DIE COLLETS

Die Collets offer the user minimum contact between the die and the tool. Only the die edges are pressed against the die collets inverted pyramidal polished walls. Die collet advantages are maximum available vacuum surface, no physical contact with the sensitive top surface of the die, allows pick-up with uneven or obstructed die surface topology, die self-alignment effect at pick-up, consent die scrubbing action, good placement accuracy, maintenance free and long life, compatibility for scrubbing action, well suited for very small die applications.

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

	IP Inverted Pyramid 4 sided, die collet available in the traditional tip material tungsten carbide (W) and now available in ceramic (C) which has the benefit of reduced costs on volume parts.
	IPIR Inverted Pyramid Inner Relief corner 4 sided die collet available in the traditional tip material tungsten carbide (W) and now available in ceramic (C) which has the benefit of reduced costs on volume parts.
	IPNC Inverted Pyramid Notched Corner relief is a 4 sided die collet available in the traditional tip material tungsten carbide (W) and now available in ceramic (C) which has the benefit of reduced costs on volume parts.
	CH 2 Sided Inverted Pyramid Die Collet is available in the traditional tip material tungsten carbide (W) and now also available in ceramic (C) which has the benefit of reduced costs on volume parts.