We offer a range
of wafer film/frame applicators from Semiconductor Equipment Corp (SEC)
which are capable of handling wafers up to 300mm wide. All models in
the series are capable of offering uniform, bubble free mounting of
tape for wafer dicing. The wafer/film applicators apply tape with
optimal control of temperature and pressure parameters. The Model
3100 can handle wafers up to 6" in diameter, the Model
3150 can handle wafers up to 8" in diameter and the new Model
300 can handle wafers up to 12" in diameter.
For back grinding
operations the Model 3200 tape applicator
quickly and easily applies a uniform protective tape to wafers for processing.
Click
Here for a video demonstration
MODEL 3100
WAFER
FILM/FRAME APPLICATOR :
The Model 3100
wafer film/frame applicator offers bubble free tape application, a
safe and accurate tape trimming system, uniform tape tension, it
works with all standard film frames, its adjustable, machine
controlled roller pressure, closed loop temperature control, optional
non-contact platen, optional static eliminator.
up to 6"
wafer capability standard
Accepts all film
frames (specify type and size)
Manual tape feed
Manual tape tensioning
Compatible with
standard or interleaved tape
Vacuum stage wafer hold-down
Heated vacuum
stage adjustable to 60 degrees C. Max
Built in cutter
tape separation systems
Captive roller
assembly assures consistent wafer/film contact pressure
Adjustable spring
loaded platen for optimum contact pressure
MODEL 3150
WAFER
FILM/FRAME APPLICATOR:
The Model 3150
wafer film/frame applicator offers bubble free tape application, a
safe and accurate tape trimming system, uniform tape tension, it
works with all standard film frames, its adjustable, machine
controlled roller pressure, closed loop temperature control, optional
non-contact platen, optional static eliminator.
up to 8"
wafer capability standard
Accepts all film
frames (specify type and size)
Manual tape feed
Manual tape tensioning
Compatible with
standard or interleaved tape
Vacuum stage wafer hold-down
Heated vacuum
stage adjustable to 60 degrees C. Max
Built in cutter
tape separation systems
Captive roller
assembly assures consistent wafer/film contact pressure
Adjustable spring
loaded platen for optimum contact pressure
MODEL 300
WAFER FILM/FRAME APPLICATOR :
The Model 300
wafer film/frame applicator offers bubble free tape application, a
safe and accurate tape trimming system, uniform tape tension, it
works with all standard film frames, its adjustable, machine
controlled roller pressure, closed loop temperature control, optional non-contact
platen, optional static eliminator.
Features include :
up to 12"
wafer capability standard
Accepts all film
frames (specify type and size)
Manual tape feed
Manual tape tensioning
Compatible with
standard or interleaved tape
Vacuum stage wafer hold-down
Heated vacuum
stage adjustable to 60 degrees C. Max
Built in cutter
tape separation systems
Captive roller
assembly assures consistent wafer/film contact pressure
Adjustable spring
loaded platen for optimum contact pressure
OPTIONAL ITEMS
FOR WAFER/FILM FRAME APPLICATORS
Static Eliminator
with power supply.
Non-contact assembly
includes:
pressure back-up
to support wafer during tape application
Controls to remove
back-up pressure when tape roller is off the wafer
Pressure regulator
to maintain correct back-up pressure
Service Kit
Peeler Assembly option
For Older 3100
/ 3150 Machines
Also available for
existing Model 3100 and 3150 is a Cutter Assembly retrofit-kit which
allows replacement of the cutting blades to a more robust and longer
life rotating blade.
Spares and Accessories
We can also supply
all spare parts and assemblies for you existing Model 3100/3150
wafer/film applicators. We can also supply clamp rings, wafer
handling systems and frames - call us for further details !!!
MODEL 3200
BACKLAP
TAPE APPLICATOR :
The Model 3200
backlap tape applicator quickly, easily and uniformly applies
protective tape to wafers for back grinding operations. The roller
applicator assures bubble free application of tape to the wafer. The
built in fail-safe cutter trims the tape accurately along the edge of
the wafer including flats. The Model 3200 can mount up to 6"
wafers and will work with all tapes.
Call us for
further details.
