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 ENHANCED BALL BONDABILITY - DFX
CAPILLARY
 
The DFX capillary concept utilized a
smaller chamfer angle to contain the free air ball inside
the chamfer, thus resulting in a smaller mashed ball
diameter. Applicable for ultra-fine pitch bonding.
Typically, as Ultra-Fine Pitch Bonding goes below 50 µm
BPP, the given BPP and bond pad opening (BPO) requires a
much smaller wire diameter (WD) of 20 µm and below. While
this offers the advantage of cost reduction and the use of
standard capillary design, wire sweep problems surfaced
during the molding process. Most reverted back to using
larger wire diameter of 23 µm.
Due to the dimensional constraint on the hole and
chamfer diameter of the capillary, SPT developed a unique
capillary design, the ‘dfx ’ capillary
specifically targeting to contain the gold squashed out
during bonding. This design concept utilized a smaller
chamfer angle (CA) to contain the Free Air Ball (FAB)
inside the chamfer, thus resulting in a smaller mashed
ball diameter (MBD) as shown Below.
Features
Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.
18/01/2012 03:50
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