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Diamond Wheel Dressing Solution Resistors - Thin Film Microwave & RF Solitec Spinners, Coaters and Developer support Storage Cabinets (Dry / Nitrogen & Custom) Tapes (Wafer, Dicing & Protective) Tape / Film Applicator / Mounters UV Curing Control & Test Equipment
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DICING TAPE / WAFER FILM/FRAME APPLICATORS PARTSWe offer a range of wafer film/frame applicators from Semiconductor Equipment Corp (SEC) which are capable of handling wafers up to 300mm wide. All models in the series are capable of offering uniform, bubble free mounting of tape for wafer dicing. The wafer/film applicators apply tape with optimal control of temperature and pressure parameters. The Model 3100 can handle wafers up to 6" in diameter, the Model 3150 can handle wafers up to 8" in diameter and the new Model 300 can handle wafers up to 12" in diameter. For back grinding operations the Model 3200 tape applicator quickly and easily applies a uniform protective tape to wafers for processing.
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MODEL 3100
WAFER
FILM/FRAME APPLICATOR : The Model 3100 wafer film/frame applicator offers bubble free tape application, a safe and accurate tape trimming system, uniform tape tension, it works with all standard film frames, its adjustable, machine controlled roller pressure, closed loop temperature control, optional non-contact platen, optional static eliminator.
MODEL 3150
WAFER
FILM/FRAME APPLICATOR: The Model 3150 wafer film/frame applicator offers bubble free tape application, a safe and accurate tape trimming system, uniform tape tension, it works with all standard film frames, its adjustable, machine controlled roller pressure, closed loop temperature control, optional non-contact platen, optional static eliminator.
The Model 300 wafer film/frame applicator offers bubble free tape application, a safe and accurate tape trimming system, uniform tape tension, it works with all standard film frames, its adjustable, machine controlled roller pressure, closed loop temperature control, optional non-contact platen, optional static eliminator.
The Model 3200 backlap tape applicator quickly, easily and uniformly applies protective tape to wafers for back grinding operations. The roller applicator assures bubble free application of tape to the wafer. The built in fail-safe cutter trims the tape accurately along the edge of the wafer including flats. The Model 3200 can mount up to 6" wafers and will work with all tapes. Call us for further details. 03/09/2010 09:06 |
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