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PL - PERIPHERAL PICK UP TOOL

The Peripheral pickup Tool (PL) offers the flexibility to select a custom tool outer dimension, wall size and vacuum hole dimension. Peripheral pick-up tools are particularly suited in the following situations:

  • When the surface contact area between the tool and the die must be minimized

  • When certain die areas are to be protected from tool contact

  • When vacuum force must be increased (compared to CT or RT pick-up tools)

PL tools are traditionally proposed in Tungsten Carbide (W) because of the need for very fine wall dimensions which are highly polished to eliminate sharp edges, to prevent damage to the die surface. Plastic base material is only recommended when some restrictions are respected.

 

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

 

13/08/2008 14:34

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

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