ENHANCED BALL BONDABILITY - DFX CAPILLARY

The DFX capillary concept utilized a smaller chamfer angle to contain the free air ball inside the chamfer, thus resulting in a smaller mashed ball diameter. Applicable for ultra-fine pitch bonding.

Typically, as Ultra-Fine Pitch Bonding goes below 50 µm BPP, the given BPP and bond pad opening (BPO) requires a much smaller wire diameter (WD) of 20 µm and below. While this offers the advantage of cost reduction and the use of standard capillary design, wire sweep problems surfaced during the molding process. Most reverted back to using larger wire diameter of 23 µm. 

Due to the dimensional constraint on the hole and chamfer diameter of the capillary, SPT developed a unique capillary design, the ‘dfx ’ capillary specifically targeting to contain the gold squashed out during bonding. This design concept utilized a smaller chamfer angle (CA) to contain the Free Air Ball (FAB) inside the chamfer, thus resulting in a smaller mashed ball diameter (MBD) as shown Below.

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