 SBN SERIES CAPILLARIES FOR FINE PITCH
SBN Slimline Bottleneck capillaries
series is intended for fine pitch application for bond pad
pitch (BPP) 125um up to as fine as 90um.
Integration of the new Zirconia (AZ)
composite material into the SBN capillary has set a new
milestone in the micro-packaging technology. The SBN-AZ
configuration offers higher strength and is ideal for QFP
and BGA packaging platforms. For 80um and below the PI
capillary design is recommended.
SBN-C Slimline Bottleneck capillary,
high density, fine grain ceramic "Polish"
SBN-CM Slimline Bottleneck capillary,
high density, fine grain ceramic "Matte"
SBN-AZ Slimline Bottleneck capillary,
Zirconia Composite Material "Polish"
SBN-AZM Slimline Bottleneck capillary,
Zirconia Composite Material "Matte"
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