CSA ZERO DEGREE FACE ANGLE CAPILLARY ideal for ultrasonic bonding applications, available in C and CM material options
SBN SLIMLINE BOTTLENECK - FOR ULTRA FINE PITCH capillaries series is intended for ultra-fine pitch application for bond pad pitch up to 125µm up to as fine as 55µm. Integration of the new Zirconia (AZ) composite material into the SBN capillary has set a new milestone in the micro-packaging technology. The SBN-AZ configuration offers higher strength and is ideal for QFP and BGA packaging platforms.
CUB Capillary for Copper Wire Bonding
Chip Scale Package (CSP-QFN) Capillary
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