Phone: +44 (0)1460 61791
Email: sales@epakelectronics.com

Hybrid Alumina/Glass Walled Electronic Packages

Mini-Systems Inc (MSI) Electronic Package Division offer high performance, alumina/glass walled packages and lids in flat pack, plug-in and surface mount configurations for microwave applications. The range of packages have been specifically designed for aerospace, telecommunication, opto-electronic, hybrid, crystal oscillator & industrial applications.

The package types include glass wall & metal flat packs, plug-ins, gull wing & J-leaded chip carriers, machine microwave & surface mount microwave packages and TO8 packages. A full custom package service is available to suit all applications.

Alumina/Glass Sidewall Packages

As well as setting the pace for Alumina/Glass sidewall packages, our Package Division also offers the same surpassing abilities in the manufacturing of products designed to meet all other package requirements.

Our customers/partners may also benefit from our offering of a complete line of matching lids as Combo Lids, Stepped Lids, and Domed Covers.

For additional information or if you require assistance in finding a package to suit your specific requirements feel free to e-mail us or contact us

Mini-Systems Inc Hybrid Package & Lid Catalogue

Glass Flat-Packages, Glass Flat-packages (Cut & Formed), Plug-Ins, Metal Flat Packages, also T08 cans

MSI Package Division History

Founded in 1972, Mini-Systems, Inc., Electronic Package Division has been providing the electronics industry with the very highest quality hybrid microelectronic packages available anywhere in the world. The Electronic Package Division is best known for supplying the hybrid alternative to plastic microelectronic packages...our Alumina/Glass Sidewall packages. These packages meet military and space level quality requirements as well as exceeding virtually all commercial needs.

More than 25 years of experience has made MSI the industry leader.

Mini-Systems Inc Package Catalogue

  • MSI Package Division Products Include:
  • Metal Sidewall packages (Metal Flatpacks, QFP's)
  • Metal Sidewall Plug-In packages (DIP's)
  • Transistor Oscillator packages (TO's)
  • Custom Microwave packages (Machined Modules)
  • Multi-chip packages (MCM)
  • Fiber Optic packages

We hope to have the opportunity prove this to you. Call us for more information and tell us what you need.

Mini-Systems Chip Carrier Packages Mini-Systems plug-in Packages with 10 leads