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    ELECTRONIC PACKAGES

MSI Electronic Package Division offer high performance, alumina/glass walled packages and lids in flat pack, plug-in and surface mount configurations for microwave applications. The range of packages have been specifically designed for aerospace, telecommunication, opto-electronic, hybrid, crystal oscillator & industrial applications.

     

The package types include glass wall & metal flat packs, plug-ins, gull wing & J-leaded chip carriers, machine microwave & surface mount microwave packages and TO8 packages. A full custom package service is available to suit all applications.

ALUMINA/GLASS SIDEWALL PACKAGES

As well as setting the pace for Alumina/Glass sidewall packages, our Package Division also offers the same surpassing abilities in the manufacturing of products designed to meet all other package requirements.

Our customers/partners may also benefit from our offering of a complete line of matching lids as Combo Lids, Stepped Lids, and Domed Covers.

For additional information or if you require assistance in finding a package to suit your specific requirements feel free to e-mail us or contact us

 

Glass Flat-Pack

 

Glass Flat-Pack

 

Glass Flat-pack, Cut & Formed

 

 

 

Plug-Ins

 

Glass Flat-Pack

Metal Flat Packs

 

 

 

 

 

 

 

 

 

 

 

 

MSI Package Division History

Founded in 1972, Mini-Systems, Inc., Electronic Package Division has been providing the electronics industry with the very highest quality hybrid microelectronic packages available anywhere in the world. The Electronic Package Division is best known for supplying the hybrid alternative to plastic microelectronic packages...our Alumina/Glass Sidewall packages. These packages meet military and space level quality requirements as well as exceeding virtually all commercial needs.

More than 25 years of experience has made MSI the industry leader. 

Mini-Systems Inc Package Catalogue

MSI Package Division Products

  • Metal Sidewall packages (Metal Flatpacks, QFP's)

  • Metal Sidewall Plug-In packages (DIP's)

  • Transistor Oscillator packages (TO's)

  • Custom Microwave packages (Machined Modules)

  • Multichip packages (MCM)

  • Fiber Optic packages

We hope to have the opportunity prove this to you. Call us for more information and tell us what you need.

03/09/2010 09:06

 

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

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