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OTHER ACCESSORIES FOR WIRE BONDING PROCESS

BOND SHEAR TOOLS (BST)

CERAMIC TWEEZER (TWZ)

CAPILLARY UNPLUGGING PROBES (CUP-25)

CAPILLARY UNPLUGGING WIRE (CUW)

EFO WANDS

HEATER BLOCKS

BOND SHEAR TOOLS (BST)

In wire bonding, the assessment of the ball bond reliability after post bonding is determined through ball shear test. A ball shear tool mounted onto the shear tester is used to shear through the bonded ball with a shear height of 3-5 µm from the bond pad surface. To produce accurate shear readings, the ball shear tool must fulfill the following criteria,

The tip size of the shear tool must not interfere with the adjacent bonds, considering the bond pad pitch during actual testing.

The width of the tip must be in full contact with the bonded ball.

SPT is capable of fabricating bond shear tools for different type of shear testers with tip sizes ranging from 30 µm to 300 µm. Beside the standard chisel type shear tool, SPT also provide customized shear tools to meet your testing requirements.

How To Order:

BST -Face Width -Drawing (Options)

CERAMIC TWEEZER (TWZ)

SPT ’s ESD Ceramic Tweezer offers a simple method for threading of ultra-fine gold wire through the capillary without having to worry that the wire gets choked inside the capillary. The ceramic tweezer is ideal for fine-pitch and ultra fine-pitch bonding application whereby the manoeuvre of the wire within the hole f the capillary is limited.

Until now, threading of Au wire though the capillary has been performed using a metal tweezer to grip the wire. This has the tendency to flatten the wire and increase the surface area. In ultra fine pitch bonding, hole to wire clearance is only about 3-4um.Most of the time ,the wire gets choked inside the hole as the flatten wire is almost the same diameter as the hole size. With the ceramic tweezer, this flatten effect was overcome.

Advantages: 

  • Rigidity of the ceramic tip provide absolute gripping of the gold wire without damaging or flattening the wire.
  • Especially useful for ultra fine-pitch bonding whereby the hole to gold wire clearance is very limited by the bonding application and the capillary hole gets clogged easily due to the flattening effect of the wire.

How To Order:

TWZ -Material -TL -Tip Style

CAPILLARY UNPLUGGING WIRE (CUW)

 

Capillary unplugging wire offers an easy and economical way to unplug clogged capillary. This is especially useful for engineers during evaluation as the gold ball tends to get clogged in the capillary holes since the optimum process parameters are not defined yet.

The unplugging wire has also proven to be helpful to production operators when they have difficulties threading the wire through the capillary. Instead of changing to a new capillary, the unplugging tool can help to push out gold residues, foreign particles and gold ball out of the hole. This can be done by simply inserting the tip of the unplugging tool from the top of the capillary and gently raises and lowers the wire within the capillary.

Advantages:

  • Clogged capillaries can easily be unplugged, hence minimize capillary wastage before end of tool life.
  • User friendly. Removal of capillary from the transducer is not necessary as the flexible tip of the unplugging tool can be inserted from the top of the capillary as shown.
  • Optimize tip configuration to handle a wide ranges of capillary hole size.
  • Each unplugging tool can be used more than dozen of times thus saving unnecessary wastage of capillary and production down time.
  • Especially useful for ultra fine-pitch capillaries as the capillary hole gets clogged easily due to limited gold wire clearance in the hole.

CAPILLARY UNPLUGGING PROBES

 

EFO WANDS

The importance of consistent free air ball (FAB) for fine-pitch (FP) and ultra-fine pitch (UFP) bonding applications has led to the development of new alloy material to improve the performance of the EFO wand. Together with a new proprietary process, consistent EFO sparking effect can be achieved with SPT EFO wands. SPT is capable of making customized EFO wands used on different types of bonder with precise dimensions and accuracy.

Advantages: 

  • Consistent free air ball formation & ball shape uniformity
  • New proprietary process to ‘season ’ the EFO wand. this will ensure consistent performance when installing on bonder.
  • Longer tool life

How To Order:

EFO -Model -Option..

Example :EFO -K .S 8028

Note: Other standard or custom models available on request

 

 

HEATER BLOCKS

SPT ’s Heater Block Assembly offers yet another value-added product to further support end-users for their complex bonding application. SPT is capable to fabricate a wide variety of heater block assembly or all types of packages used on any type of wire bonder.

SPT ’s "butterfly ’ design has proven to eliminate the bouncing effect on the lead finger. The "butterfly " design has shown excellent gripping &clamping stability on lead fingers, especially for high pin counts QFP packages. With SPT ’s "butterfly " design, no high temperature tape is required. This has been tested and proven at many customer production sites with superior performance as compared to conventional designs.

Advantages: 

  • Absolute lead finger stability during bonding with the "butterfly " design heater block assembly..
  • The "butterfly "heater block assembly can be applied to a wide range of lead frame design for all types of ire bonder.
  • Especially useful for FP and UFP high pin count devices.

How To Order:

HBXX -User Code -Bonder Model -Package Type (Batch .umber)

HBXX : Part Type +Bonding Window Quantity

HB:order both clamp and heater block

HBC: order clamp only

HBH: order heater block only

Example :-HB4X -Semicon -ASM 339 -QFP208L (A123)

Top View "Butterfly " Design Bottom View "Butterfly " Design

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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