OTHER ACCESSORIES FOR WIRE BONDING
PROCESS
BOND SHEAR TOOLS (BST)
CERAMIC TWEEZER (TWZ)
CAPILLARY UNPLUGGING WIRE
(CUW)
EFO WANDS
HEATER BLOCKS
BOND SHEAR TOOLS (BST)
In wire bonding, the assessment of the ball bond reliability after post
bonding is determined through ball shear test. A ball shear tool mounted onto
the shear tester is used to shear through the bonded ball with a shear height
of 3-5 µm from the bond pad surface. To produce accurate shear readings, the
ball shear tool must fulfill the following criteria,
The tip size of the shear tool must not interfere with the adjacent bonds,
considering the bond pad pitch during actual testing.
The width of the tip must be in full contact with the bonded ball.
SPT is capable of fabricating bond shear tools for different type of shear
testers with tip sizes ranging from 30 µm to 300 µm. Beside the standard
chisel type shear tool, SPT also provide customized shear tools to meet your
testing requirements.
How To Order:
BST -Face Width -Drawing (Options)
CERAMIC TWEEZER (TWZ)
SPT ’s ESD Ceramic Tweezer offers a simple method for threading of
ultra-fine gold wire through the capillary without having to worry that the
wire gets choked inside the capillary. The ceramic tweezer is ideal for
fine-pitch and ultra fine-pitch bonding application whereby the manoeuvre of
the wire within the hole f the capillary is limited.
Until now, threading of Au wire though the capillary has been performed
using a metal tweezer to grip the wire. This has the tendency to flatten the
wire and increase the surface area. In ultra fine pitch bonding, hole to wire
clearance is only about 3-4um.Most of the time ,the wire gets choked inside
the hole as the flatten wire is almost the same diameter as the hole size.
With the ceramic tweezer, this flatten effect was overcome.
Advantages:
- Rigidity of the ceramic tip provide absolute gripping of the gold wire
without damaging or flattening the wire.
- Especially useful for ultra fine-pitch bonding whereby the hole to gold
wire clearance is very limited by the bonding application and the
capillary hole gets clogged easily due to the flattening effect of the
wire.
How To Order:
TWZ -Material -TL -Tip Style
CAPILLARY UNPLUGGING WIRE
(CUW)
Capillary unplugging wire offers an easy and economical way to unplug
clogged capillary. This is especially useful for engineers during evaluation
as the gold ball tends to get clogged in the capillary holes since the
optimum process parameters are not defined yet.
The unplugging wire has also proven to be helpful to production operators
when they have difficulties threading the wire through the capillary. Instead
of changing to a new capillary, the unplugging tool can help to push out gold
residues, foreign particles and gold ball out of the hole. This can be done
by simply inserting the tip of the unplugging tool from the top of the
capillary and gently raises and lowers the wire within the capillary.
Advantages:
- Clogged capillaries can easily be unplugged, hence minimize capillary
wastage before end of tool life.
- User friendly. Removal of capillary from the transducer is not necessary
as the flexible tip of the unplugging tool can be inserted from the top of
the capillary as shown.
- Optimize tip configuration to handle a wide ranges of capillary hole
size.
- Each unplugging tool can be used more than dozen of times thus saving
unnecessary wastage of capillary and production down time.
- Especially useful for ultra fine-pitch capillaries as the capillary hole
gets clogged easily due to limited gold wire clearance in the hole.
CAPILLARY UNPLUGGING PROBES
EFO WANDS
The importance of consistent free air ball (FAB) for fine-pitch (FP) and
ultra-fine pitch (UFP) bonding applications has led to the development of new
alloy material to improve the performance of the EFO wand. Together with a
new proprietary process, consistent EFO sparking effect can be achieved with
SPT EFO wands. SPT is capable of making customized EFO wands used on
different types of bonder with precise dimensions and accuracy.
Advantages:
- Consistent free air ball formation & ball shape uniformity
- New proprietary process to ‘season ’ the EFO wand. this will ensure
consistent performance when installing on bonder.
- Longer tool life
How To Order:
EFO -Model -Option..
Example :EFO -K .S 8028
Note: Other standard or custom models available on request
HEATER BLOCKS
SPT ’s Heater Block Assembly offers yet another value-added product to
further support end-users for their complex bonding application. SPT is
capable to fabricate a wide variety of heater block assembly or all types of
packages used on any type of wire bonder.
SPT ’s "butterfly ’ design has proven to eliminate the bouncing
effect on the lead finger. The "butterfly " design has shown
excellent gripping &clamping stability on lead fingers, especially for
high pin counts QFP packages. With SPT ’s "butterfly " design, no
high temperature tape is required. This has been tested and proven at many
customer production sites with superior performance as compared to
conventional designs.
Advantages:
- Absolute lead finger stability during bonding with the "butterfly
" design heater block assembly..
- The "butterfly "heater block assembly can be applied to a wide
range of lead frame design for all types of ire bonder.
- Especially useful for FP and UFP high pin count devices.
How To Order:
HBXX -User Code -Bonder Model -Package Type (Batch .umber)
HBXX : Part Type +Bonding Window Quantity
HB:order both clamp and heater block
HBC: order clamp only
HBH: order heater block only
Example :-HB4X -Semicon -ASM 339 -QFP208L (A123)
Top View "Butterfly " Design Bottom View "Butterfly "
Design
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