Adhesives & Epoxies

Air Dryers

Bonding Capillaries

Bonding Wedges

Chip Capacitors

CO2 Cleaning

Custom Automation

Die Bonders

Die & Pin Eject Systems

Die Pickup Tools

Dispensing Systems

Dry Storage Cabinets

Diamond Wheel Dressing Solution

Dicing & Wafer Tapes

Dust Collectors

Electronic Packages

Epoxy Stamping & Dispensing

Hot Gas/Rework

Ink Coating & Handling

Machine Guarding

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Pick & Place Systems

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Surface Abrader

Tape / Film Applicators

UV Curing Control & Test Equipment

UV Curing Equipment

Printing Supplies &  Equipment

Wafer Backlap Applicator

--------------

Home Page

--------------

Applications

Contact Us 

Data Sheets

Links

Map & Directions

News

Products By Manufacturer

Site Map

Spares & Servicing

 

 

 

 

SEST - STEEL EPOXY STAMPING TOOLS

Metallic stamping tools are used for small to medium die sizes. The tip has a specific shape depending on the range of die size and is adjustable to all shank types.  5 types of tool are available and selection is dependant on the size and dispense pattern required.

  • DAUB             : for die size less than .010" / 0.25mm

  • ROUND           :  for die size less than .040" / 1.00mm 

  • RECTANGULAR : for die size between .040" / 1.00mm and .080" / 2.00mm

  • STAR             : for die size between .040" / 1.00mm and .100" / 2.54mm

  • GRID              : for die size larger than .100" / 2.54mm

The small stand-off allows for consitent amount of epoxy to be picked up and transferred. Note: *Standard height is .005" /0.127mm and limited to 50% of stand-off when shorter size of TL, TW or ØF is less than .030" / 0.80mm

A spring-loaded stamping tool version is also available on two common threaded shank holders.

 

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

 

 

13/08/2008 14:34

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

Latest  News:

 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication.