

Specific Uses - Sawing silicon wafers where a thicker tape than Low Tack-Blue is required with the same adhesion level.

Squares

Specific Uses - A handy way to dispense tape for users without tape handling equipment. Also ideal for use with interlocking rings.

Inkjet Cover Tape

Specific Uses - applied to seal the ink cartridge against ink leakage during storage and transportation.

High Purity Pressure Sensitive Expandable Tape with Liner

Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.
P/N 24202 Low Tack, 80 um thick
P/N 24203 Medium Tack, 80 um thick
P/N 24204 High Tack, 80 um thick
P/N 24205 Low Tack, stable over time, 75 um thick
P/N 24206 Medium Tack, stable over time, 75 um thick
P/N 24207 Low Tack, stable over time, 110 um thick
P/N 24208 Medium Tack, stable over time, 110 um thick
P/N 24209 Low Tack, 155 um thick
P/N 24211 High Tack, 155 um thick

UV Curable Dicing Tape

Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.
P/N 24213 Low Tack, expandable PVC, 80 um thick
P/N 24216 Extra High Tack, non-expandable Polyethylene, 90 um thick
P/N 24339 Super High Tack, expandable PVC, 85 um thick
our most popular UV tape
P/N 24351 Super High Tack, expandable Polyolefin, 170 um thick
great for dicing BGA & ceramic

Heat Release Tape

Heat Release Tape is a unique thermal release tape that behaves like normal adhesive tape at room temperature but can be easily peeled off by simply heating when you want to remove the tape.

Wafer, Dicing & Protective Tapes Data Sheet

Heat Release Tape Data Sheet.

03/09/2010 09:06