UT Non-Fine Pitch Capillaries For Wire Bonding

Non-Fine Pitch Wire Bonding Capillaries

UT Capillary - Non-Fine Pitch Solutions For Standard Bonding Applications

UT capillary series is geometrically designed for non-fine pitch, and non- bottleneck type used for gold and copper wire application. The main design feature is main taper angle (MTA) either 30° or 20° MTA with larger tip size 140µm and above. The UT design has become an ideal choice for LED (light emitting diodes) application.

SPT's UT series of bonding capillaries offer a superb range of wire bonding capillaries suitable for all non-fine pitch applications.
Non-Fine Pitch Wire Bonding Capillaries with different face angles
UTF A newer addition to the UTS range offers a 4° face angle available in AZM material options
UTS Very popular series with 8° face angle available in AZM material options
UTE Also recently added to give an 11° face angle, available in AZM material options

Capillary Part Number Selection Guide

The capillary design selection guide is always based on specific device & package configuration, wire type, and wire bonder. The selection of capillary part number process is simplified as follows:

Capillary Tip The selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter(HD), chamfer diameter (CD), chamfer angle (CA), tip diameter (T) and face angle (FA).

Shank Style The shank style selection is characterized by geometrical design of the capillary bonding tool as dictated by specific device and / or package configuration.

Surface Finish The selection of a particular capillary tip surface finish hinges on whether the application is for gold or copper wire bonding.

Material Capillary material selection for optimum tool life performance for a given bonding application.

Wire Type The proper selection of capillary design is a resultant of the various wire bonding considerations.

(UT) Non-Fine Pitch Part Number Selection

Infinity 3X Longer Tool Life

SPT 'Infinity' capillary material extends the tool life up to 3X its original tool life. This option is available on many tools and is a proprietary process SPT use to increase tool life.

ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - UT Series Non-Fine Pitch Bonding CapillariesPRICE QUOTE - email us at sales@epakelectronics.comUT Ordering Information Datasheet

BONDING CAPILLARIES & ACCESSORIES WE OFFER:

Non-Fine Pitch Capillaries (UT)UT NON-FINE PITCH CAPILLARIES
QFN (Quad Flat Non-Lead) SQ Capillary for gold and copper wire bondingQFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
Copper Wire Bonding Capillaries (SU)COPPER WIRE BONDING CAPILLARY
Enhanced Stitch Bond CapillariesENHANCED STITCH BONDABILITY
Advanced Bonding ApplicationsADVANCED BONDING APPLICATIONS
AZR Copper Bonding Capillary MaterialAZR LONG LIFE MATERIAL FOR CU WIRE BONDING
INFINITY 3X LONGER TOOL LIFEINFINITY 3X LONGER TOOL LIFE
Ball Stitch On Ball Wire Bonding CapillariesBALL STITCH ON BALL (BSOB)
Stud Ball Bumping (SBB) Bonding CapillarySTUD BALL BUMPING
Several different taper styles are available: One Side Relief, Double Side Relief, 90 Degree Double Side Relief and Vertical Bottle NeckSPECIAL CAPILLARY TAPER DESIGNS
Capillary unblocking and unplugging wireCAPILLARY UNPLUGGING WIRE (CUW)
EFO Wands for Capillary Bonding by SPTEFO WANDS
Window Clamps & Heater Block For QFP SOP & Multi-lead PackagesWINDOW CLAMPS & HEATER BLOCK
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