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CDN - COMMON DISPENSING NOZZLE

In most programmable dispensing pumps, typical nozzle designs have been optimized to dispense consistent pattern and volume. Most of these standard nozzles have a distinct chamfered feature that reduces surface tension between the needle and material at the point of separation, therefore less probable to tailing or bridging. Stand off pin (SOP**) option is available to control the allowable distance between the needle tip and substrate.

 

*Gauge Sizes

 

 

 

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

 

13/08/2008 14:34

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

Latest  News:

 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
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