UTF A recent addition to the UTS range offers a 4° face angle available in C and CM material options
UTS Very popular series with 8° face angle available in C and CM material options
UTE Also recently added to give an 11° face angle, available in C and CM material options

CSA ZERO DEGREE FACE ANGLE CAPILLARY ideal for ultrasonic bonding applications, available in C and CM material options

SBN SLIMLINE BOTTLENECK - FOR ULTRA FINE PITCH capillaries series is intended for ultra-fine pitch application for bond pad pitch up to 125µm up to as fine as 55µm. Integration of the new Zirconia (AZ) composite material into the SBN capillary has set a new milestone in the micro-packaging technology. The SBN-AZ configuration offers higher strength and is ideal for QFP and BGA packaging platforms.

DFX DESIGN CAPILLARY for bond pad pitch 50µm & below

CUB Capillary for Copper Wire Bonding

Chip Scale Package (CSP-QFN) Capillary

Programmed Intelligence P.I. Capillary

Infinity Capillary Capillary for extended working life by up to three times as long

Other Accessories For Wirebonding

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.

08/03/2013 15:31