Wire Bonding Capillaries for Gold, Aluminium and Copper
SPT offers a wide range of bonding capillaries with designs and features optimized for your bonding needs. From standard bonding packages, such as SOIC, TSOP up to complex bonding applications for low-k, stacked die, multi-tier, Cu wire, ultra fine-pitch bonding and many more. SPT capillaries support your widest array of bonding applications and challenges.
UT Non-Fine Pitch Capillaries
SPT's UT series of bonding capillaries offer a superb range of wire bonding capillaries suitable for all non-fine pitch applications.
UTF A newer addition to the UTS range offers a 4° face angle available in AZM material options
UTS Very popular series with 8° face angle available in AZM material options
UTE Also recently added to give an 11° face angle, available in AZM material options
QFN Package Copper & Gold Wire Bonding Capillary
Solutions For QFN Package Copper & Gold Wire
Copper Wire Bonding Capillary
Fine & Large Wire
Enhanced Stitch Bondability
2N9 Gold Wire Bonding
Advanced Bonding Applications
Low-K Wire Bonding
Multi-tier Wire Bonding
Stacked Die Wire Bonding
AZR Long Life Material for Cu Wire Bonding
Extended Capillary Touchdowns
No Change In Bonding Parameters
Consistent Bond Quality
Infinity 3X Longer Tool Life
SPT 'Infinity' capillary material extends the tool life up to 3X its original tool life
Specific Package Application
Ball Stitch On Ball (BSOB)
Stud Ball Bumping
Special Capillary Taper Designs
Small Precision Tools wire bonding capillaries are formed out of an ultra-pure 99.99% Al2O3 fine grade ceramic powder......
Accessories for Wire Bonding
Capillary Unplugging Wire (CUW)
Window Clamps & Heater Block
CAPILLARY MATERIALS WIRE BONDING CAPILLARIES ARE FORMED OUT OF AN ULTRA-PURE 99.99% AL2O3 FINE GRADE CERAMIC POWDER......
Capillary Part Number Selection Guide
The capillary design selection guide is always based on specific device & package configuration, wire type, and wire bonder. The selection of capillary part number process is simplified as follows:
Capillary Tip The selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter(HD), chamfer diameter (CD), chamfer angle (CA), tip diameter (T) and face angle (FA).
Shank Style The shank style selection is characterized by geometrical design of the capillary bonding tool as dictated by specific device and / or package configuration.
Surface Finish The selection of a particular capillary tip surface finish hinges on whether the application is for gold or copper wire bonding.
Material Capillary material selection for optimum tool life performance for a given bonding application.
Wire Type The proper selection of capillary design is a resultant of the various wire bonding considerations.
BONDING CAPILLARIES & ACCESSORIES WE OFFER:
UT NON-FINE PITCH CAPILLARIES
QFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
COPPER WIRE BONDING CAPILLARY
ENHANCED STITCH BONDABILITY
ADVANCED BONDING APPLICATIONS
AZR LONG LIFE MATERIAL FOR CU WIRE BONDING
INFINITY 3X LONGER TOOL LIFE