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 SPECIAL APPLICATION & CUSTOM DIE
PICK UP COLLETS
Typically, die collets are used with square
or rectangular die, however, SPT supplies custom die collet configurations,
compatible with a large range of specific die or component geometry. For
more unusual applications, we can offer a range of options for odd shaped
die, modified vertical relief for die that need to be placed in packages
near walls and even odd shaped die (see the Rhomboide shape in the picture
below)
Die Collet Internal Pyramid Angle.
When looking at the force distribution generated in the die
tool at the moment of die placement, we may distinguish the case between a 90
degree internal pyramid angle and the 110 degree version. With a 90 degree
angle, the longitudinal and vertical forces have the same amplitude but the
distribution in the bulk is completely different. Longitudinal forces are
acting on a quite thin superficial material layer while the vertical forces
have their counter reaction forces applied on the surface of the die with
theoretically a force gradient toward the axes of symmetry. With an angle
higher than 90 degrees, the amplitude of the vertical force component becomes
predominant in regards to the longitudinal component. Choosing an angle of
110 degrees or 120 degrees is recommended especially with die larger than
2.00mm thus reducing die chipping. But even if chipping results, a higher
angle than 90 degrees will help push the broken chip along the die sides
rather than over the die surface.
For thin or fragile die or
components see the new RTR-D2/RTR-D3
Series Pickup tips
ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky,
Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer,
Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko,
Universal, West Bond, Viking Semicon and other die bonders.
Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.
18/01/2012 03:50 |
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