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DICING TAPE / WAFER FILM/FRAME APPLICATORS PARTS

We offer a range of wafer film/frame applicators from Semiconductor Equipment Corp (SEC) which are capable of handling wafers up to 300mm wide. All models in the series are capable of offering uniform, bubble free mounting of tape for wafer dicing. The wafer/film applicators apply tape with optimal control of temperature and pressure parameters. The Model 3100 can handle wafers up to 6" in diameter, the Model 3150 can handle wafers up to 8" in diameter and the new Model 300 can handle wafers up to 12" in diameter.

For back grinding operations the Model 3200 tape applicator quickly and easily applies a uniform protective tape to wafers for processing.

Click Here for a video demonstration

Model 3100 & 3150 Data Sheet.

MODEL 3100 WAFER FILM/FRAME APPLICATOR :

The Model 3100 wafer film/frame applicator offers bubble free tape application, a safe and accurate tape trimming system, uniform tape tension, it works with all standard film frames, its adjustable, machine controlled roller pressure, closed loop temperature control, optional non-contact platen, optional static eliminator.

up to 6" wafer capability standard

Accepts all film frames (specify type and size)

Manual tape feed

Manual tape tensioning

Compatible with standard or interleaved tape

Vacuum stage wafer hold-down

Heated vacuum stage adjustable to 60 degrees C. Max

Built in cutter tape separation systems

Captive roller assembly assures consistent wafer/film contact pressure

Adjustable spring loaded platen for optimum contact pressure

MODEL 3150 WAFER FILM/FRAME APPLICATOR:

The Model 3150 wafer film/frame applicator offers bubble free tape application, a safe and accurate tape trimming system, uniform tape tension, it works with all standard film frames, its adjustable, machine controlled roller pressure, closed loop temperature control, optional non-contact platen, optional static eliminator.

up to 8" wafer capability standard

Accepts all film frames (specify type and size)

Manual tape feed

Manual tape tensioning

Compatible with standard or interleaved tape

Vacuum stage wafer hold-down

Heated vacuum stage adjustable to 60 degrees C. Max

Built in cutter tape separation systems

Captive roller assembly assures consistent wafer/film contact pressure

Adjustable spring loaded platen for optimum contact pressure

MODEL 300 WAFER FILM/FRAME APPLICATOR :

Model 300 Data Sheet.

The Model 300 wafer film/frame applicator offers bubble free tape application, a safe and accurate tape trimming system, uniform tape tension, it works with all standard film frames, its adjustable, machine controlled roller pressure, closed loop temperature control, optional non-contact platen, optional static eliminator.

Features include :

up to 12" wafer capability standard

Accepts all film frames (specify type and size)

Manual tape feed

Manual tape tensioning

Compatible with standard or interleaved tape

Vacuum stage wafer hold-down

Heated vacuum stage adjustable to 60 degrees C. Max

Built in cutter tape separation systems

Captive roller assembly assures consistent wafer/film contact pressure

Adjustable spring loaded platen for optimum contact pressure

OPTIONAL ITEMS FOR WAFER/FILM FRAME APPLICATORS

Static Eliminator with power supply.

Non-contact assembly

includes:

pressure back-up to support wafer during tape application

Controls to remove back-up pressure when tape roller is off the wafer

Pressure regulator to maintain correct back-up pressure

Service Kit

Peeler Assembly option

For Older 3100 / 3150 Machines

Also available for existing Model 3100 and 3150 is a Cutter Assembly retrofit-kit which allows replacement of the cutting blades to a more robust and longer life rotating blade.

Spares and Accessories

We can also supply all spare parts and assemblies for you existing Model 3100/3150 wafer/film applicators. We can also supply clamp rings, wafer handling systems and frames - call us for further details !!!

MODEL 3200 BACKLAP TAPE APPLICATOR :

The Model 3200 backlap tape applicator quickly, easily and uniformly applies protective tape to wafers for back grinding operations. The roller applicator assures bubble free application of tape to the wafer. The built in fail-safe cutter trims the tape accurately along the edge of the wafer including flats. The Model 3200 can mount up to 6" wafers and will work with all tapes.

Call us for further details.

03/09/2010 09:06