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MICROLOY
OSMIUM-CARBIDE ALLOY
- Several times the life of carbide
- Osmium has hexagonal close packed crystal structure with highest
density of all elements
- Hardness and modulus of elasticity exceed carbide
- Properties allow unique finishes
- Excellent ultrasonic coupling allows lower parameters and room
temperature bonding of gold
Longer tool life
Typically customers find the tool life several times longer because of
wear-resistant osmium alloy at the tip of our tools. The consistency of
Microloy makes the tool lifetime predictable and stable for a given
application
"Low stress" bonding
Because of the excellent ultrasonic coupling, many users of these tools find
that they can bond with less power, force, time and/or temperature, including
room temperature bonding of gold wire at 60k Hz.
Higher reliability bonds
The unique finishes possible with the osmium enhance the transmission of
ultrasonic energy and improve the quality of the bond. This is especially
true with gold interconnects.
Fine pitch Bonding Wedges
The Microloy bonding tools are being used in a 35 micron pitch bonding
process.
In the 1970's Microminiature Technology, Inc. discovered that an osmium (Os)
based alloy had a set of properties that made it an ideal material for the
tips of bonding tools used in ultrasonic wire, ribbon and TAB bonding. Its
wear-resistance and unique surface finishes allow for unparalled ultrasonic
coupling. The alloy was given the name "Microloy", its critical
properties include:
- High density
- High elastic modulus
- Extreme hardness
- Excellent wear resistance
- Fine grain structure
- Low porosity
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Hexagon close packed crystal structure |
Since then, Microminiuature Technology has been supplying these osmium tipped
tools for critical bonding applications where the quality and consistency of
the bond is the top priority for products such as: cardiac pacemakers, air
bag sensors, military avionics, medical imaging, satellite systems and
optoelectronics.

SPT Wedge Bonding Tool made of Microloy Osmium-Carbide alloy. Background: SEM
image of a Microloy surface
Microloy’s properties plus our manufacturing expertise allow a unique
bonding surface finishes for efficient ultrasonic coupling, with minimal
build-up for longer tool life
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Wedge Bonding Tool Surface
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Matte "M"
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Frost (F)
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- High and consistent pull strengths
- Reduced bond power, force and time
- Less deformation of bond
- Eliminate cross-grooves
Data Sheet for Microloy
material for FP/UT/US/ABT and M type tools
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13/08/2008 09:24
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Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film
& Thick Film Resistors - Electronic Packages - Dispensing
Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape &
Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV
Curing Systems & Accessories - Solderability Test Equipment -
Steam Agers - Custom Machine Guarding
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