CAPILLARIES
UT SERIES - FOR NON-FINE PITCH
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UTF A recent addition to the UTS range offers a
4° face angle available in C and CM material options
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UTS Very popular series with 8° face angle
available in C and CM material options
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UTE Also recently added to give an 11° face
angle, available in C and CM material options
CSA ZERO DEGREE FACE ANGLE CAPILLARY ideal for
ultrasonic bonding applications, available in C and CM material options
SBN SLIMLINE BOTTLENECK - FOR ULTRA FINE PITCH
capillaries series is intended for ultra-fine pitch application for bond pad
pitch up to 125µm up to as fine as 55µm. Integration of the new Zirconia
(AZ) composite material into the SBN capillary has set a new milestone in the
micro-packaging technology. The SBN-AZ configuration offers higher strength
and is ideal for QFP and BGA packaging platforms.
DFX DESIGN CAPILLARY for bond pad pitch 50µm &
below
CUB Capillary for Copper Wire Bonding
Chip Scale Package (CSP-QFN) Capillary
Programmed Intelligence
P.I. Capillary
Infinity
Capillary Capillary for extended working life by up to three times as long
Other
Accessories For Wirebonding
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