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REST - RUBBER EPOXY STAMPING TOOLS

 

Rubber epoxy stamping tools offer an inexpensive solution for epoxy dispensing, especially for prototyping and small production runs. Typically the REST tools are used on die sizes from .051" / 1.30mm and above.

The design provides a dot matrix epoxy print out. The layout of the tool pins ensure a consistent amount of die attach material to be placed on the pad area.

Three rubber pad patterns are available with different dot diameter and pitch configurations:

  • Pad # 3, dot diameter .0118" / 0.30mm, pitch .031" / 0.80mm

  • Pad # 5, dot diameter .0197" / 0.50mm, pitch .040" / 1.00mm

  • Pad # 6, dot diameter .0236" / 0.60mm, pitch .040" / 1.00mm

How to select:

Even if empirical experiments give only true image of the final dispense output, we can approach the desired result by considering the following rule of thumb.

  • The epoxy coverage of the tool chosen must be larger than the die size while the physical pad patteren PL x PW should be equal or smaller than the die size. For the standard pad layout, the value PL, PW, DL, DW are given in the table and can be calculated with the following formula :

  • When the die is pressed onto the epoxy layout, enclosed by the dot outline DL x DW, the die attach material will spread out and the epoxy coverage will be extended by approximately:

  • Whenever possible it is advisable to choose a pattern that has closer gaps between the dots. For high epoxy viscosity, best results are obtained with larger dot spacing. 

 

 

 

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.  

18/01/2012 03:50

EPAK
Latest  News:
 

06.07.2011

NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor

Lighter, brighter, cleaner and quieter.

09.03.2011

Custom Flex Circuit Abrader

We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.

21.10.2010

SA150 Video of our Surface Abrader added to our YouTube channel

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BV9000 Videos Added  of our Rectifier Beveller to our new YouTube video channel online

03.08.2010

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Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

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Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
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19.03.08 : New  Website Launched

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