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CAPILLARIES

Small Precision Tools Bonding Capillaries

UT SERIES - FOR NON-FINE PITCH

  • UTF A recent addition to the UTS range offers a 4° face angle available in C and CM material options

  • UTS Very popular series with 8° face angle available in C and CM material options

  • UTE Also recently added to give an 11° face angle, available in C and CM material options

CSA ZERO DEGREE FACE ANGLE CAPILLARY ideal for ultrasonic bonding applications, available in C and CM material options

SBN SLIMLINE BOTTLENECK - FOR ULTRA FINE PITCH capillaries series is intended for ultra-fine pitch application for bond pad pitch up to 125µm up to as fine as 55µm. Integration of the new Zirconia (AZ) composite material into the SBN capillary has set a new milestone in the micro-packaging technology. The SBN-AZ configuration offers higher strength and is ideal for QFP and BGA packaging platforms.

DFX DESIGN CAPILLARY for bond pad pitch 50µm & below

CUB Capillary for Copper Wire Bonding

Chip Scale Package (CSP-QFN) Capillary

Programmed Intelligence P.I. Capillary

Infinity Capillary Capillary for extended working life by up to three times as long

Other Accessories For Wirebonding


 

27/06/2008 09:38

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