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Products/Dispensing Equipment/Epoxy Stamping & Dispensing Tools

Products/Bonding Tools/Epoxy Stamping & Dispensing Tools

EPOXY STAMPING & DISPENSING TOOLS

In general, dispensing can be defined as transfer of fluid from a container (typically in syringe) to a substrate in a form of pattern or calculated volumes to host a die or component. In electronics industry, there are various methods that have evolved to keep up with the rapid development of manufacturing need for adhesives and conductive epoxies in a wide array of packaging assemblies. 

Over the years, dispensing applications have expanded to other areas needed for new types of packaging encapsulation techniques. A wide variety of fluid materials with different viscosity are being used, from solder paste, conductive adhesives and damming compound to fluxes, thermal paste and underfills.

DISPENSING PROCESS AND TECHNOLOGY

Stamping:

Sometimes known as daubing or pin transfer, this method involves dipping a compliant tool into a reservoir of liquid material then transferring the adhering liquid onto a substrate. This method is frequently used to attain very small dots. However, the process is considered slow as compared to other methods especially if the application requires multiple dots dispensing. To increase throughput, gang (multiple) stamping tool can be employed to stamp an array of dots simultaneously. Grid type stamping tool is also available to print a large area.

Stencil Printing:

Stencil printing is the fastest and most efficient way of applying adhesive to a large area in mass production runs. In this method, a patterned stencil is placed over the substrate and a squeegee force the material through the stencil apertures onto the substrate. This may become complicated when the stencil apertures become so small that the material can no longer print effectively.

Jet-dispensing:

Non-contact jet-dispensing is one of the newer methods in dispensing technologies. Shots of fluid are fired onto the substrate in a non-contact process. Since dispensing dots are typically restricted to one specific size during a run, larger volumes are achieved by accumulating multiple dots. By moving the jet head during deposition, required patterns can be formed.

Nozzle or Needle Dispensing:

In this method, time and air pressure is commonly used to push the fluid through a needle or nozzle to form single dot or multiple dot patterns over the substrate. Over the years, various dispensing platforms with programmable pumps and valves, such as auger and piston have been developed to achieve unique patterns or volumes using single needle or special tapered nozzle. These platforms could either be stand-alone dispensing equipment or integrated on those new pick and place machines.

ASM 809, Alphasem Easyline, Amica, Assembly Tech, ESEC 2005 / 2006 / Micron 2 / Micron 5003, ESC, Datacon, Delvotec, Air Vac, Dr Tresky Flip Station, Foton, Hacker, Hughes, ISMECA SDB1000 / ADB2000, K&S 6300 / 6900, KME, Laurier, MRSI 505, Muehlbauer, Palomar HG1 / HG2, Quad APS1, SEC (Semiconductor Equipment Corp) Model 850, Model 860, Model 410, Model 830, KTM83A, KTM 83B, Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.  

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

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