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240 pages
| Epak Electronics Ltd provide bonding tools,capillaries,co2
cleaning machines,abrasive blasters,thin film and thick film chip
resistors and semiconductor bonding and processing equipment from Comco
Inc, Deflex, SEC,SPT,MSI,RPS,AI Technology,AIT,UV Process Supply,DTIC,
spares for Solitec spinners and coaters |
| Epak Electronics Ltd provide bonding tools,capillaries,co2
cleaning machines,abrasive blasters,thin film and thick film chip
resistors and semiconductor bonding and processing equipment from Comco
Inc, Deflex, SEC,SPT,MSI,RPS,AI Technology,AIT,UV Process Supply,DTIC,
spares for Solitec spinners and coaters |
| News and Updates from Epak Electronics Ltd |
| Products Listed By Manufacturer from Epak Electronics Ltd |
| Applications Solutions from Epak Electronics Ltd |
| Products Listed By Manufacturer from Epak Electronics Ltd |
| Spares, Servicing and technical support for Comco, Semiconductor
Equipment Corp, RPS, Solitec Wafer Processing, Deflex, PURCO2, and AB
Manufacturing for the UK & Europe |
| Epak Electronics Ltd provide bonding tools,capillaries,co2 cleaning
machines,abrasive blasters,thin film and thick film chip resistors and
semiconductor bonding and processing equipment from Comco Inc, Deflex,
SEC,SPT,MSI,RPS,AI Technology,AIT,UV Process |
| Epak Electronics Ltd Contact Details |
| Epak Electronics Ltd Map & Directions How to get to us |
| Epoxies & Adhesives For Electronics, encapsulation, die attach, heat
sink attach, LCD assembly, Manufacturing From AI Technology |
| Abrasive blast powders and media including sodium bicarbonate, silicon
oxide, aluminum oxide, walnut shell, glass beads, plastic, pumice and crushed
glass from comco inc |
| Desiccant Air Dryer, Continuous Air Dryer, water and oil air filter from
Comco Inc Particularly suitable for Micro Abrasive Blasters from Swam, SS White
& Comco |
| micro abrasive & grit blast cabinets from Comco workstations
including clearview and procentre |
| Wire Bonding Capillaries from SPT for ASM, Alphasem, Amica, Assembly
Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes,ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko |
| SPT Ultrasonic Wire Bonding Wedges for fine pitch, microwave, ribbon wire, tab and waffle tools for large or small wire bonds. |
| Thin film Surface Mount MOS chip capacitors and Binary chip capacitors,
SMT, Epoxy, Wire Bondable from Mini Systems Inc (MSI) availabel from Epak UK |
| C02 Liquid Carbon Dioxide Cleaning - clean, solvent free cleaning uses
C02, it doesn't create it |
| Custom automation solutions for small to medium scale production
environments. We have experience in customisation from modified or custom work
cabinets to our fully programmable precision surface abrader, contact us if you
have an application, we may be able to help |
| Cool-Silver, outperforms all leading manufacturers includinig Arctic
Silver Computer CPU thermal paste by 2 to 4 degrees celsius and can cool your
computer by as much as 4 to 8 degrees, From AI Technology |
| Epoxy Die placement, Die Bonders for Eutectic, Pick and Place, Flip Chip,
Laser Diode and chip scale devices, from Epak Electronics Ltd |
| Die Eject Grid & Pin Eject System From Semiconductor Equipment Corp.
Safely remove die from wafers mounted on dicing tape |
| Tapes for semiconductor wafer dicing, Inkjet cover tapes, ceramic hybrid
substrate sawing, surface protection tapes and many other applications that
require an adhesive tape with relatively low adhesion |
| Die Pickup tools for ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC,
Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S,
KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment
Corp), Shinkawa, Toshoko, Unive |
| dispensing systems from low cost meter mix system to micro dispenser and
hand held electrical dispensers from DTIC |
| Diamond Wheel Dressing Solutions From Philtec |
| Abrasive Dust Collection & Dust Extraction for abrasives, Comco
CTR100 Procentre Abrasive Workstation & Dust Collector for shot blasting and
micro grit blasting |
| Electronic Packages - glass side wall & metal flat packs, electronic
packaging including Plug-ins, Gull Wing, J-leaded Chip Carriers From Mini
Systems Inc |
| Epoxy Stamping and dispensing nozzles,Luer lock, Rubber and Steel
stamping tools and nozzles for epoxy dispensing for ASM, Alphasem, Amica,
Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker,
Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar |
| Hot Gas Rework Station And Hot Gas Nozzles From Rework Station & Hot
Gas Removal Station by Semiconductor Equipment Corp, Model 430 & Model 450 |
| Ink Coating and Handling products selected for their usefulness in
handling UV curable materials. |
| Custom Machine Safety Guards Covers and Protective Plates By Luminati |
| manual and semi-automatic mask and substrate alignment, HTG ABM
Semi-Automatic (Contact/Proximity) Mask Alignment Systems |
| Maintenance & Shop cleaning, storage, static control, mats and UV
filter products selected for their usefulness in handling UV curable materials. |
| Comco Microblaster, mini-sandblasting or grit blasting using fine
particles of abrasive to deburr, texture, surface finish and strip coatings in a
refined and controlled way. |
| Accessories and options for the Comco range including constant air bleed,
blast timer, tank extender, high pressure model blasters, wire stripping ring
nozzle, blast window protectors, nozzle splitters and spares and repair services
from Epak |
| small volume Micro Abrasive Blasting Services By Epak Electronics Ltd for
low volume parts processing from de-burring to surface preparation, corrosion
removal to mold cleaning using the Comco Inc Microblaster |
| Pick and Place Bonder, Model 830 by SEC, the updated version of the KTM
83a and KTM83B is a general purpose manual or semi-automatic pick and place
system for die and surface mount components |
| Colour Inspection, screen printing, doctor blades, ph meters, pantone
products screen making supplies and Printing Supplies, the products have
been carefully selected for their usefulness in the printing processes that
involve UV curable materials from UV Process Supply |
| Thin film chip resistors, SMT, Surface Mount, Wire Bondable, Epoxy, ROHS,
high reliability, laser trimmed, Lead free, Mini Systems Inc (MSI) available
from Epak Electronics Ltd UK |
| Microwave & RF Thin film chip resistors from Mini Systems Inc (MSI)
brought to you by Epak Electronics Ltd |
| Thick film chip resistors, MIL-PRF 55342, SMT resistors, Wire Bondable
Resistors, ROHS, ISO9001, high reliability components, from Mini Systems Inc
(MSI),SN62,Untinned,High Temperature terminations available, brought to you from
Epak Electronics Ltd |
| UV Safety glasses, UV face shields, coveralls, respiritory and hearing
protection, skin protection, barrier creams, for all your safety needs for
workers exposed to potential hazzards from using UV ultraviolet inks coatings
and adhesives |
| Silicon Doping Stain Safe-T-Stain From Epak Electronics Ltd |
| Solder Pots, automated Solderability Tester, Soldering Equipment, Steam
Ager, Tin Dipping Equipment from Robotic Process Systems |
| Solitec WP spares and assistance, we have a complete range of manuals a
schem,atics for 500 series and 800 series machines including the coaters,
spinners and developers, also 5110, 5100 series and can offer support for older
machines |
| Steam Ager From RPS ST-2 & STD-2 artificial Steam Aging to MIL-STD
202 Method 208 |
| Nitrogen & Dry Storage Cabinets Made From Perspex, Stainless Steel,
Tempered Glass or PVC From Luminati |
| SA150 Precision Surface Abrader, using micro abrasive blast technology
for fine media grit blasting, SA-150 |
| Protective tape applicator, wafer film frame applicator for mounting
wafers or die in frames for dicing or storage from Semi Conductor Equipment Corp
supplied by Epak |
| UV speed monitors, temperature monitors, radiation dose monitors, ink
cure analyzer, film thickness controls, adhesion, viscocity and humidity
testing, uv inspection equipment CURING CONTROLS FROM UV PROCESS SUPPLY |
| UV Curing Equipment and UV Cure Systems, Lamps, irradiators, power
suppliers, conveyor belts, spares and replacement parts , small conveyor units
for the laboratory to high performance housings and lamps for nearly every
application from UV Process Supply |
| Wafer Backlap Tape Applicator Model 3200 & 3250 applies protective
tape to your wafer prior to backlapping. An optional peeler assembly is
available to remove the tape after thinning the wafer. SEC (Semiconductor
Equipment Corp) brought to you by Epak Electronics Ltd UK |
| Epak Electronics Ltd Map & Directions How to get to us |
| NEW Comco AccuFlo AF10 micro-abrasive blaster including the patented
Simoom? Technology - a redesigned modulator, aerodynamic tank and
PowderGate? valve. The added flexibility and enhanced powder flow
control allow a wider range of applications to be performed with the unit. |
| Micro dispensing system for 0.01cc repeatable dispensing from 10cc
syringe or 0.1cc from 30cc syringes with programmable time and manual or
automatic dispense modes from DTIC |
| Mini-Systems have never made any parts obsolete, parts obsolescence is
becomming an increasing problem for component purchasing particularly in the
military, space, medical and satellite industries. More information available
from Epak Electronics Ltd UK |
| BV9000 wafer beveller made by Epak, custom rectifier beveller solution
for up to 6" wafers using micro abrasive technology |
| Comco CTR200 & CTR201 Procentre Plus Abrasive Workstation & Dust
Collector (downdraught design) ESD version available, CE Compliant, RoHS |
| Custom Flex Circuit Abrading System - Improve the laser soldering on flex
circuit . We have experience in customisation from modified or custom work
cabinets to our fully programmable precision surface abrader, contact us if you
have an application, we may be |
| Solder Dipping Machine, Component solder tinning, Solder Pots,
Solderability Tester, Steam Ager, Tin Dipping Equipment from Robotic Process
Systems |
| NEW UV-C Intensity Labels for easy, fast and low cost UVC measurement
from Epak Electronics |
| Fossil Cleaning Blast Cabinet, Paleontology Cleaning Box, EWS2290 Custom
abrasive blast cabinet for small to large fossils - epak custom |
| Special Thin Die Pickup Tips - RTR-D3-MH Multi-hole, RTR-D3-CCG Double Y
Cross Groove pick up tools for fragile delicate components particularly with
epoxy placement from SPT for die pickup and bonding |
| C02 Liquid Carbon Dioxide Cleaning - clean, solvent free cleaning uses
C02, it doesn't create it |
| Wafer & Substrate Dicing, Sawing & Protective Tapes |
| Thermal gels and greases from AI Technology including COOL-GEL,
COOL-Grease, and the new Artic Silver beater COOL-SILVER from Epak, UK &
Ireland representative |
| Precision Substrate Alignment Module System for Substate to mask, mask to
mask and substrate to substrate alignment |
| Mask Aligner HTG ABM Semi-Automatic (Contact/Proximity) Mask Alignment
System |
| AIT is the only manufacturer of dicing tapes that can withstand high
temperature exposure. This unique ability to tolerate high temperatures is
further enhanced with unique anti-static highly stretchable substrate.
UV-release versions with different peel strengths are also available. by AI
Technology (AIT) from Epak, UK & Ireland representative |
| AIT Electrically conductive and non-conductive paste die attach adhesives
from AI Technology |
| AIT Electrically conductive and non-conductive film die attach adhesives
from AI Technology |
| phase change thermal interface pads and thermal interface materials from
Epak, UK & Ireland representative for AI Technology (AIT) |
| AIT stress-free Electrically conductive and non-conductive substrate and
component attach film adhesives from AI Technology brought to you in the UK
& Ireland by Epak Electronics your local representative |
| AIT Electrically conductive and non-conductive substrate and component
attach adhesives from AI Technology brought to you in the UK & Ireland by
Epak Electronics your local representative |
| Custom adhesives and epoxy materials from AIT for large area and
mis-matched substrates, special coatings for extreme moisture or excessive heat,
pressure sensitive and curable coatings and adhesives, dry or pressure epoxy
films and speciality polymer based materials for manufacturing by AI Technology
(AIT) from Epak, UK & Ireland representative |
| COOL-CLAD and COUPLER TPR-CU Instead of a thermally conductive rigid
fiberglass epoxy laminate, we use our proprietary flexible thermal dielectric
insulating layer resulting in stress and warp-free thermal copper-clad laminates
from Epak, UK & Ireland representative |
| ESD protection coatings and materials by AI Technology from Epak, UK
& Ireland representative |
| EMI/RFI COMPRESSIBLE GASKET SHEET Materials from Epak, UK & Ireland
representative |
| proven reliability of flip-chip interconnections with flexible conductive
adhesive by AI Technology (AIT) from Epak, UK & Ireland representative |
| Lid seal preforms for solderable lid seal when applied to insulating lids
such as glass for optical lids, ceramic lids for large and small components, LCP
(Liquid Crystal Polymers) for high performance components, and lid seals for
MEMS and wafer level packaging represents the most cost-effective solution for
reliability and performance from AIT, AI Technology brought to you in the UK
& Ireland by Epak Electronics your local representative |
| COUPLER TM is a novel organic copper-clad laminate that is
available with 40-50 micron molecularly flexible dielectric and as thin 1/4 oz
copper layer for ultra-thin components and boards from AI Technology AIT brought
to you by Epak your UK & Ireland Representative |
| Mil-Std 883C Method 5011.4 compliant materials by AI Technology (AIT)
from Epak, UK & Ireland representative |
| NASA ESA OUTGASSING Qualified adhesives epoxy and materials, Mil-Std 883C
Method 5011.4 compliant materials by AI Technology (AIT) from Epak, UK &
Ireland representative |
| EMI/RFI COMPRESSIBLE GASKET SHEET Materials from Epak, UK & Ireland
representative |
| Advanced Circuit Substrate Materials and solderable copper
clad laminate for multi-layer circuit fabrication from AI
Technology AIT brought to you by Epak your UK & Ireland
Re |
| solderable insulating lids, wafer level MEMS and optical lid solutions,
solutions in hermetic lid sealing. The solderable lid sealing when applied to
insulating lids such as glass for optical lids, ceramic lids for large and small
components, LCP (Liquid Crystal Polymers) for high performance components, and
lid seals for MEMS and wafer level packaging represents some of the most
cost-effective solutions with unparalleled reliability performance. From Epak
Electronics Ltd UK & Ireland Representative |
| Single-Sided Copper-Clad Laminate Flexible Circuit Material Substrates,
Double-Sided Copper Laminates Flexible Circuit Mateirals for Flexible Circuits,
Interposers,and Modules and , Flexible Pre-Preg Flexible Circuit Material for
Multi-layer Flexible Circuits and Interposers from Epak, UK & Ireland rep |
| Thermally Conductive & Electrically Insulating Paste
Adhesives,Electrically and Thermally Conductive Paste, Thermally Conductive
& Electrically Insulating Films and Pads, and Electrically and Thermally
Conductive Films and Pads from Epak, UK & Ireland representative for AI
Technology (AIT) |
| Comco CTR100 Procentre Abrasive Workstation & Dust Collector ESD
version available |
| Comco DF1200 DirectFlo Micro Abrasive Blaster for fine media grit
blasting |
| Comco DF1400 DirectFlo DF1400 Micro Abrasive Blaster for fine media grit
blasting |
| Abrasive Lathe ideally suited for abrading parts that require precision
material removal, cleaning or texturing. A self-contained workstation the
Standard Lathe delivers a powerful stream of abrasive in a programmable pattern
ensuring a high degree of repeatability and control from Comco Inc for Micro
Abrasive Blasters |
| Abrasive Lathe for abrading precision material removal, cleaning or
texturing. A self-contained workstation the Standard Lathe delivers a powerful
stream of abrasive in a programmable pattern ensuring a high degree of rep |
| Workstation Cabinet Magnifier for increased visibility on small parts by
Comco |
| Comco MB1000 & MB1002 Micro Abrasive Blasters for fine media grit
blasting |
| Abrasive Blast Nozzles for Comco Microblaster, Directflo and Powerflo and
|
| Comco PF2400 PowerFlo Micro Abrasive Blaster for fine media grit blasting |
| Comco PF2400 PowerFlo Micro Abrasive Blaster for fine media grit blasting |
| EZ-Mix Hi battery powered, motorized, hand held dispenser for 2 part
materials from DTIC |
| EZ-Mix FR low cost meter mix dispensing system from DTIC |
| SA3000 Large Precision Surface Abrader, using micro abrasive blast
technology for fine media grit blasting, SA-3000 for 300mm wide wafers |
| Back contact chip resistors 0202 case thin film back contact resistor
MSBC2 series and EMSBC2 Series from Mini-Systems Inc available from Epak UK |
| Surface Mount Chip Resistor Kits from the WATF series from Mini Systems
Inc (MSI) brought to you from Epak Electronics Ltd |
| Thin Film Resistor and mos capacitor network MRCN Series designed for
hybrid circuits from Mini Systems Inc (MSI) brought to you from Epak Electronics
Ltd UK |
| chip attenuators for surface mount, SMT, PCB, hybrid, and high
reliability electronics, MSAT1, MSAT2, MSAT3, MSAT5, MSAT6, MSAT7, MSAT10,
MSAT21, MSAT22, MSAT23 Series from Mini Systems Inc (MSI) available from Epak
Electronics Ltd UK |
| BINARY MOS Style Chip Capacitors, SMT, Surface Mount, Wire Bondable,
MSBIN series MSBIN-1, MSBIN-2, MSBIN-3 & MSBIN-4 from Mini-Systems Inc
(MSI) for Hybrid and Microwave circuits Available from Epak UK |
| MSCC series MOS Style Chip Capacitors MSCC2, MSCC3, MSCC4 & MSCC5
from mini-Systems Inc (MSI) available from Epak UK |
| Thin film dual resistor networks 0303 case size MSDR3 series from Mini
Systems Inc (MSI) brought to you from Epak Electronics Ltd UK |
| Thin Film Chip attenuators MSAT1 MSAT2 MSAT3 & MSAT10 series provide
attenuation accuracy for frequencies through 20MHz. They offer the low noise,
stray capacitance and tight tolerance of the thin film in compact sizes from
Epak UK |
| High Value Chip Resistors 1.5 mega ohm to 15 mega ohm MSHR2 MSHR3 MSHR4
Series from mini-Systems Inc (MSI) available from Epak UK |
| THIN FILM DUAL ISOLATED RESISTOR NETWORKS 0303 case size MSIR3 SERIES
from Mini Systems Inc (MSI) brought to you from Epak Electronics Ltd |
| Thin Film Chip Jumpers, MSJC and WAJC series zero ohm jumpers, bonding
islands and stand offs for hybrid and custom circuit design from MSI available
from Epak Electronics UK |
| MSMR1 series thin film chip resistor in 0101 case size is available with
values from 2 ohm to 18 K ohm, Tolerance range from 1% to 10% available from
Mini Systems Inc |
| Multi-tap LOG resistor offers six resistive elements of 10 0hm, 10 0hm,
20 0hm, 50 0hm, 50 0hm, 100 0hm, The MSMT117 & MSMT125 series making a total
of 240 ohm from Mini Systems Inc available from Epak Electronics Ltd UK |
| Microwave Frequency chip resistors MSMW, SMT, Surface mount, Wire
Bondable, Epoxy, high frequency. values from 2 ohm to 18 K ohm (series and
tolerance dependant). MSMW110, MSMW112, MSMW115, MSMW118, MSMW120, MSMW121,
MSMW122, & MSMW124, Tolerance range from 1% to 10% available from Epak UK |
| 500m WATT THIN FILM POWER RESISTORS, 500mw, MSPR1 SERIES from Mini
Systems Inc (MSI) availabel from Epak Electronics Ltd UK |
| Binary and numerical laser codable resistors MSSR-2 & MSSR-3 from
Mini-Systems Inc (MSI) availabel from Epak UK |
| MSTF1 series resistor, SMT, Surface Mount, Wire Bondable, .015" case
size, Mini-Systems Inc, MSI offers a space saving design in a .015" x
0.015" case size from Mini Systems Inc (MSI) brought to you from Epak
Electronics Ltd |
| 0202 case size, Chip Resistor, Alumina, glass, quartz, silicon substrate,
wire bondable and surface mount, SMT, MSTF2 series thin film chip
resistors from Mini Systems Inc (MSI) brought to you from Epak Electronics Ltd |
| Center tapped thin film chip resistors, SMT, Epoxy, Wire bondable MSTF3
Series from Mini-Systems Inc (MSI) available from Epak UK |
| Wire bondable thin film chip resistors MSTF 35 series from Mini-Systems
Inc (MSI) available from Epak UK |
| 0404 case size MSTF4 SERIES & MSDR4 SERIES MEGOHM THIN FILM CHIP
RESISTORS from Mini Systems Inc (MSI) brought to you from Epak Electronics Ltd |
| Resistive Thin Film Power Terminators PTSM & PTWB series from Mini
Systems Inc (MSI) available from Epak Electronics Ltd UK |
| Surface Mount (SMT) thin film resistors WATF series. Half-wrap or
Full-wrap terminations offer maximum flexibility from Mini Systems Inc (MSI)
brought to you from Epak Electronics Ltd UK |
| Thick Film Jumpers, bonding islands and zero 0 ohm jumpers from Mini
Systems Inc, TJ, J, MJ, DJ & WAJ Series from Epak UK |
| Thick Film Jumpers & Bonding Islands, Stand Offs from Mini Systems
Inc (MSI) TJ, J, MJ, DJ & WAJ Series Zero Ohm available from Epak UK |
| Thick Film Attenuator Chips, SMT Attenuators, Wire Bondable Attenuators -
MSA Series Wire and Ribbon Bondable Thick Film chip Attenuators from Mini
Systems Inc available from Epak UK |
| MIL-PRF-55342 Qualified Thick Film chip Resistors, Class A, Class B,
Class C Testing, Qualified to MIL-PRF-55342 M, P, R & S Level failure
rates from Mini Systems Inc Available in UK from Epak |
| Wire Bondable & Flip Chip Thick Film Resistors. Surface Mount
Resistors, WA and HW Series Surface Mount chip Resistors from Mini Systems Inc
Available in UK from Epak |
| Surface mount Resistor Networks SMR series Thick Film Jumpers from Mini
Systems Inc |
| Wraparound and Half-wrap Thick Film Surface Mount chip Resistors from
Mini Systems Inc (MSI) WA Series and HW Series available from Epak UK |
| Flip Chip Die Bonder Model 850 from Semiconductor Equipment Corp is a
semi-automatic placement system for flip chips, chip scale devices and bare die. |
| Die Bonder for solder and gold bumped flip chip, eutectic bonding
including laser diodes and bars and epoxy bonding SEC Model 860 Omni Bonder |
| Custom Pick Up And Bonding Tools And Special Tool Solutions from SPT |
| Die pickup tools, die collets for die placement and bonding from SPT for
ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr
Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer,
Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal,
West Bond, Viking Semicon and other die bonders. |
| Die Shear Tools DST & DST2 for Shear Strength Testing |
| EFO Electronic Flame Off Wand for Consistent free air ball |
| Microloy Osmium carbide material for bonding wedges ,longer life tool,low
stress bonding,high reliability bonds recommended for 35 micron pitch bonding
process |
| Die Ejector Needles PUN Push Up Needles from SPT |
| Production Conveyor systems and mini conveyors from UV Process Supply In
the lab, the evaluation of new formulas and batches is important for
consistency. Laboratory curing systems provide chemists small, relatively
inexpensive production units for the evaluation of inks and coatings prior to
use. |
| B002-001, B002-002, B002-003, B002-006, We offer a range of conveyor
belts from the Heat Dissipating UV Conveyor Belts are specially designed to
withstand high levels of radiation emitted from a UV curing system, to Standard
Conveyor Belts that can withstand UV light, ozone and solvents, and provide long
life at exposure to processing temperatures from -40 to 500 degrees F. |
| Colour Densitometer, degree of darkness or colour saturation measurement.
The Betacolor Range includes the 2000, S1, S2 and S4 models. M003-001, M003-006,
M003-005, M003-004 for all your printing supplies from UV Proc |
| Drawdown rods, machines, opacity testing, hand proofers and cleaners, rod
storage racks andlaboratory drawdown machines from UV Process Supply, brought to
you by Epak, your UK and Ireland representative |
| We offer diaphragm pumps that are compatible with UV inks and coatings
for most production uses. Our transfer pump series offers a range of compact,
inexpensive pumps for use with UV and water based inks and coatings, acetate
monomers, and some solvents. Ideal for various flexo-graphic and screen printing
applications, thes4e pumps offer capacity ranges up to 7 gallons per minute
(GPM). |
| Eye and face protection, goggles, face shields, uv glasses, uv protective
windows, splash and chemical goggles and protective eyewear from UV Process
Supply brought to you by Epak Electronics your local UK and Ireland
representative |
| Ozone gas detector & warning badges, test strips for ozone from Epak
Electronics, UK and Ireland representatives |
| Hand pumps for UV, chemical and industrial applications for all types of
manufacturing and even FDA approved hand pumps for food grade liquids and
chemicals. |
| UV Mercury Lamp cleaning kit, UV lamp and reflector cleaning kit and
Cleaning solution for UV lamp and reflector. By using the Lamp and Reflector
Maintenance Kit, you can clean lamps and reflectors to ensure maximum energy
efficiency. Each item in this kit quickly removes dust and other foreign
particulate without leaving a residue. Never use steel wool, emery paper, or
abrasive powders for cleaning lamps or reflectors |
| The LM-9000, the flagship of this technology, is a highly modular,
computer-based, full spectrum UV data acquisition and management system
providing both real-time display and data storage of UV Lamp output
characteristics. Our exclusive Optical Probe and Fiber Optic sub-systems will
allow permanent sensor placement inside the curing zone, reflector housing, or
even directly on the lamp. |
| Roller lube, UV resistant grease and solvent resistant grease for UV
systems. A range of UV resistant and high temperature lubricants for mechanical
assemblies in a UV curing system. Ideal for web, conveyor and other printing
machinery exposed to continuous solvent contact during production and cleanup
and for mechanical areas around UV lamps, such as grippers and shutters. Brought
to you from Epak Electronics Ltd UK |
| Peristaltic pumps, empty large drums into small, easy to carry
containers, or they can transfer metered amounts of inks and coatings to your
application equipment.Metering enables materials to be dispensed in desired or
multiple volumes. Using the principle of positive displacement, the flexible
tubing (through which the material is transfered) is squeezed by a rotating
mechanical roller that created the pump action. This unique feature offers easy
clean-up and quick changeover. |
| Replacement parts and accessories for Pumps including fitting kits,
in-line strainer fuilters, tubing, pump adaptors, ball valves, surge suppressors
for pumps, hand valves and daetwyler rare earth magnet and adaptors for anything
you need to repair, refit or install a pump |
| Radiometers for monitoring and checking UV lamp output for inks, coatings
and adhesives in any UV environment by Epak, your UK and Ireland representative |
| We can offer a wide range of spares and accessories for your UV system
from replacement lamps and housings, reflectors and filters to air knives, fans,
high voltage wire and relays. If you cant find what you need or need more
information, please do not hesitate to contact us. |
| Small area UV curing systems, hand spot guns, lamps and liquid light
guides for instantaneous cure of photoinitiated adhesives, potting compounds, UV
coatings and inks. Applications that require a highly concentrated UV curing
include PC board applications, encapsulation, wire tacking and high strength
bonding of disparate materials. |
| Speed monitors - tachometers and stroboscope from UV Process Supply,
combo tachometer stroboscope, digital strobotach, humidity and temperature
stopwatch, mini pocket tachometer, contact photo tachometer, multi function
tachometer and dual function tachometer for radiation exposure level measuremet
related to UV curing for measurement to ensure uniform drying brought to you by
Epak, your UK and Ireland representative |
| A wide range of ink knifes, scrapers, spreaders and stirrers from UV
Process Supply, in steel, stainless steel, nylon, wood and polypropylene for all
your mixing, scraping stirring and cleaning needs |
| UV Filters, uv filter screens, uv filter sheets, ultra violet lamp
filters for T8 and T12 lamps, removeable uv filter materials for all UV curing
applications from UV Process Supply, brought to you by Epak Electronics, your UK
and Ireland representative |
| Surface Tension measurement equipment, Dyne Pens, Dyne Solutions,Corona
treater, Goniometer surface tension measurement and cotton swabs for
contamination free use of the dyne liquids and pens. Measure and Create surface
tension to allow the best adhesion compatability for inks, coatings and
substrates for the best adhesion. UV PROCESS SUPPLY |
| Temperature Monitoring : thermometers, infrared IR meters, non-contact
temperature meters, pocket thermometers, digital thermometers, high temperature
meters, paper thermomters, hand held thermometers, tempil indicator sticks and
kits from UV Process Supply, brought to you by Epak, your UK and Ireland
representative |
| UV Curing chamber, 365 nm and 264 nm, The compact and low cost UV Curing
Chamber 365nm features microprocessor technology and a unique photo-feedback
system which measures and controls UV output and ensures maximum energy
efficiency |
| UV Process Supply offer the most complete line of UV Curing (Mercury
Vapor) and Exposure (Metal Halide) lamps on the market. Regardless of lamp
diameter, end fitting or power requirement, we can provide an exact match or
suitable alternative. |
| UV LED lamps, no heat, long life,instant on off, low power consumption
and non hazardous lamps are just a few of the benefits from UV LED technology.
UV LED lamps offer many benefits from conventional UV lamps including instant
on/off, they emits no heat, last for tens of thousands of hours of lamp life,
are scalable from 1"-1000' and can be sized exactly to your specifications.
They are a non-hazardous lamp and can simply be powered by a universal
power wall adapter, no specialist or heavy duty power supplies are needed.
Brought to you from UV Process Supply |
| UV Intensity Labels, Fastcheck Strips for UV exposure measurement, for
monitoring exposure levels from UV, N010-001, N010-005 |
| UV Filters, uv filter screens, uv filter sheets, ultra violet lamp
filters for T8 and T12 lamps, removeable uv filter materials for all UV curing
applications from UV Process Supply, brought to you by Epak Electronics, your UK
and Ireland representative |
| Microblasting Applications for precision machined parts,
deburring,removing EDM recast and discolouration,finishing and texturing
injection mold cavities and cleaning molds and hot runner nozzles with Comco
microblaster system |
| Turbine blade manufacturing and reconditioning,actuator poppets,pneumatic
valve deflectors,thermocouple manufacturing,gyro components and lense
manufacturing,load cells,strain gage,ceramic components,electronic
sensors,fasteners,selective corrosion removal mold and die tooling cleaning and
refurbishment,conformal coating removal are just some of the application for
microblasting, abrasive blast cleaning and surface finishing, Comco Inc,
Microblasting, Epak, UK & Ireland |
| manufacturing & Processing Medical Implant Devices, Dental Implant
Device,Wire Stripping Ring nozzle, Bone Screw Manufacturing, Abrasive blast
technology applications from Comco Inc, Microblasting, Epak, UK |
| Deburr Dental Implants, Devesting Pressable Ceramic, Surface Preparation
of Metal Alloys prior to Opaquing, Removal of Oxides from Surface of Porcelain
Crowns, Selecting Texturing of Dental Appliances, Shaping Tooth Anatomy, Comco
Inc, Microblasting, Epak, UK & Ireland |
| Fossil cleaning and preparation to remove the matrix surrounding an
embedded fossil is a popular application for micro-abrasive blasting.
Substantial amounts of material need to be removed to expose the fossil, and
damage to the fossil must be avoided. Microblasting or air abrasive equipment
can be used for cleaning fossils because it provides the precision required to
prevent harm to the specimen. |
| Decorative engraving with micro-abrasive blasting yields attractive
results on a variety of hard materials such as glass, acrylic, marble, onyx,
phenolic, wood and ceramic. Artists etch words or designs by either
freehand blasting or stencil blasting. Stencil blasting involves using a
mask applied to the item to be blasted. Any open areas on the stencil will
be blasted creating the design on the piece. Micro-abrasive blasting also
provides the accuracy and tight focus to be used for drawing with the abrasive
stream on the item. Personalizing glassware with names and dates is a
popular freehand application. |
| Capillary unplugging tools, EFO wands, Heater blocks, ceramic tweezers
and capillary unplugging probes, accessories for wire bonding from SPT. BST
tools, TWZ tools, CUW tools |
| EDN tungsten carbide dispensing nozzles for ESEC epoxy dispensing from
SPT for ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air
Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI,
Muehlbauer, Palo |
| Common Dispense Nozzle tools for programmable dispense systems from
SPT for ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air
Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI,
Muehlbauer, Palo |
| Micro Dispensing Nozzles for micro dots from SPT for ASM, Alphasem,
Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton,
Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad,
SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond,
Viking Semicon and other die bonders. |
| Luer Dispensing nozzles and tips from stainless steel or tungsten carbide
tip from SPT |
| REST Rubber Epoxy Stamping Tools for epoxy dispensing and stamping from
SPT for ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air
Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI,
Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa,
Toshoko, Universal, West Bond, Viking Semicon and other die bonders |
| SEST Steel Epoxy Stamping Tools for epoxy dispensing and stamping from
SPT for ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air
Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI,
Muehlbauer, Palo |
| SPT FP SERIES FINE PITCH ULTRASONIC BONDING WEDGE (formerly aprova) Tool
Styles : FP30A, FP38A, FP45A, FP55A, FP60A, FP30B, FP38B, FP45B, FP55B, FP60B,
FP30C, FP38C, FP45C, FP55C, FP60C |
| SPT UT & US SERIES UNIVERSAL ULTRASONIC WIRE BONDING WEDGE (formerly
aprova),UT30,US30,UT38,US38,UT45,US45 Tool styles |
| COB Chip-On-Board Bonding Wedge technology is successfully used to
connect semiconductors to PCBs for chip and wire bonding. Tool Style : UT30A
with 30 degree feed angle |
| SPT ABT Series 30ABT, 45ABT, 55ABT & 60ABT is the most widely used
and recommended tool design for automatic, manual with automatic retrofit and
manual ultrasonic wedge bonders |
| M Series Microwave Bonding tools Tool Styles : M30A, M38A, M45A, M55A,
M60A, M30B, M38B, M45B, M55B, M60B |
| SPT 1008A Side wire bonding wedge tool with standard 10 degree back in
titanium carbide for gold wire or tungsten carbide for aluminum wire, for use in
all conventional bonding machines from SPT, Small Precision Tools |
| SPT 1200 / 1100 / 1300 / 1400 Slimline Notch 0? back bonding wedge is
designed for use with aluminum wire in all conventional bonding machines, Tool
Styles : 1100A, 1200A, 1300A, 1400A, 1100B, 1200B, 1300B, 1400B |
| SPT XGR Series Insulated Wire Bonding Wedge Special Bonding Tools |
| SPT PF20 bonding needles for use in Manual Thermocompression Bonders.
Mainly used in microwave bonding applications with very small pads. |
| SPT Ribbon Wire Bonding Wedge Tools RW30 / RW445 / RW55 / RW60 |
| SPT OSG7 Orthodyne Inline Groove No Hole Bonding Wedge Tools 70 degree deep "v" groove |
| CKVD Style Inline Groove No-Hole Bonding Wedge Tools 70 degree deep
"v" groove,Tool Styles : CKVD-100, CKVD-125, CKVD-150, CKVD-175,
CKVD-200, CKVD-250, CKVD-300, CKVD-350, CKVD-380, CKVD-400, CKVD-500 |
| SPT CK Style Inline Groove No-Hole Bonding Wedge Tools |
| SPT 45CK Style Inline Groove Autobonding Wedge Tools |
| LWD6 Style Inline Groove No-Hole Bonding Wedge Tools from SPT (Small
Precision Tools), Tool Styles : LWD6-75, LWD6-100, LWD6-125, LWD6-150, LWD6-175,
LWD6-200, LWD6-250, LWD6-300, LWD6-350, LWD6-380, LWD6-400, LWD6-500 60 Degree
Deep V Groove |
| SPT 1009A Style Concave No-Hole Bonding Wedge Tools |
| SPT 3016 4016 Style Large Wire Inline Groove Notch Wedge Bonding Tools |
| SPT 3016 4016 Style Large Wire Inline Groove Notch Wedge Bonding Tools |
| SPT 30D6 / 45D6 / 60D6 STYLE INLINE GROOVE NOTCH TOOLS |
| SPT AB16 Style Large Wire Inline Groove Autobonding Wedge Tools |
| SPT 7000 7100 7045 7145 SERIES DOUBLE CROSS GROOVE
SINGLE POINT-TAB WEDGE TOOLS |
| SPT 7500 7600 7545 7645 SERIES DOUBLE CROSS PROTRUSION SINGLE POINT-TAB
WEDGE TOOLS |
| 7045W 7145W SERIES WAFFLE FOOT SINGLE POINT-TAB WEDGE TOOLS from
SPT, Small precision Tools |
| Microblaster Spares, Technical help and repair services for Comco
Abrasive blasters by Epak Electronics Ltd |
| Spares for SEC Semiconductor Equipment Corp Old and Discontinued Models :
Model 2650 Die Matrix Expander, Model 2750 Wafer Fracturer, Model 2800 Automatic
Scriber, Model 4020 Eutectic Die Bonder, Model 4100 Flip Chip Die Bonder For
Small Die, Model 4200 Eutectic Die Bonder for laser diodes, Model 4425 Hot Gas
Jet Module, Model 4450 Hot Gas Rework Station, Model 460 Hot Shot BGA/SMD Rework
Station, Model 410 Flip Chip Die Bonder, Model 6000 Die Shear Tester, KTM83A
Semiautomatic Pick And Place System, KTM83B Manual Pick And Place System |
| Solder Pots, Solderability Tester, Steam Ager, Tin Dipping Equipment from
Robotic Process Systems |
| Abrasive Trimmer TR1800, TR2000, TR4000, Abrasive Profiler PR1101,
Surface Abrader SA1200, MB100 Microblaster and Rectifier Beveller BV6500-1
legacy blast equipment from Comco, contact us if you need technical help and
repair services for Comco equipment, Epak Electronics Ltd |
| Abrasive Blast Nozzles for Comco Microblaster, Directflo and Powerflo and
|
| Thin Film power chip attenuators MSAT5 MSAT 6 & MSAT7 series provide
attenuation accuracy for frequencies through 20MHz from Mini Systems Inc |
| SPT (aprova) UT Series Capillaries, UTF UTS UTE for non-fine pitch
wire bonding that does not require a bottleneck tip design. Designed for higher
ball shear and stitch pull readings. |
| SPT (aprova) CSA Series Zero Face degree and large outer radius
capillaries for excellent stitch transition, available in matte or polished
finish. |
| SPT (aprova) SBN Slimline Bottleneck Capillaries for Fine Pitch
Bonding of Bond Pad Pitch 125 um to BPP 90 um. |
| SPT DFX capillary specifically targeting to contain the gold squashed out
during bonding resulting in a smaller mashed ball diameter from Epak |
| PI Capillary for Low-K,stacked die and ultra-fine pitch bonding
applications from SPT |
| SPT (formerly aprova) infinity capillary have extended life of three
times higher than a standard capillary |
| 7045W WAFFLE SHANK FLATS SERIES WAFFLE FOOT SINGLE POINT-TAB WEDGE
TOOLS |
| PCTR FCTR Conical thermoplastic polymer rubber tip pick up tools and
special conical flip chip pick up tools from SPT for die pickup and bonding |
| Peripheral Die Pickup Tool from SPT for ASM, Alphasem, Amica, Assembly
Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes,
ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC
(Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking
Semicon and other die bonders. |
| Die pickup tools - Collets - 2 sided inverted pyramid placement
tools CH channel collets from SPT for ASM, Alphasem, Amica, Assembly Tech, ESEC,
ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA,
K&S, KME, Laurier, MRSI, Muehlbauer, Palo |
| Die Collets - 4 sided inverted pyramid bonding tools IP, IPIR, IPNC and
IPCR Types from SPT for ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon,
Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME,
Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp),
Shinkawa, |
| 2151-CT Threaded replaceable conical pick up tools from SPT |
| RPCT Replaceable plastic conical tip pick up tools made from Delrin TM
from SPT |
| CT single piece conical tip pick up tools from SPT |
| RT single piece rectangular tip pick up tools from SPT |
| ST Replaceable silicone cylindrical, round pick up tips, soft tip pick up
tools made from Silicone from SPT |
| Special and custom Die Collets and bonding tools from SPT for ASM,
Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr
Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer,
Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal,
West Bond, Viking Semicon and other die bonders |
| Epoxy dispensing tools for static dispense systems from SPT for ASM,
Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr
Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer,
Palo |
| EMI RFI Shielding Hints and Tips for leaks, ventilation problems with
heat and potential pitfall and solutions by AI Technology from Epak, UK &
Ireland representative |
| Pre-Applied Melt-Bonding & Pressure-Sensitive EMI/RFI Shielding
Lid-Shield For UHF and Microwave Components and Boards by AI Technology from
Epak, UK & Ireland representative |
| Thin film resistor kits, substrates and jumpers and networks from Mini
Systems Inc (MSI) brought to you from Epak Electronics Ltd UK |
| Wire Stripping Abrasive Ring Nozzle from Comco MB1570 for removing
coatings and surface preparation for bonding/welding wires and moulded/extruded
cables, on demo at Epak, UK |
| Microwave terminations WAMT series special resistor patterning to enhance
RF performance. Half-wrap or Full-wrap terminations offer maximum flexibility in
microwave applications from Mini Systems Inc (MSI) brought to you from Epak
Electronics Ltd |
| Screen making equipment, mesh counter, squeegee holder, disappearing
registration guide, liquid frame seal adhesive, aluminium scoop coater, screen
blockout and screen exposure calculator for all your printing supplies from UV
Process Supply |
| Thin film Resistor arrays and resistor Networks, Dual, Isolated and RC
network and multi-tap resistors from Mini Systems Inc (MSI) brought to you from
Epak Electronics Ltd UK |
| Portable and benchtop uv curing systems including solar simulator,
portable 400 watt uv lamp, uv developer unit, 1600 watt curing lamps and scarab
400 watt uv curing lamp from UV Process Supply, brought to you by Epak
Electronics Ltd UK & Ireland |
| Inkjet curing lamps, large area flood curing, ballasts & power
supplies, lamp voltage interface and lighthouse systems for all your UV system
and application needs from UV Process Supply, brought to you by Epak Electronics
Ltd UK & Ireland |
| Mercury UV Grid Lamps are photochemical lamps with tubing bent back and
forth to form several parallel "bars". They are designed for
applications where short wave UV energy is needed. Ideal for curing epoxies,
removing trace amounts of organic contaminants, electronic component cleaning,
ozone generators, erasing Eproms and other scientific and environmental uses. |
| Products Listed By Manufacturer from Epak Electronics Ltd |
| SPT Standard Wire Bonding Tools 1001, 1002 and 1100 series standard 10º back bonding wedge is
designed for use with aluminum wire in all conventional manual bonding machines,
Tool Styles : 1001A, 1001B, 1002A, 1002B, 1110A, 1110B |
| SC suction cup and HSC high temperature suction die pick up tools from
SPT component bonding |
| TFC9000 Thin Film Calorimeter - Measure curing of your inks and coatings.
Test Old inks and new batches to check consistency. Quantitively measure
curability of inks coatings and adhesives |
|